CN104952861A - 一种低成本、高亮度、大功率白光led - Google Patents

一种低成本、高亮度、大功率白光led Download PDF

Info

Publication number
CN104952861A
CN104952861A CN201410120470.1A CN201410120470A CN104952861A CN 104952861 A CN104952861 A CN 104952861A CN 201410120470 A CN201410120470 A CN 201410120470A CN 104952861 A CN104952861 A CN 104952861A
Authority
CN
China
Prior art keywords
wafer
white light
light led
support
power white
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410120470.1A
Other languages
English (en)
Inventor
刘兰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Wenrun Optoelectronic Co Ltd
Original Assignee
Jiangsu Wenrun Optoelectronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Wenrun Optoelectronic Co Ltd filed Critical Jiangsu Wenrun Optoelectronic Co Ltd
Priority to CN201410120470.1A priority Critical patent/CN104952861A/zh
Publication of CN104952861A publication Critical patent/CN104952861A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

Landscapes

  • Led Device Packages (AREA)

Abstract

本发明公开了一种低成本、高亮度、大功率白光LED，包括支架、第一晶片、第二晶片、荧光胶体、金线，所述金线的两端分别与所述第一、第二晶片及支架底部固定连接，晶片外表面包覆荧光胶体，荧光胶体上表面与所述支架顶面水平对齐，支架底部设有散热片，所述第一、第二晶片通过固晶粘结胶分别固定在固晶区域内，第一、第二晶片相互串联导通。支架碗杯内部采用大平杯设计，固晶区域和散热面积较传统支架大。可以放置两颗尺寸较大的晶片，实现双晶串联；又可以将晶片的热量及时通过底部散热片散发出去，提高LED的光衰性能。

Description

一种低成本、高亮度、大功率白光LED
技术领域
本发明公开了一种低成本、高亮度、大功率白光LED，涉及光电技术领域。
背景技术
作为目前全球最受瞩目的新一代光源，LED因其高亮度、低热量、长寿命、环保、可回收再利用等优点，被称为是21世纪最有发展前景的绿色照明光源。LED照明优势众多，但价格问题一直是制约LED照明推广的最大问题。为了解决成本问题，LED双晶片串联作为其中一种降低成本方案应运而生。但由于固晶区域的限制，传统的白光LED封装体在实行双晶串联的技术方案时，两个晶片没有足够的安装空间和焊线空间。
发明内容
本发明所要解决的技术问题是：针对现有技术的缺陷，提供一种低成本、高亮度、大功率白光LED。
本发明为解决上述技术问题采用以下技术方案：
一种低成本、高亮度、大功率白光LED，包括支架、第一晶片、第二晶片、荧光胶体、金线，所述金线的两端分别与所述第一、第二晶片及支架底部固定连接，晶片外表面包覆荧光胶体，荧光胶体上表面与所述支架顶面水平对齐，支架采用大平杯设计，固晶区域较大，所述第一、第二品片通过固晶粘结胶分别固定在固晶区域内，第一、第二晶片相互串联导通，支架底部还设置有散热片。
作为本发明的进一步优选方案，所述第一、第二晶片均为蓝色晶片，蓝色晶片的激发波长为452～470纳米。
作为本发明的进一步优选方案，所述荧光胶体包括胶粘剂和荧光粉。
作为本发明的进一步优选方案，所述荧光粉为峰值波长540纳米左右的绿色荧光粉和峰值波长为620纳米左右的红色荧光粉。
作为本发明的进一步优选方案，所述胶粘剂为环氧树脂或者硅胶或者环氧树脂与硅胶的混合物。
本发明采用以上技术方案与现有技术相比，具有以下技术效果：
(1)与传统支架相比，支架设计采用大平杯设计，固晶区域较大，可以放置两颗尺寸较大的芯片，实现双晶串联；较传统单晶LED器件亮度提高约1倍。从LM/元的角度考虑，大大节约了成本。
(2)支架底部增设散热片，结构简单，有效降低了热阻，可将蓝色晶片产生的热量直接散发出去，改善了白光LED的光衰性能，延长了白光LED的使用寿命。
附图说明
图1是本发明的结构示意图，
其中：1.支架，2.蓝色晶片，3.蓝色晶片，4.荧光胶体，5.金线
具体实施方式
下面结合附图对本发明的技术方案做进一步的详细说明：
本发明的结构示意图如图1所示，具体包括支架、第一蓝色晶片、第二蓝色晶片、荧光胶体、金线，第一蓝色晶片和第二蓝色晶片通过固晶粘结胶固定在支架底部，其激发波长为452～470纳米，第一蓝色晶片与第二蓝色晶片通过金线实现串联连接；第一蓝色晶片和第二蓝色晶片外表面包覆有一层荧光胶体，荧光胶体上表面与支架顶面平齐，荧光胶体由胶粘剂和荧光粉混合烘干制成，荧光粉为540纳米左右的绿色荧光粉和峰值波长为620纳米左右的红色荧光粉。其中胶粘剂可以是环氧树脂、硅胶，或二者的混合物。支架底部碗杯采用大平杯设计，所述第一、第二晶片通过固晶粘结胶分别固定在固晶区域内，第一、第二晶片相互串联导通，支架底部还设置有散热片。
本发明的制作方法为：将第一蓝色晶片和第二蓝色晶片固定在支架内，焊好线，再将胶粘剂和荧光粉的混合物按比例混合调匀，涂敷在第一蓝色晶片和第二蓝色晶片上，烘烤固化成形。

