CN103700754A - 发光二极管封装件、背光模组和显示装置 - Google Patents

发光二极管封装件、背光模组和显示装置 Download PDF

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CN103700754A
CN103700754A CN201310684966.7A CN201310684966A CN103700754A CN 103700754 A CN103700754 A CN 103700754A CN 201310684966 A CN201310684966 A CN 201310684966A CN 103700754 A CN103700754 A CN 103700754A
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guide plate
package member
diode package
light emission
emission diode
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柏玲
布占场
王贺陶
鹿堃
颜凯
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BOE Technology Group Co Ltd
Beijing BOE Display Technology Co Ltd
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Beijing BOE Display Technology Co Ltd
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Priority to US14/422,141 priority patent/US9917233B2/en
Priority to PCT/CN2014/083570 priority patent/WO2015085780A1/zh
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
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    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
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    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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Abstract

本发明提供一种发光二极管封装件、背光模组和显示装置，涉及显示技术领域。所述发光二极管封装件，包括封装壳和封装在所述封装壳内部的发光二极管芯片，所述封装壳为包括至少一个斜面的多面体，所述封装壳的其中一个斜面为所述发光二极管封装件的出光面。本发明提供的发光二极管封装件具有体积小、出光面大的特点。所述背光模组中包括所述发光二极管封装件。本发明适用于液晶显示器的背光源。

