CN203934105U - 印制电路布线板 - Google Patents
印制电路布线板 Download PDFInfo
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- CN203934105U CN203934105U CN201420296963.6U CN201420296963U CN203934105U CN 203934105 U CN203934105 U CN 203934105U CN 201420296963 U CN201420296963 U CN 201420296963U CN 203934105 U CN203934105 U CN 203934105U
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- connecting pad
- wiring board
- printed wiring
- transmission terminal
- heat transmission
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
本实用新型提供印制电路布线板,该印制电路布线板具备用于将部件安装于该印制电路布线板的表面安装部件连接用焊盘。表面安装部件连接用焊盘由管脚连接用焊盘和散热用端子连接用焊盘构成。在除了管脚连接用焊盘与散热用端子连接用焊盘之间以外的部位而且在上述散热用端子连接用焊盘附近,设置焊锡吸收焊盘。由此来抑制因过剩焊锡而引起的部件的安装不良。
Description
技术领域
本实用新型涉及能够抑制因过剩焊锡而引起的部件安装不良的、用于电子设备的印制电路布线板。
背景技术
近年来,为了应对高功能化、高密度化,出于强化散热以及接地的目的,用于电子设备的表面安装部件在部件的底面部分设置电极的情况越来越多。在回流(reflow)钎焊工序中,就带有散热用端子的电子部件而言,在其散热用端子与散热用端子连接用焊盘之间在高度方向上存在间隙,因此需要熔化焊锡的隆起高度。此时,在高度方向上假定最宽的间隙,而连接散热用端子与散热用端子连接用焊盘。因此,若供给所需的焊锡量,则在散热用端子与散热用端子连接用焊盘之间的高度方向上的间隙变窄的情况下,会产生焊锡量过剩。其结果,将产生如下问题,过剩的焊锡从散热端子的焊锡接合部被挤出,形成焊锡球而析出并移动,从而引起部件端子间的短路。
因此,在日本特开平9-223862号公报、日本特开2006-303392号公报以及日本特开2012-227349号公报中提出了如下方案:在带有散热用端子的电子部件进行焊锡接合时,在管脚连接用焊盘与散热用端子连接用焊盘之间设置焊锡吸收焊盘,从而抑制过剩焊锡向同一部件的管脚间流动。
但是,在没有焊锡吸收焊盘的部位,在过剩的焊锡被挤出的情况下会形成焊锡球而析出并移动,引起其他部件的端子间的短路,因此在抑制因过剩焊锡而对其他部件引起的短路不良的方面,能够期待充分的效果。
实用新型内容
因此,本实用新型的目的在于,在散热用端子连接用焊盘的附近且除了管脚连接用焊盘与散热用端子连接用焊盘之间以外的部位设置焊锡吸收焊盘,在确保散热用端子所需的焊锡量的状态下,抑制因过剩焊锡而引起的其他部件的端子间的短路等的部件安装不良。
本实用新型的第一方案的印制电路布线板,其是抑制因过剩焊锡而引起的部件的安装不良的印制电路布线板,并且,上述印制电路布线板具备用于将部件安装于该印制电路布线板的表面安装部件连接用焊盘,上述表面安装部件连接用焊盘由管脚连接用焊盘和散热用端子连接用焊盘构成,在除了上述管脚连接用焊盘与上述散热用端子连接用焊盘之间以外的部位而且在上述散热用端子连接用焊盘附近,设置有焊锡吸收焊盘。由此,抑制因过剩焊锡而引起的部件的安装不良。
本实用新型第二方案的印制电路布线板,其是抑制因过剩焊锡而引起的部件的安装不良的印制电路布线板,并且,上述印制电路布线板具备用于将部件安装于该印制电路布线板的表面安装部件连接用焊盘,上述表面安装部件连接用焊盘由管脚连接用焊盘和散热用端子连接用焊盘构成,在除了上述管脚连接用焊盘与上述散热用端子连接用焊盘之间以外的部位而且在上述散热用端子连接用焊盘附近,设置有供给焊膏的焊锡吸收焊盘。由此,抑制因过剩焊锡而引起的部件的安装不良。
根据本实用新型,在散热用端子连接用焊盘附近且除了管脚连接用焊盘与散热用端子连接用焊盘之间以外的部位设置焊锡吸收焊盘,从而能够在确保散热用端子所需的焊锡量的状态下,抑制过剩焊锡对其他部件引起的端子间的短路等的部件安装不良。
附图说明
图1是说明本实用新型的印制电路布线板的实施方式1的图。
图2是说明本实用新型的印制电路布线板的实施方式2的图
具体实施方式
首先,使用图1来说明本实用新型的印制电路布线板的实施方式1。
如图1所示,在印制电路布线板10的载置表面安装部件的一侧的面上,设置有表面安装部件连接用焊盘11和焊锡吸收焊盘14。表面安装部件连接用焊盘11由管脚连接用焊盘12和散热用端子连接用焊盘13构成。
散热用端子连接用焊盘13配置在表面安装部件的部件组件安装区域15下部。焊锡吸收焊盘14设置在除了管脚连接用焊盘12与散热用端子连接用焊盘13之间以外的部位而且是散热用端子连接用焊盘13的附近。
印制电路布线板10的除了设置有表面安装部件连接用焊盘11以及焊锡吸收焊盘14以外的表面区域的大部分被抗焊剂16覆盖。
如上所述,在本实用新型的印制电路布线板的实施方式1中,通过将焊锡吸收焊盘14设置于除了管脚连接用焊盘12与散热用端子连接用焊盘13之间以外的部位而且是散热用端子连接用焊盘13的附近,能够抑制焊锡球对其他部件引起的短路不良。
接下来,使用图2来说明本实用新型的印制电路布线板的实施方式2。
