CN203910791U - 一种磨砂面表面装贴型led - Google Patents

一种磨砂面表面装贴型led Download PDF

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Publication number
CN203910791U
CN203910791U CN201420179643.2U CN201420179643U CN203910791U CN 203910791 U CN203910791 U CN 203910791U CN 201420179643 U CN201420179643 U CN 201420179643U CN 203910791 U CN203910791 U CN 203910791U
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China
Prior art keywords
led
frosted
ppa support
surface mounted
smd
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Expired - Lifetime
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CN201420179643.2U
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English (en)
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龚文
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SHENZHEN JINGTAI CO Ltd
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SHENZHEN JINGTAI CO Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Illuminated Signs And Luminous Advertising (AREA)
  • Led Device Packages (AREA)

Abstract

本实用新型公开了一种磨砂面表面装贴型LED，包括黑色PPA支架1；通过固晶胶4固定在所述黑色PPA支架1上的红色、绿色和蓝色芯片3；连接所述红色、绿色和蓝色芯片3与所述PPA支架1的金线，最重要的是，还包括覆盖在所述黑色PPA支架1透光面的磨砂封装胶体5。当光线照射到磨砂面胶体5上后就会形成漫反射，人的肉眼在感光上就反应为不反光，在根本上决解了显示屏反光的问题，从而填补国内外有此类需求的市场空白。

Description

一种磨砂面表面装贴型LED
技术领域
本实用新型涉及LED封装技术领域，更具体的说是涉及一种磨砂面表面装贴型LED。
背景技术
LED(发光二极管)应用非常广泛，由于现有技术提供的全彩SMD(表面贴装型，Surface Mounted Devices)表面光滑，表面呈反光状态，应用于LED显示屏时，在关屏时显示屏表面呈反光状态(主要体现为LED表面反光)，尤其在摄像时拍摄的画面上出现大面积亮团问题(无法看到正常的图像)，如图3所示，光线照射到光滑面胶体5′后，会直线反射出来。
所以目前客户对LED产品要求产品表面不反光，就现有的全彩SMD LED产品来看无法满足要求。
所以如何降低LED显示屏的反光问题是本领域技术人员亟需解决的问题。
实用新型内容
有鉴于此，本实用新型提供了一种磨砂面表面装贴型LED，包括黑色PPA支架；通过固晶胶固定在所述黑色PPA支架上的红色、绿色和蓝色芯片；连接所述红色、绿色和蓝色芯片与所述PPA支架的金线，最重要的是，还包括覆盖在所述黑色PPA支架透光面的磨砂封装胶体。
优选的，在上述磨砂面表面装贴型LED中，所述黑色PPA支架的整体外型结构为长2.1毫米，宽2.1毫米，高1.1毫米的长方体型。
经由上述的技术方案可知，与现有技术相比，本实用新型公开提供了一种磨砂面表面装贴型LED，其表面添加了磨砂面胶体，如图4所示，当光线照射到磨砂面胶体5上后就会形成漫反射，人的肉眼在感光上就反应为不反光，在根本上决解了显示屏反光的问题，从而填补国内外有此类需求的市场空白。
附图说明
为了更清楚地说明本实用新型实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本实用新型的实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据提供的附图获得其他的附图。
图1附图为本实用新型的俯视结构示意图。
图2附图为本实用新型的正面结构示意图。
图3附图为背景技术中的光线反光示意图。
图4附图为本实用新型的光线漫反射示意图。
在图1-图4中：1为黑色PPA支架、2为金线、3为红色、绿色和蓝色芯片、4为固晶胶、5为磨砂面胶体、5′为光滑面胶体。
具体实施方式
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本实用新型一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本实用新型保护的范围。
请参考图1和图2：
本实用新型实施例公开了一种磨砂面表面装贴型LED，包括黑色PPA支架1；通过固晶胶4固定在黑色PPA支架1上的红色、绿色和蓝色芯片3；连接红色、绿色和蓝色芯片3与PPA支架1的金线，其中，还包括覆盖在黑色PPA支架1透光面的磨砂封装胶体5。
对比图3和图4的光线照射图，很明显的可以看到当光线照射到磨砂面胶体5上后就会形成漫反射，人的肉眼在感光上就反应为不反光，在根本上决解了显示屏反光的问题。
为了进一步优化上述技术方案，黑色PPA支架1的整体外型结构为长2.1毫米，宽2.1毫米，高1.1毫米的长方体型。其本身就是小尺寸，所以做出长方体形在做其他方面的工作也比较简单化了。
本说明书中各个实施例采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似部分互相参见即可。对于实施例公开的装置而言，由于其与实施例公开的方法相对应，所以描述的比较简单，相关之处参见方法部分说明即可。
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本实用新型。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的，本文中所定义的一般原理可以在不脱离本实用新型的精神或范围的情况下，在其它实施例中实现。因此，本实用新型将不会被限制于本文所示的这些实施例，而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。

Claims (2)

1.一种磨砂面表面装贴型LED，包括黑色PPA支架(1)；通过固晶胶(4)固定在所述黑色PPA支架(1)上的红色、绿色和蓝色芯片(3)；连接所述红色、绿色和蓝色芯片(3)与所述PPA支架(1)的金线，其特征在于，还包括覆盖在所述黑色PPA支架(1)透光面的磨砂封装胶体(5)。
2.根据权利要求1所述的磨砂面表面装贴型LED，其特征在于，所述黑色PPA支架(1)的整体外型结构为长2.1毫米，宽2.1毫米，高1.1毫米的长方体型。
CN201420179643.2U 2014-04-15 2014-04-15 一种磨砂面表面装贴型led Expired - Lifetime CN203910791U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105810115A (zh) * 2016-05-30 2016-07-27 深圳市奥蕾达科技有限公司 新型cob全彩led发光面板及其制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105810115A (zh) * 2016-05-30 2016-07-27 深圳市奥蕾达科技有限公司 新型cob全彩led发光面板及其制造方法

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