Claims (5)

1.一种低成本、高亮度、大功率白光LED，包括支架、第一晶片、第二晶片、荧光胶体、金线，所述金线的两端分别与所述第一、第二晶片及支架底部固定连接，晶片外表面包覆荧光胶体，荧光胶体上表面与所述支架顶面水平对齐，其特征在于：支架碗杯内部采用大平杯设计，所述第一、第二晶片通过固晶粘结胶分别固定在固晶区域内，第一、第二晶片相互串联导通，支架底部设置有散热片。
2.如权利要求1所述的一种低成本、高亮度、大功率白光LED，其特征在于：所述第一、第二晶片均为蓝色晶片，蓝色晶片的激发波长为452～470纳米。
3.如权利要求1所述的一种低成本、高亮度、大功率白光LED，其特征在于：所述荧光胶体包括胶粘剂和荧光粉。
4.如权利要求3所述的一种低成本、高亮度、大功率白光LED，其特征在于：所述荧光粉的峰值波长540纳米左右的绿色荧光粉和峰值波长为620纳米左右的红色荧光粉。
5.如权利要求3所述的一种低成本、高亮度、大功率白光LED，其特征在于：所述胶粘剂为环氧树脂或者硅胶或者环氧树脂与硅胶的混合物。
CN201410120470.1A 2014-03-27 2014-03-27 一种低成本、高亮度、大功率白光led Pending CN104952861A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410120470.1A CN104952861A (zh) 2014-03-27 2014-03-27 一种低成本、高亮度、大功率白光led

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410120470.1A CN104952861A (zh) 2014-03-27 2014-03-27 一种低成本、高亮度、大功率白光led

Publications (1)

Publication Number Publication Date
CN104952861A true CN104952861A (zh) 2015-09-30

Family

ID=54167409

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410120470.1A Pending CN104952861A (zh) 2014-03-27 2014-03-27 一种低成本、高亮度、大功率白光led

Country Status (1)

Country Link
CN (1) CN104952861A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107799508A (zh) * 2017-11-03 2018-03-13 江苏稳润光电科技有限公司 一种解决散热问题的led灯丝及制造方法
CN113540315A (zh) * 2021-06-11 2021-10-22 东莞市立德达光电科技有限公司 一种植物照明led封装方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201651846U (zh) * 2010-01-26 2010-11-24 吴中林 一种白光led光源
CN102278641A (zh) * 2011-08-25 2011-12-14 上海亚明灯泡厂有限公司 白光led灯及其生成高显色白光的方法
CN102454945A (zh) * 2010-10-27 2012-05-16 深圳市日上光电有限公司 一种获得高显色性暖白光的方法及其封装结构
CN102891245A (zh) * 2012-09-17 2013-01-23 温州大学 将荧光晶片用于大功率白光led的封装结构及其封装方法
CN103346245A (zh) * 2013-06-25 2013-10-09 彩虹集团公司 一种白光led及制备方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201651846U (zh) * 2010-01-26 2010-11-24 吴中林 一种白光led光源
CN102454945A (zh) * 2010-10-27 2012-05-16 深圳市日上光电有限公司 一种获得高显色性暖白光的方法及其封装结构
CN102278641A (zh) * 2011-08-25 2011-12-14 上海亚明灯泡厂有限公司 白光led灯及其生成高显色白光的方法
CN102891245A (zh) * 2012-09-17 2013-01-23 温州大学 将荧光晶片用于大功率白光led的封装结构及其封装方法
CN103346245A (zh) * 2013-06-25 2013-10-09 彩虹集团公司 一种白光led及制备方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107799508A (zh) * 2017-11-03 2018-03-13 江苏稳润光电科技有限公司 一种解决散热问题的led灯丝及制造方法
CN113540315A (zh) * 2021-06-11 2021-10-22 东莞市立德达光电科技有限公司 一种植物照明led封装方法

Similar Documents

Publication Publication Date Title
CN104393145A (zh) 一种低热阻、高亮度、陶瓷基白光led
CN204179079U (zh) 一种基于cob封装的多色led光源
CN203150541U (zh) 一种基于cob封装的led光源
CN104952861A (zh) 一种低成本、高亮度、大功率白光led
CN204696126U (zh) 基于陶瓷荧光体封装的cob结构白光led光源
CN201706452U (zh) 一种高效led灯具散热器
CN201428943Y (zh) Led灯
CN203686842U (zh) 节能路灯
CN202901891U (zh) 一种贴片式led发光器件
CN202373624U (zh) Led封装结构
CN209183572U (zh) 一种led光源
CN203367350U (zh) 一种夹层扩散剂直插型白光led
CN203659925U (zh) 高亮度贴片发光二极管
CN202109275U (zh) Yag荧光led球泡灯
CN202302944U (zh) Led面光源用cob封装灯条模块
CN201448655U (zh) 一种发光二极管结构
CN204885214U (zh) Led灯珠结构
CN203398152U (zh) 一种led
CN202749411U (zh) 一种白光led
CN203549493U (zh) Led球泡灯
CN202996907U (zh) 一种高效集成式led光源
CN202332956U (zh) 一种集成封装的大功率led装置
CN203950837U (zh) 全角度白色发光二极管灯条
CN204045587U (zh) 一种全角度发光封装模块
CN203826378U (zh) 基于透光基板的全角度发光led光源

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20150930

WD01 Invention patent application deemed withdrawn after publication