图2的印制电路布线板10与图1的印制电路布线板的不同点仅在于将图1的印制电路布线板10的焊锡吸收焊盘14变为供给焊膏的焊锡吸收焊盘17,其他的构成与图1的印制电路布线板10相同。
虽然在图1的印制电路布线板10中不向上述焊锡吸收焊盘14供给焊膏也能够期待大致的效果,但是如图2所示,与其他的表面安装部件连接用焊盘11相同地,通过向焊锡吸收焊盘17供给焊膏,在回流工序中所供给的焊膏熔融,能够期待促进焊锡吸收焊盘的焊锡吸收的效果。
Claims (2)
1.一种印制电路布线板,其是抑制因过剩焊锡而引起的部件的安装不良的印制电路布线板,上述印制电路布线板的特征在于,
上述印制电路布线板具备用于将部件安装于该印制电路布线板的表面安装部件连接用焊盘,
上述表面安装部件连接用焊盘由管脚连接用焊盘和散热用端子连接用焊盘构成,
在除了上述管脚连接用焊盘与上述散热用端子连接用焊盘之间以外的部位而且在上述散热用端子连接用焊盘附近,设置有焊锡吸收焊盘。
2.一种印制电路布线板,其是抑制因过剩焊锡而引起的部件的安装不良的印制电路布线板,上述印制电路布线板的特征在于,
上述印制电路布线板具备用于将部件安装于该印制电路布线板的表面安装部件连接用焊盘,
上述表面安装部件连接用焊盘由管脚连接用焊盘和散热用端子连接用焊盘构成,
在除了上述管脚连接用焊盘与上述散热用端子连接用焊盘之间以外的部位而且在上述散热用端子连接用焊盘附近,设置有供给焊膏的焊锡吸收焊盘。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013003219U JP3185456U (ja) | 2013-06-06 | 2013-06-06 | 余剰はんだによる部品の実装不良を抑制するプリント配線板 |
JP2013-003219 | 2013-06-06 |
Publications (1)
Publication Number | Publication Date |
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CN203934105U true CN203934105U (zh) | 2014-11-05 |
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ID=50429219
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201420296963.6U Active CN203934105U (zh) | 2013-06-06 | 2014-06-05 | 印制电路布线板 |
Country Status (3)
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JP (1) | JP3185456U (zh) |
CN (1) | CN203934105U (zh) |
DE (1) | DE202014102541U1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110856338A (zh) * | 2019-10-22 | 2020-02-28 | 深圳市华星光电技术有限公司 | 电路板组件及电子设备 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09223863A (ja) | 1996-02-15 | 1997-08-26 | Pfu Ltd | 基板バックアップ手段を備えたクリームハンダ印刷装置およびクリームハンダ印刷方法 |
JP2006303392A (ja) | 2005-04-25 | 2006-11-02 | Matsushita Electric Ind Co Ltd | プリント配線板と電子回路基板及びその製造方法 |
JP2012227349A (ja) | 2011-04-19 | 2012-11-15 | Hitachi Ltd | 電子部品の実装方法 |
-
2013
- 2013-06-06 JP JP2013003219U patent/JP3185456U/ja not_active Expired - Fee Related
-
2014
- 2014-05-30 DE DE202014102541.3U patent/DE202014102541U1/de not_active Expired - Lifetime
- 2014-06-05 CN CN201420296963.6U patent/CN203934105U/zh active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110856338A (zh) * | 2019-10-22 | 2020-02-28 | 深圳市华星光电技术有限公司 | 电路板组件及电子设备 |
CN110856338B (zh) * | 2019-10-22 | 2021-03-23 | Tcl华星光电技术有限公司 | 电路板组件及电子设备 |
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Publication number | Publication date |
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DE202014102541U1 (de) | 2014-09-08 |
JP3185456U (ja) | 2013-08-15 |
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