CN206059348U - A kind of hot-pressing system of the encapsulation heat pressing process based on flip-chip - Google Patents
A kind of hot-pressing system of the encapsulation heat pressing process based on flip-chip Download PDFInfo
- Publication number
- CN206059348U CN206059348U CN201620977465.7U CN201620977465U CN206059348U CN 206059348 U CN206059348 U CN 206059348U CN 201620977465 U CN201620977465 U CN 201620977465U CN 206059348 U CN206059348 U CN 206059348U
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- China
- Prior art keywords
- hot pressing
- pressing
- hot
- flip
- chip
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Abstract
The utility model discloses a kind of hot-pressing system of the encapsulation heat pressing process based on flip-chip, plural image conversion thermal head can be applied to the encapsulation hot pressing of multiple flip-chips simultaneously, and the hot pressing head assembly that can be located away from hot pressing main body has abundant applied environment, the hot pressing head assembly that can be changed at any time can correspond to the chip of different shape or type, so as to substantially increase the efficiency of production.
Description
Technical field
This utility model is related to a kind of hot-pressing system of the encapsulation heat pressing process based on flip-chip, is particularly well-suited to chip
SMD encapsulation hot pressing, COB encapsulation hot pressing, CSP techniques and other can be applicable to the packaging technology of flip-chip.
Background technology
Be presently used for flip-chip encapsulation heat pressing process thermal head with using it is single, can not be while being applied to many
The defects such as the encapsulation hot pressing of individual flip-chip, are unfavorable for that production is fast and effectively carried out.
Utility model content
To solve the above problems, the purpose of this utility model is to provide a kind of encapsulation heat pressing process based on flip-chip
Hot-pressing system, plural image conversion thermal head can be applied to the encapsulation hot pressing of multiple flip-chips simultaneously, and can
The hot pressing head assembly for being located away from hot pressing main body has abundant applied environment, and the hot pressing head assembly that can be changed at any time can be corresponded to
In different shape or the chip of type, so as to substantially increase the efficiency of production.
The technical scheme adopted by the invention for solving the technical problem is：
A kind of hot-pressing system of the encapsulation heat pressing process based on flip-chip, including hot pressing main body and detachably connectable in heat
Hot pressing head assembly below pressure main body, hot pressing main body arrange having heaters, and hot pressing head assembly includes company is separated with hot pressing main body
The hot pressing plane for connecing and the several spaced contact mouth being arranged on below hot pressing plane, each contact mouth are connected with for reality
The graphical thermal head of the encapsulation hot pressing of existing flip-chip.The figure of graphical thermal head can be square, rhombus, circle,
Star or other figures, can be applied to the encapsulation hot pressing of multiple flip-chips simultaneously, it is adaptable to the SMD encapsulation heat of chip
Pressure, COB encapsulation hot pressing, CSP techniques and other can be applicable to the packaging technology of flip-chip.Hot pressing head assembly can be located away from heat
Pressure main body, therefore when needing to be packaged hot pressing to different type or various sizes of flip-chip, neatly can be replaced with
Corresponding hot pressing head assembly such that it is able to suitable for the applied environment for enriching.Additionally, also hot pressing head assembly is fixed on hot pressing master
Type that can not be separated on body, such hot pressing head assembly are applied to the encapsulation heat of the flip-chip of solid shape
Pressure.When graphical thermal head is not used, only graphical thermal head need to be removed, it becomes possible to become the thermal head of thermal head planarization
Component, wherein hot pressing plane are exactly the planarization thermal head for hot pressing is packaged to flip-chip.
Further, the temperature controlling range of heater is room temperature to 500 degree.Heater has very big temperature control model
Enclose, the technological requirement of the encapsulation hot pressing of various flip-chips can be applied to, during use, the heat of heater is first transmitted to hot pressing
Main body, then hot pressing head assembly is transmitted to, so heater, hot pressing main body and hot pressing head assembly have identical temperature, and temperature
Degree is synchronous to be risen, 500 degree of heating-up temperature or maximum temperature values until reaching technological requirement.
