CN204067421U - 层状双体led芯片封装结构 - Google Patents
层状双体led芯片封装结构 Download PDFInfo
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- CN204067421U CN204067421U CN201420416447.2U CN201420416447U CN204067421U CN 204067421 U CN204067421 U CN 204067421U CN 201420416447 U CN201420416447 U CN 201420416447U CN 204067421 U CN204067421 U CN 204067421U
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CN201420416447.2U CN204067421U (zh) | 2014-07-28 | 2014-07-28 | 层状双体led芯片封装结构 |
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CN201420416447.2U CN204067421U (zh) | 2014-07-28 | 2014-07-28 | 层状双体led芯片封装结构 |
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CN204067421U true CN204067421U (zh) | 2014-12-31 |
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CN201420416447.2U Expired - Fee Related CN204067421U (zh) | 2014-07-28 | 2014-07-28 | 层状双体led芯片封装结构 |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information |
Inventor after: Xu Haipeng Inventor after: He Fang Inventor after: Huang Jianbo Inventor after: Lei Junyong Inventor after: Liu Qiuting Inventor after: Rong Chao Inventor after: Tian Qin Inventor before: Xu Haipeng |
|
COR | Change of bibliographic data | ||
C56 | Change in the name or address of the patentee | ||
CP03 | Change of name, title or address |
Address after: 518000, 2, 3 and 5 buildings, E new low carbon technology park, Shenzhen Wood Street, Pinghu District, Longgang District, Guangdong, China Patentee after: Shenzhen Xinguang electronic Polytron Technologies Inc Address before: 2, E building, 518000 Tung Sheng low carbon technology park, Pinghu street, Longgang District, Shenzhen, Guangdong, China Patentee before: SHENZHEN XINGUANGTAI ELECTRONIC TECHNOLOGY CO., LTD. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141231 Termination date: 20200728 |
|
CF01 | Termination of patent right due to non-payment of annual fee |