WO2023178844A1 - 一种新型led封装结构 - Google Patents

一种新型led封装结构 Download PDF

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Publication number
WO2023178844A1
WO2023178844A1 PCT/CN2022/098151 CN2022098151W WO2023178844A1 WO 2023178844 A1 WO2023178844 A1 WO 2023178844A1 CN 2022098151 W CN2022098151 W CN 2022098151W WO 2023178844 A1 WO2023178844 A1 WO 2023178844A1
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Prior art keywords
packaging structure
led
size
rear side
top surface
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PCT/CN2022/098151
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English (en)
French (fr)
Inventor
李鸿渐
李璟
王国宏
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南京阿吉必信息科技有限公司
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Publication of WO2023178844A1 publication Critical patent/WO2023178844A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other

Definitions

  • the present invention relates to the field of LED packaging technology, and in particular to a new type of LED packaging structure.
  • LEDs are widely used in lighting and display fields due to their advantages of energy saving, rich colors, small size, and long life.
  • the luminous wavelength of LEDs can cover the entire visible light band and has important application value, especially in large-scale display applications. irreplaceable position.
  • SMD surface mount structure SMD
  • COB Chip on Board
  • the purpose of this application is to provide a new type of LED packaging structure.
  • the new type of LED packaging structure provided by this application uses an asymmetric packaging structure. When placed, the light-emitting surface and the positive and negative electrodes of the LED can be directly identified from the vibrating table. Mainly based on Judging by the shape and size of the light-emitting surface of the packaging structure, there is no need to tape the LED package, which can reduce the process and cost of manufacturing display screens or lamps.
  • a new type of LED packaging structure including a substrate with an insulating area and first and second bonding wire areas, an LED chip and a fluorescent colloid.
  • the substrate, the LED chip and A packaging structure is provided outside the fluorescent colloid.
  • the packaging structure does not have complete mirror symmetry.
  • the packaging structure has at least six faces. At least one of all the faces of the packaging structure has a shape that is not square or rectangular. .
  • This application uses an asymmetric packaging structure.
  • the light-emitting surface and positive and negative electrodes of the LED can be directly identified from the vibrating table.
  • the judgment is mainly based on the shape and size of the light-emitting surface of the packaging structure.
  • At least one of all faces of the packaging structure is trapezoidal in shape.
  • the packaging structure includes a top surface, a bottom surface, a left side, a right side, a front side and a rear side, and the top surface, the bottom surface, the left side, the right side, the
  • the shape of the front side and the rear side is an isosceles trapezoid, the left side, the right side, the front side and the rear side are connected end to end, the left side is connected to the rear side, and the top surface Different from the dimensions of the bottom surface, the dimensions of the left side, the right side and the rear side are different.
  • This kind of design can directly identify the light-emitting surface of the LED according to the shape of each surface during the packaging process. It can also determine the positive and negative electrodes of the LED based on the length of each side of the light-emitting surface. There is no need to tape the LED package, which reduces application Product manufacturing processes and costs.
  • the size of the top surface is larger than the size of the bottom surface, and the size of the left side is smaller than the size of the right side.
  • the packaging structure includes a top surface, a bottom surface, a left side, a right side, a front side and a rear side, and the top surface, the bottom surface, the left side, the right side, the The shape of the front side and the rear side is a right-angled trapezoid, the left side, the right side, the front side and the rear side are connected end to end, the left side is connected to the rear side, and the top surface and The size of the bottom surface is different, and the size of the left side, the right side, the front side and the rear side are different.
  • This kind of design can also directly identify the light-emitting surface of the LED according to the shape of each surface during the packaging process, and judge the positive and negative electrodes of the LED according to the length of each side of the light-emitting surface. There is no need to tape the LED package, which reduces the manufacturing of application products. processes and costs.
  • the size of the top surface is larger than the size of the bottom surface
  • the size of the left side is smaller than the size of the right side
  • the size of the front side is smaller than the size of the rear side.
  • the shape of the packaging structure is a truncated cuboid.
  • the advantage of this design is that it is easy to identify and thus easy to use.
  • one or more LED chips are placed in the packaging structure.
  • At least one of the surfaces of the packaging structure is transparent.
  • an asymmetric packaging structure is used.
  • the light-emitting surface and the positive and negative electrodes of the LED can be directly identified on the vibrating table, mainly based on the shape and size of the light-emitting surface of the packaging structure.
  • Taping LED packages can reduce the manufacturing process and cost of display screens or lamps, making them easier to use.
  • Figure 1 is a perspective view of an LED packaging structure with an asymmetric shape in Embodiment 1;
  • Figure 2 is a plan view of the top surface a2 in Embodiment 1;
  • Figure 3 is a plan view of bottom surface b2 in Embodiment 1;
  • Figure 4 is a plan view of the left side c2 in Embodiment 1;
  • Figure 5 is a plan view of the right side d2 in Embodiment 1;