Further, the area of graphical thermal head covers the area of pressed chip comprehensively.In order to allow the encapsulation of flip-chip
Hot pressing can have good pressing ability and efficiency, and the area of graphical thermal head must cover the face of pressed chip comprehensively
Product, graphical thermal head must can be placed into SMD can pressure surface product or COB encapsulate box dam in so that chip well can connect
The heat that conduction comes is received, the success rate of encapsulation hot pressing is improved, heat pressing badness rate is reduced.
Preferably, graphical thermal head is solid construction.The graphical thermal head of solid construction can effectively conduct heat
Measure and with stable construction featuress, excessively will not firmly cause graphical thermal head to occur to become because of with the pressing of chip
Shape, with good sustainable usability.
The beneficial effects of the utility model are：A kind of hot-pressing system of the encapsulation heat pressing process based on flip-chip, two
Graphical thermal head above can be applied to the encapsulation hot pressing of multiple flip-chips simultaneously, and can be located away from hot pressing master
The hot pressing array of body has an abundant applied environment, the hot pressing array that can be changed at any time enable thermal head be replaced with any time with
The corresponding shape of chip or type, so as to substantially increase the efficiency of production.
Description of the drawings
The utility model is described in further detail with example below in conjunction with the accompanying drawings.
Fig. 1 is the schematic diagram of this utility model hot-pressing system.
Specific embodiment
With reference to Fig. 1, a kind of hot-pressing system of the encapsulation heat pressing process based on flip-chip of the present utility model, including hot pressing
Main body 1 and the detachably connectable hot pressing head assembly below the hot pressing main body 1, the hot pressing main body 1 arrange having heaters, institute
Stating hot pressing head assembly is included the hot pressing plane 2 of connection is separated with the hot pressing main body 1 and is arranged on below the hot pressing plane 2
Several spaced contact mouth, each contact mouth be connected with for realize flip-chip encapsulation hot pressing graphical hot pressing
3.The figure of graphical thermal head 3 can be square, rhombus, circle, star or other figures, can be applied to simultaneously
The encapsulation hot pressing of multiple flip-chips, it is adaptable to chip SMD encapsulation hot pressing, COB encapsulation hot pressing, CSP techniques and other can answer
For the packaging technology of flip-chip.Hot pressing head assembly can be located away from hot pressing main body 1, therefore when needing to different type or not
When hot pressing is packaged with the flip-chip of size, can neatly be replaced with corresponding hot pressing head assembly such that it is able to be applied to
Abundant applied environment.Additionally, also hot pressing head assembly be fixed on can not be separated on hot pressing main body 1 type, it is this
The hot pressing head assembly of type is applied to the encapsulation hot pressing of the flip-chip of solid shape.When graphical thermal head 3 is not used, only
Graphical thermal head 3 need to be removed, it becomes possible to become the hot pressing head assembly of thermal head planarization, wherein hot pressing plane 2 is exactly to be used for
The planarization thermal head of hot pressing is packaged to flip-chip.
Wherein, the temperature controlling range of heater is room temperature to 500 degree.Heater has very big temperature controlling range,
The technological requirement of the encapsulation hot pressing of various flip-chips can be applied to, during use, the heat of heater is first transmitted to hot pressing master
Body 1, then hot pressing head assembly is transmitted to, so heater, hot pressing main body 1 and hot pressing head assembly have identical temperature, and temperature
Degree is synchronous to be risen, 500 degree of heating-up temperature or maximum temperature values until reaching technological requirement.
Wherein, the area of graphical thermal head 3 covers the area of pressed chip comprehensively.In order to make the encapsulation of flip-chip hot
Pressure energy enough has good pressing ability and efficiency, and the area of graphical thermal head 3 must cover the area of pressed chip comprehensively,
Graphical thermal head 3 must can be placed into SMD can be in the box dam that encapsulates of pressure surface product or COB so that chip well can be received
To the heat that conduction comes, the success rate of encapsulation hot pressing is improved, heat pressing badness rate is reduced.
