CN204029852U - 一种贴片式led - Google Patents

一种贴片式led Download PDF

Info

Publication number
CN204029852U
CN204029852U CN201420372647.2U CN201420372647U CN204029852U CN 204029852 U CN204029852 U CN 204029852U CN 201420372647 U CN201420372647 U CN 201420372647U CN 204029852 U CN204029852 U CN 204029852U
Authority
CN
China
Prior art keywords
luminescence chip
utility
support
model
surface mounted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201420372647.2U
Other languages
English (en)
Inventor
龚文
邵鹏睿
张磊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN JINGTAI CO Ltd
Original Assignee
SHENZHEN JINGTAI CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHENZHEN JINGTAI CO Ltd filed Critical SHENZHEN JINGTAI CO Ltd
Priority to CN201420372647.2U priority Critical patent/CN204029852U/zh
Application granted granted Critical
Publication of CN204029852U publication Critical patent/CN204029852U/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

本实用新型公开了一种贴片式LED，包括支架；通过固晶胶固定在所述支架上的发光芯片；用于所述发光芯片与所述支架电连接的金线；保护和固定所述发光芯片和所述金线的封装胶体；其特征在于，所述支架底部设置有散热片，所述支架的长度为4.0mm，宽度为0.8mm，高度为0.8mm，所述发光芯片为蓝色芯片，所述封装胶体为混合了荧光粉的透明硅胶。本实用新型产品非常适合现有面板灯及背光照明市场，相比于传统背光照明光源产品更加轻薄，在面板灯结构上可以减少更多的物料成本，在保证其性能的情况下面板灯的性价比更高。

Description

一种贴片式LED
技术领域
本实用新型涉及LED光源技术领域，更具体的说是涉及一种贴片式LED。
背景技术
近年来，随着LED技术的发展，LED封装产品的结构也越来越多元化，现有4014贴片式LED作为新一代光源主要应用于面板灯照明和屏幕背光，与传统面板灯光源相比，具有光线柔和、安全可靠、绿色环保等特点，由于现有4014贴片式LED整体尺寸长度为4.0mm、宽度为1.4mm、高度为0.8mm，尺寸偏宽，在应用到一些以导光板为扩散媒体的照明灯具上时，所需导光板厚度最低要求需要在2.8mm以上，然而导光板的成本在其灯具中所占比重将近60％，因此如何设计一款合适的光源，在不影响其性能的情况下，降低导光板的应用成本，是本领域技术人员值得深思的问题。
综上所述，如何提供一种应用于面板灯和背光照明的成本更低的贴片式LED是本领域技术人员亟需解决的问题。
实用新型内容
有鉴于此，本实用新型提供了一种贴片式LED，包括支架；通过固晶胶固定在所述支架上的发光芯片；用于所述发光芯片与所述支架电连接的金线；保护和固定所述发光芯片和所述金线的封装胶体；其特征在于，所述支架底部为热电一体结构散热片，所述支架的长度为4.0mm，宽度为0.8mm，高度为0.8mm，所述发光芯片为蓝色芯片，所述封装胶体为混合了荧光粉的透明硅胶。
优选的，在上述的一种贴片式LED中，还包括所述支架底部散热片为固定焊盘。
经由上述的技术方案可知，与现有技术相比，本实用新型公开提供了一种贴片式LED，其重点在于，本实用新型支架的宽度为0.8mm，减小了支架的整体尺寸，节约了支架成本，从而减少了封装胶体的使用量，也就节约了硅胶和荧光粉的成本。在应用于以导光板为扩散媒体的照明灯具上时，可以选择更加轻薄的导光板，与4014LED产品对比，导光板厚度可以降低30％到40％，相应的，以重量来算成本的导光板，其成本也会下降30％到40％，从灯具总成本上来算，可以节省20％左右成本，可以成功的解决目前LED面板灯背光照明灯具成本偏高的问题，而支架底部的热电一体结构散热片，增强了本实用新型的散热性能，提高了稳定性。
同时下面结合附图和具体实施方式对本实用新型作进一步说明。
附图说明
为了更清楚地说明本实用新型实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本实用新型的实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据提供的附图获得其他的附图。
图1附图为本实用新型的正面结构示意图。
图2附图为本实用新型的侧面结构示意图。
图中：101-支架；102-发光芯片；103-金线；104-封装胶体；105-散热片；106-固晶胶；a-长度；b-宽度；c-高度。
具体实施方式
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本实用新型一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本实用新型保护的范围。
本实用新型实施例公开了一种应用于面板灯和背光照明的成本更低的贴片式LED。
为了实现上述功能，提供以下技术方案：
请参考附图1，一种贴片式LED，包括支架101；通过固晶胶106固定在支架101上的发光芯片；用于发光芯片102与支架101电连接的金线103；保护和固定发光芯片102和金线103的封装胶体104；还包括支架101底部为热电一体垂直散热片105，支架101的长度a为4.0mm，宽度b为0.8mm，高度c为0.8mm，发光芯片为蓝色芯片，封装胶体104为混合了荧光粉的透明硅胶。
本实用新型支架101的宽度b为0.8mm，减小了支架101的整体尺寸，节约了支架101成本，从而减少了封装胶体104的使用量，也就节约了硅胶和荧光粉的成本。发光芯片用蓝色芯片，封装胶体104用混合了荧光粉的透明硅胶，荧光粉为黄色荧光粉，蓝色发光芯片上配合能被蓝光激发的黄色荧光粉，发光芯片发出的蓝光与荧光粉发出的黄光互补形成白光，增强了光效。
本实用新型公开提供了一种轻薄型LED，宽度b仅为0.8mm，在应用中与导光板搭配时，可以大大减小导光板厚度，使其应用成本更低，本实用新型可广泛应用于现有的面板灯照明、屏背光光源中。
本说明书中各个实施例采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似部分互相参见即可。对于实施例公开的装置而言，由于其与实施例公开的方法相对应，所以描述的比较简单，相关之处参见方法部分说明即可。
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本实用新型。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的，本文中所定义的一般原理可以在不脱离本实用新型的精神或范围的情况下，在其它实施例中实现。因此，本实用新型将不会被限制于本文所示的这些实施例，而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。

