CN203800016U - Chip and pin connection realized by utilizing solid copper bridge - Google Patents

Chip and pin connection realized by utilizing solid copper bridge Download PDF

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Publication number
CN203800016U
CN203800016U CN201420098234.XU CN201420098234U CN203800016U CN 203800016 U CN203800016 U CN 203800016U CN 201420098234 U CN201420098234 U CN 201420098234U CN 203800016 U CN203800016 U CN 203800016U
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CN
China
Prior art keywords
chip
copper sheet
pin
bridge
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420098234.XU
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Chinese (zh)
Inventor
王伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tianjin Jin Tai Technetium Science And Technology Ltd
Original Assignee
Tianjin Jin Tai Technetium Science And Technology Ltd
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Priority to CN201420098234.XU priority Critical patent/CN203800016U/en
Application granted granted Critical
Publication of CN203800016U publication Critical patent/CN203800016U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/37099—Material
    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/37138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/37147—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/4005—Shape
    • H01L2224/4009—Loop shape
    • H01L2224/40095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/848—Bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/848—Bonding techniques
    • H01L2224/84801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Connection Of Batteries Or Terminals (AREA)

Abstract

The utility model relates to a chip and pin connection realized by utilizing a solid copper bridge. The chip and pin connection is characterized in that a gasket is welded on a substrate, a chip is welded on the gasket, the chip is boned with one end of a copper sheet, and the other end of the copper sheet is bonded with a pin. The adhesive materials between one end of the copper sheet and the chip and between the other end of the copper sheet and the pin are a solder paste. One end, boned with the chip, of the copper sheet is designed into a circular shape, and the diameter of the circular shape is identical with the size of a middle section of the copper sheet; and the other end, boned with the pin, of the copper sheet is designed into a circular shape, and the diameter of the circular shape is 2-2.5 times that of the end boned with the chip.

Description

A kind of chip that utilizes solid copper bridge to realize is connected with pin
Technical field
The utility model relates to a kind of chip that utilizes solid copper bridge to realize is connected with pin.
Background technology
In Discrete device packaging, in the time running into common anode, common cathode on line, the on line of on line, chip chamber is necessary means repeatedly at present.But, this technology easily cause short circuit and production efficiency low.
Utility model content
In order to address the above problem, the utility model provides a kind of novel chip and pin connection encapsulation technique.
For achieving the above object, the utility model adopts following technical scheme:
A kind of chip that utilizes solid copper bridge to realize is connected with pin, it is characterized by and in substrate, is welded with liner, welding chip on described liner, described chip and copper sheet one end bonding, the described copper sheet other end and pin bonding.
Further, the adhesion material between the other end and the described pin of one end of described copper sheet and described chip, described copper sheet is tin cream.
Further, one end shape of described copper sheet and described chip bonding is designed to circle, this round diameter is identical with the thickness of described copper sheet interlude, and described copper sheet and described pin bonding end shape are also designed to circle, and the 2-2.5 that this round diameter is described chip bonding end diameter doubly.
Adopt solid copper bridge to realize chip and be connected with pin, more traditional bonding wire craft is enhanced productivity greatly, can obtain unique packaged battery resistance, the higher magnitude of current, better heat conductivility.Between copper sheet and pad, rely on tin cream melting and then stick together but not directly pressing, the unreliability that has reduced the later stage stress brings while using, has also reduced the damage to device in encapsulation process.
Brief description of the drawings
Fig. 1 is the vertical view of utility model.
Fig. 2 is the end view of utility model.
Fig. 3 is the state diagram of sticking together of the liner of utility model and chip.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
With reference to figure 1,2,3, a kind of chip that utilizes solid copper bridge to realize is connected with pin, is welded with liner 1, welding chip 2 on described liner 1, described chip 2 and copper sheet 3 one end 31 bondings, described copper sheet 3 other ends 33 and pin 4 bondings in substrate.Adhesion material between described copper sheet 3 one end 31 and described chip 2, described copper sheet 3 other ends 33 and described pin 4 is tin cream.One end 31 shapes of described copper sheet 3 are designed to circle, the diameter of this circle 31 is identical with the thickness of described copper sheet 3 interludes 32, and described copper sheet 3 other end 33 shapes are also designed to circle, the 2-2.5 of one end 31 diameters that these circle 33 diameters are described copper sheet 3 doubly.
Adopt solid copper bridge 3 to realize chip 2 and be connected with pin 4, more traditional bonding wire craft is enhanced productivity greatly, can obtain unique packaged battery resistance, the higher magnitude of current, better heat conductivility.Between copper sheet 3 and chip 1, pin 4, rely on tin cream melting and then stick together but not directly pressing, the unreliability that has reduced the later stage stress brings while using, has also reduced the damage to device in encapsulation process.

Claims (3)

1. a chip that utilizes solid copper bridge to realize is connected with pin, it is characterized by: in substrate, be welded with liner, welding chip on described liner, described chip and copper sheet one end bonding, the described copper sheet other end and pin bonding.
2. a kind of chip that utilizes solid copper bridge to realize as claimed in claim 1 is connected with pin, it is characterized in that: the adhesion material between the other end and the described pin of one end of described copper sheet and described chip, described copper sheet is tin cream.
3. a kind of chip that utilizes solid copper bridge to realize as claimed in claim 1 is connected with pin, it is characterized in that: one end shape of described copper sheet and described chip bonding is designed to circle, this round diameter is identical with the thickness of described copper sheet interlude, and described copper sheet and described pin bonding end shape are also designed to circle, this round diameter is 2-2.5 times of described chip bonding end diameter.
CN201420098234.XU 2014-03-06 2014-03-06 Chip and pin connection realized by utilizing solid copper bridge Expired - Fee Related CN203800016U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420098234.XU CN203800016U (en) 2014-03-06 2014-03-06 Chip and pin connection realized by utilizing solid copper bridge

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420098234.XU CN203800016U (en) 2014-03-06 2014-03-06 Chip and pin connection realized by utilizing solid copper bridge

Publications (1)

Publication Number Publication Date
CN203800016U true CN203800016U (en) 2014-08-27

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420098234.XU Expired - Fee Related CN203800016U (en) 2014-03-06 2014-03-06 Chip and pin connection realized by utilizing solid copper bridge

Country Status (1)

Country Link
CN (1) CN203800016U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104409372A (en) * 2014-12-08 2015-03-11 杰群电子科技（东莞）有限公司 Semiconductor device and encapsulating method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104409372A (en) * 2014-12-08 2015-03-11 杰群电子科技（东莞）有限公司 Semiconductor device and encapsulating method thereof
CN104409372B (en) * 2014-12-08 2018-09-21 杰群电子科技（东莞）有限公司 A kind of semiconductor devices and its packaging method

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140827

Termination date: 20180306

CF01 Termination of patent right due to non-payment of annual fee