Wherein, graphical thermal head 3 is solid construction.The graphical thermal head 3 of solid construction can effectively conduct heat
Measure and with stable construction featuress, excessively firmly graphical thermal head 3 will not be caused to occur because of with the pressing of chip
Deformation, with good sustainable usability.
When using this utility model hot-pressing system, first the chip by crystal-bonding adhesive together with base plate bonding is positioned over
The lower section of graphical thermal head 3, heater are made its heat be transmitted on graphical thermal head 3 by hot pressing main body 1, work as figure
After shape thermal head 3 reaches the temperature of technological requirement defined, then graphical thermal head 3 is pushed, make graphical thermal head 3 good
Push down chip, wait the heat of graphical thermal head 3 that die bond adhesive curing is conducted to crystal-bonding adhesive and made by chip, finally complete
The encapsulation of chip.If current Graphics thermal head 3 can not meet needs when being packaged the flip-chip of hot pressing, thermal head
Component 2 is located away from hot pressing main body 1, is then replaced with the hot pressing head assembly 2 corresponding with the shape of flip-chip or size, i.e., more
Change the graphical thermal head 3 corresponding with the shape of flip-chip or size into, then carry out above-mentioned hot pressing again, it is complete
Into the encapsulation of different shape and the chip of size.
Be more than to it is of the present utility model it is preferable enforcement illustrated, but this utility model be not limited to it is above-mentioned
Embodiment, those of ordinary skill in the art can also make a variety of equivalents on the premise of without prejudice to this utility model spirit
Deformation is replaced, and the deformation or replacement of these equivalents are all contained in the application claim limited range.
Claims (4)
1. it is a kind of based on flip-chip encapsulation heat pressing process hot-pressing system, it is characterised in that：Including hot pressing main body（1）With can
Separation is connected to the hot pressing main body（1）The hot pressing head assembly of lower section, the hot pressing main body（1）Having heaters, the heat are set
Pressure head component includes can be with the hot pressing main body（1）Separate the hot pressing plane of connection（2）Be arranged on the hot pressing plane（2）Under
Side several spaced contact mouth, each contact mouth be connected with for realize flip-chip encapsulation hot pressing graphical heat
Pressure head（3）.
2. it is according to claim 1 it is a kind of based on flip-chip encapsulation heat pressing process hot-pressing system, it is characterised in that：
The temperature controlling range of the heater is room temperature to 500 degree.
3. it is according to claim 2 it is a kind of based on flip-chip encapsulation heat pressing process hot-pressing system, it is characterised in that：
The graphical thermal head（3）Area cover the area of pressed chip comprehensively.
4. it is according to claim 1 it is a kind of based on flip-chip encapsulation heat pressing process hot-pressing system, it is characterised in that：
The graphical thermal head（3）For solid construction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620977465.7U CN206059348U (en) | 2016-08-29 | 2016-08-29 | A kind of hot-pressing system of the encapsulation heat pressing process based on flip-chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620977465.7U CN206059348U (en) | 2016-08-29 | 2016-08-29 | A kind of hot-pressing system of the encapsulation heat pressing process based on flip-chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206059348U true CN206059348U (en) | 2017-03-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620977465.7U Expired - Fee Related CN206059348U (en) | 2016-08-29 | 2016-08-29 | A kind of hot-pressing system of the encapsulation heat pressing process based on flip-chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206059348U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106158677A (en) * | 2016-08-29 | 2016-11-23 | 广东德力光电有限公司 | The hot-pressing system of encapsulation heat pressing process based on flip-chip and using method thereof |
-
2016
- 2016-08-29 CN CN201620977465.7U patent/CN206059348U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106158677A (en) * | 2016-08-29 | 2016-11-23 | 广东德力光电有限公司 | The hot-pressing system of encapsulation heat pressing process based on flip-chip and using method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170329 Termination date: 20170829 |