Claims (2)

1.一种贴片式LED，包括支架(101)；通过固晶胶(106)固定在所述支架(101)上的发光芯片；用于所述发光芯片(102)与所述支架(101)电连接的金线(103)；保护和固定所述发光芯片(102)和所述金线(103)的封装胶体(104)；其特征在于，所述支架(101)底部为热电一体垂直散热片(105)，所述支架(101)的长度(a)为4.0mm，宽度(b)为0.8mm，高度(c)为0.8mm，所述发光芯片为蓝色芯片，所述封装胶体(104)为混合了荧光粉的透明硅胶。
2.根据权利要求1所述的一种贴片式LED，其特征在于，所述支架(101)底部散热片(105)为固定焊盘。
CN201420372647.2U 2014-07-08 2014-07-08 一种贴片式led Expired - Lifetime CN204029852U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420372647.2U CN204029852U (zh) 2014-07-08 2014-07-08 一种贴片式led

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420372647.2U CN204029852U (zh) 2014-07-08 2014-07-08 一种贴片式led

Publications (1)

Publication Number Publication Date
CN204029852U true CN204029852U (zh) 2014-12-17

Family

ID=52069683

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420372647.2U Expired - Lifetime CN204029852U (zh) 2014-07-08 2014-07-08 一种贴片式led

Country Status (1)

Country Link
CN (1) CN204029852U (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106876375A (zh) * 2017-03-28 2017-06-20 山东晶泰星光电科技有限公司 一种集成式rgb‑led显示屏
CN110005972A (zh) * 2019-03-29 2019-07-12 长兴科瑞照明电器有限公司 一种照明模组、一种灯具以及一种照明模组制造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106876375A (zh) * 2017-03-28 2017-06-20 山东晶泰星光电科技有限公司 一种集成式rgb‑led显示屏
WO2018176655A1 (zh) * 2017-03-28 2018-10-04 山东晶泰星光电科技有限公司 一种集成式rgb-led显示屏
EP3557615A4 (en) * 2017-03-28 2020-01-08 Shandong Prosperous Star Optoelectronics Co., Ltd INTEGRATED TYPE RGB LED DISPLAY
JP2020504437A (ja) * 2017-03-28 2020-02-06 山東晶泰星光電科技有限公司Ｓｈａｎｄｏｎｇ Ｐｒｏｓｐｅｒｏｕｓ Ｓｔａｒ Ｏｐｔｏｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 集積型ｒｇｂ−ｌｅｄディスプレイ
CN110005972A (zh) * 2019-03-29 2019-07-12 长兴科瑞照明电器有限公司 一种照明模组、一种灯具以及一种照明模组制造方法

Similar Documents

Publication Publication Date Title
CN204029852U (zh) 一种贴片式led
CN205752232U (zh) 一种cob光模组
CN204516761U (zh) 基于二次光学设计的超薄柔性双面发光led光源
CN103700754A (zh) 发光二极管封装件、背光模组和显示装置
CN202972941U (zh) 导光板、光源系统以及显示模组
CN208819911U (zh) 高光效集成led支架
CN206490088U (zh) 一种可双面发光的led光源
CN204328613U (zh) 一种直下式背光模组灯条
CN202957299U (zh) 一种led封装结构
CN104167408A (zh) 覆晶式发光二极管单元
CN204884446U (zh) 一种led显示屏
CN203395652U (zh) Led灯珠
CN205428917U (zh) Led封装模组及具有该led封装模组的直下式led灯条
CN204268130U (zh) 一种多条式led平板灯
CN202487661U (zh) Led封装
CN104952861A (zh) 一种低成本、高亮度、大功率白光led
CN204651352U (zh) 基于二次光学设计的柔性荧光基板及led光源
CN203115602U (zh) 双面铝基板蜡烛灯
CN203549493U (zh) Led球泡灯
CN203932053U (zh) 全周角无暗区led360°发光灯丝
CN203491297U (zh) Led面光源的封装器件
CN203826378U (zh) 基于透光基板的全角度发光led光源
CN202473918U (zh) 高透亮多芯片白光led封装
CN203165934U (zh) Mlcob的封装结构
CN202662603U (zh) Led发光元件

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20141217

CX01 Expiry of patent term