Description

发光二极管封装件、背光模组和显示装置
技术领域
本发明涉及液晶显示器的背光源，尤其涉及背光源中发光二极管（LED）的封装结构及背光模组。
背景技术
目前液晶显示装置侧入式背光源结构中，发光二极管（LED）封装结构1设置在导光板（LGP）2的侧面，其中的LED封装结构1为矩形外观封装结构。其出光方向与导光板2的出光方向相互垂直，参看图1所示，其中水平方向的箭头表示LED封装结构1的出光方向，竖直向上的箭头表示导光板2的出光方向。
参看图2及图3所示，现有的LED封装结构包括矩形外壳10，在矩形外壳10内封装有LED芯片11，LED芯片11上连接有金线12，在矩形外壳10上，LED芯片11所正对的面为出光面13，在矩形外壳10内部与所述LED芯片11和出光面13之间还封装有硅胶和荧光粉14，以通过芯片产生的蓝光激发荧光粉而产生白光。
在实现本发明的过程中，发明人发现：现有的矩形外观的发光二极管封装结构体积较大但出光面较小，不利于实现背光模组的轻薄化。
发明内容
本发明要解决的技术问题是提供一种发光二极管封装件、背光模组和显示装置，其中发光二极管封装件的体积较小且出光面较大。
为解决上述技术问题，本发明的实施例提供的发光二极管封装件采用如下技术方案：
一种发光二极管封装件，包括封装壳和封装在所述封装壳内部的发光二极管芯片，所述封装壳为包括至少一个斜面的多面体，所述封装壳的其中一个斜面为所述发光二极管封装件的出光面。
优选的，所述封装壳包括呈三角形的平行设置的第一面与第二面，以及连接第一面和第二面的第一侧面、第二侧面和第三侧面，所述第一侧面、第二侧面或第三侧面为所述发光二极管封装件的出光面。
优选的，所述封装壳的所述第一面与第二面呈等腰直角三角形，其中，所述等腰直角三角形的斜边所在的面为所述发光二极管封装件的出光面。
优选的，所述发光二极管芯片的出光方向与所述发光二极管封装件的所述出光面相垂直。
优选的，所述等腰直角三角形的至少一个直角边所在的平面设有封装壳的加强部。
优选的，所述加强部与所述封装壳为一体结构。
本发明的实施例还提供一种背光模组，包括如上所述的发光二极管封装件。
优选的，所述背光模组包括导光板，所述导光板的入光面与所述发光二极管封装件的出光面相适配。
优选的，所述导光板包括平行的顶面和底面，以及四个侧面，所述导光板的至少一个侧面为斜面，并且所述导光板的所述斜面与所述导光板的所述底面之间的夹角为锐角，所述导光板的所述斜面为所述导光板的入光面，所述导光板的所述顶面为导光板的出光面，所述发光二极管封装件设置在所述导光板的所述斜面，所述发光二极管封装件的出光方向垂直于所述导光板的入光面。
本发明的实施例还提供一种显示装置，包括如上所述的背光模组。
本发明的上述技术方案的有益效果如下：
上述各方案中，相对于现有技术中呈长方体结构的LED封装件而言，本发明实施例中LED封装件由于封装壳呈包括至少一个斜面的多面体，并且所述封装壳的其中一个斜面为所述发光二极管芯片（LED芯片）的出光面，这样使得本发明中的LED封装件体积较小，出光面较大。本发明实施例背光模组中，由于导光板至少一侧的侧面为斜面，所述光源的出光方向垂直于所述导光板侧面的所述斜面，有利于减轻萤火虫（hotspot）现象（hotspot现象是采用LED作为背光光源时，背光源入光部分会有亮暗交替现象），并提高导光板出光方向的光通量，提高光能利用率。
附图说明
图1为现有技术中液晶显示模组的基本结构示意图；
图2为现有技术中发光二极管封装件的结构示意图；
图3为图2所示发光二极管封装件的立体结构示意图；
图4为本发明发光二极管封装件一实施例的结构示意图；
图5为图4所示发光二极管封装件实施例的立体结构示意图；
图6为本发明发光二极管封装件另一实施例的结构示意图；
图7为本发明背光模组实施例中发光二极管封装件的出光方向模型示意图；
图8为本发明背光模组实施例中hotspot现象（小）的示意图；
图9为现有技术中hotspot现象（大）的示意图；
图10为本发明实施例背光模组结构与现有的背光模组结构对比示意图。
具体实施方式
为使本发明要解决的技术问题、技术方案和优点更加清楚，下面将结合附图及具体实施例进行详细描述。
如图4及图5所示，本发明一种发光二极管封装件实施例，包括封装壳3和封装在所述封装壳3内部的发光二极管芯片4，所述封装壳3为包括至少一个斜面的多面体，所述封装壳3的其中一个斜面5为所述发光二极管封装件的出光面。
本发明实施例中LED封装件由于封装壳3为包括至少一个斜面的多面体，并且所述封装壳3的其中一个斜面5为所述LED芯片的出光面，这样使得本发明实施例中的LED封装件体积较小，出光面较大。
在前述实施例中，所述发光二极管芯片4上连接有金线6，发光二极管芯片4通过固晶胶7固定在位于封装壳3内的热沉8上，在发光二极管芯片4与出光面之间封装有硅胶和荧光粉9，从而可以通过发光二极管芯片产生的蓝光激发荧光粉而产生白光。
参看图4所示，为了便于发光二极管封装件在导光板侧面的布置，优选地，所述封装壳包括呈三角形的平行设置的第一面与第二面，以及连接第一面和第二面的第一侧面、第二侧面和第三侧面，所述第一侧面、第二侧面或者第三侧面为所述发光二极管封装件的出光面。
优选的，所述封装壳的所述第一面与第二面呈等腰直角三角形，其中，所述等腰直角三角形的斜边所在的面为所述发光二极管封装件的出光面。
在前述实施例中，优选地，所述发光二极管芯片4的出光方向与所述出光面5相垂直，其中，该出光方向可以为出光光强最大的方向，有利于增大通过所述出光面5的光通量，提高光的利用率。
参看图6所示，为了增强所述发光二极管封装件整体的强度，还可以在所述等腰直角三角形的至少一个直角边所在的平面设有封装壳的加强部20，当将本发明实施中的发光二极管封装件安装到背光模组中的导光板的侧面时，所述的加强部20还有利于对所述发光二极管封装件提供稳定的支撑。优选地，所述加强部20与所述封装壳3为一体结构。
参看图7所示，本发明实施例还提供一种背光模组，包括如上述实施例所述的发光二极管封装件，具体的，该背光模组包括：导光板30，所述导光板30的入光面与所述发光二极管封装件31的出光面相适配；优选的，如图所示，所述导光板包括平行的顶面U和底面D，以及四个侧面S，所述导光板的至少一个侧面S为斜面，并且所述斜面S与所述导光板30的底面D之间的夹角呈锐角；所述导光板的所述斜面S为所述导光板的入光面，所述导光板的所述顶面U为导光板的出光面，所述发光二极管封装件31设置在所述导光板的所述斜面，所述发光二极管封装件的出光方向垂直于所述导光板入光面。
参看图1所示，目前液晶显示背光源结构中，发光二极管（LED）的出光方向与导光板（LGP）的出光方向相互垂直（90°），导光板的出光方向决定了整个液晶显示模组的出光方向。然而，发光二极管光源的朗伯型发光曲线决定了在出光方向光通量占比相对较大，容易在导光板的出光面与发光二极管封装件相接触的位置处形成萤火虫（hotspot）现象。参看图7所示，本发明背光模组实施例中，所述光源的出光方向与导光板的底面D之间的夹角为锐角，即出光方向朝向导光板的底面D入射，一方面反映在导光板的出光面与发光二极管封装件相接触的位置处的光通量相对较小，从而能够减轻hotspot现象；另一方面，能够提高导光板出光方向的光通量，提高光能利用率。图8为本发明背光模组实施例中hotspot现象（小）的示意图；图9为现有技术中hotspot现象（大）的示意图。
在本发明实施例背光模组一实施例中，所述光源31包括发光二极管封装件，参看图4及图5所示，所述发光二极管封装件包括封装壳3和封装在所述封装壳3内部的发光二极管芯片4，所述封装壳3为包括至少一个斜面的多面体，所述封装壳3的其中一个斜面5为所述发光二极管封装件的出光面；所述封装壳3的所述斜面5与所述导光板30侧面的斜面S相配合。
本发明实施例中LED封装件由于封装壳3为包括至少一个斜面的多面体，并且所述封装壳3的其中一个斜面5为所述LED芯片的出光面，这样使得本发明实施例中的LED封装件体积较小，出光面较大。
本发明实施例背光模组中的LED封装件可以采用前述本发明发光二极管封装件任一实施例所述的结构，在此不再赘述。
本发明背光模组实施例中，由于采用三角形LED封装结构，能够实现薄型、窄边框的液晶显示模组结构要求。图10为本发明实施例背光模组结构与现有的背光模组结构对比示意图。看图10所示，其中的结构0为现在结构。在0结构导光板厚度不变的基础上，通过对LED出光面倾角设计，如2结构，能够有效增大LED的出光面积，提高光利用率，同时可以减小整体模组的边缘宽度。在0结构LED出光面不变的基础上，通过LED与LGP的倾角设计，如1结构、3结构，可以实现整体模组薄型化和窄边框的设计要求。在3结构的基础上，在边框厚度可以允许的前提下，可以实现LED结构加厚强化的结构设计，如4结构、5结构。
本发明实施例中，LED封装件由于封装壳为包括至少一个斜面的多面体，并且所述封装壳的其中一个斜面为所述LED芯片的出光面，这样使得本发明实施例中的LED封装件及采用该LED封装件的背光模组的体积较小，出光面较大，同时还能减轻hotspot现象，提高导光板出光方向的光通量，提高光能利用率。
以上所述是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明所述原理的前提下，还可以作出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (10)

1.一种发光二极管封装件，包括封装壳和封装在所述封装壳内部的发光二极管芯片，其特征在于，所述封装壳为包括至少一个斜面的多面体，所述封装壳的其中一个斜面为所述发光二极管封装件的出光面。
2.根据权利要求1所述的发光二极管封装件，其特征在于，所述封装壳包括呈三角形的平行设置的第一面与第二面，以及连接第一面和第二面的第一侧面、第二侧面和第三侧面，所述第一侧面、第二侧面或第三侧面为所述发光二极管封装件的出光面。
3.根据权利要求2所述的发光二极管封装件，其特征在于，所述封装壳的所述第一面与第二面呈等腰直角三角形，其中
所述等腰直角三角形的斜边所在的面为所述发光二极管封装件的出光面。
4.根据权利要求3所述的发光二极管封装件，其特征在于，所述发光二极管芯片的出光方向与所述发光二极管封装件的所述出光面相垂直。
5.根据权利要求4所述的发光二极管封装件，其特征在于，所述等腰直角三角形的至少一个直角边所在的平面设有封装壳的加强部。
6.根据权利要求5所述的发光二极管封装件，其特征在于，所述加强部与所述封装壳为一体结构。
7.一种背光模组，其特征在于，包括如权利要求1-6任一项所述的发光二极管封装件。
8.根据权利要求7所述的背光模组，其特征在于，所述背光模组包括导光板，所述导光板的入光面与所述发光二极管封装件的出光面相适配。
9.根据权利要求8所述的背光模组，其特征在于，所述导光板包括平行的顶面和底面，以及四个侧面，所述导光板的至少一个侧面为斜面，并且所述导光板的所述斜面与所述导光板的所述底面之间的夹角为锐角，所述导光板的所述斜面为所述导光板的入光面，所述导光板的所述顶面为导光板的出光面，所述发光二极管封装件设置在所述导光板的所述斜面，所述发光二极管封装件的出光方向垂直于所述导光板的入光面。
10.一种显示装置，其特征在于，包括如权利要求7-9任一项所述的背光模组。
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