  • Figure 6 is a plan view of the front side e 2 and the rear side f 2 in Embodiment 1;
  • Figure 7 is a perspective view of an LED packaging structure with an asymmetric shape in Embodiment 2;
  • Figure 8 is a plan view of the top surface a3 in Embodiment 2;
  • Figure 9 is a plan view of the bottom surface b3 in Embodiment 2.
  • Figure 10 is a plan view of the left side c3 in Embodiment 2;
  • Figure 11 is a plan view of the right side d3 in Embodiment 2;
  • Figure 12 is a plan view of the front side e3 in Embodiment 2;
  • Figure 13 is a plan view of the rear side f3 in Embodiment 2;
  • Figure 14 is a perspective view of an LED packaging structure with an asymmetric shape in Embodiment 3;
  • Figure 15 is a diagram of the bottom surface of the truncated packaging structure in Embodiment 3.
  • Figure 16 is a perspective view of a traditional LED packaging structure.
  • the present invention provides a new type of LED packaging structure, including a substrate with an insulating area and first and second bonding wire areas, an LED chip and a fluorescent colloid.
  • the substrate, LED chip and fluorescent colloid There is an encapsulation structure on the outside.
  • the encapsulation structure does not have complete mirror symmetry.
  • the encapsulation structure has at least six sides. At least one of all the faces of the encapsulation structure has a shape that is not square or rectangular.
  • the packaging structure provided outside the substrate, LED chip and fluorescent colloid does not have complete mirror symmetry.
  • the LED can be directly identified from the vibration table when placed.
  • the light-emitting surface and positive and negative electrodes are mainly judged based on the shape and size of the light-emitting surface of the packaging structure. There is no need to tape the LED package, which can reduce the process and cost of manufacturing display screens or lamps.
  • the above-mentioned new LED packaging structure refers to the overall structure of the surface-mounted LED package, while the above-mentioned packaging structure provided outside the substrate, LED chip and fluorescent colloid refers to the package that wraps the substrate, LED chip and fluorescent colloid. case.
  • the above-mentioned new LED packaging structure includes a substrate.
  • the substrate has a first bonding wire area, a second bonding wire area, and an insulating area other than the first bonding wire area and the second bonding wire area.
  • the substrate has There is an LED chip A 2 on one side, and the positive electrode and the negative electrode are connected to the other side of the substrate.
  • the positive electrode B 2 and the negative electrode C 2 are respectively connected to the first bonding wire area and the second bonding wire area of the substrate to realize the LED chip A 2 to emit light, the fluorescent colloid is wrapped around the substrate and the LED chip, and the packaging structure is set outside the fluorescent colloid to package the LED chip.
  • the positive electrode B 2 and the negative electrode C 2 need to be exposed on the surface of the packaging structure.
  • the material of the first bonding wire area and the second bonding wire area of the substrate may be one or more of copper, aluminum, iron or alloy materials, and the material of the insulating area of the substrate may be resin, silica gel or ceramic material, specifically
  • the materials of the first bonding wire area, the second bonding wire area and the insulation area are not limited here and can be selected according to actual conditions.
  • one or more LED chips can be placed in the packaging structure.
  • the colors of the multiple LED chips can be one color or a combination of multiple different colors.
  • the faces of the packaging structure may be transparent.
  • the transparent side of the packaging structure can be the light-emitting surface of the new LED packaging structure.
  • the surface of the packaging structure opposite to the LED chip can be set as a transparent surface, and the surface of the packaging structure opposite to the LED chip can be a light-emitting surface (light-emitting surface).
  • multiple surfaces of the package structure can be transparent or all surfaces can be transparent. In this way, multiple surfaces can be light-emitting surfaces, and the light-emitting surface, positive and negative electrodes of the LED package structure can also be identified by observing the internal structure.
  • At least one of all faces of the packaging structure can be trapezoidal in shape, which can prevent the packaging structure from having complete mirror symmetry, and can directionally distinguish the light-emitting surface and the positive and negative electrodes of the LED packaging structure.
  • the packaging structure may include a top surface a 2 , a bottom surface b 2 , a left side c 2 , a right side d 2 , a front side e 2 and a rear side.
  • top surface a 2 , the bottom surface b 2 , the left side c 2 , the right side d 2 , the front side e 2 and the rear side f 2 can all be in the shape of an isosceles trapezoid, and the left side c 2 ,
  • the right side d 2 , the front side e 2 and the rear side f 2 are connected end to end, and the left side c 2 is connected to the rear side d 2 , that is, the left side, front side, right side and rear side shown in Figure 1
  • the side surfaces are connected end to end to form a circle.
  • the dimensions of the top surface a 2 and the bottom surface b 2 can be different.
  • the dimensions of the left side c 2 , the right side d 2 and the rear side f 2 can be different. This kind of design can directly identify the light-emitting surface of the LED according to the shape of each surface during the packaging process. It can also determine the positive and negative electrodes of the LED based on the length of each side of the light-emitting surface. There is no need to tape the LED package, which reduces application Product manufacturing processes and costs.
  • the size of the above-mentioned top surface a 2 can be larger than the size of the bottom surface b 2.
  • the four sides of the top surface a 2 The lengths can be 2.0mm, 3.5mm, 2.8mm and 3.5mm respectively.
  • the lengths of the four sides of bottom surface b 2 can be 1.8mm, 3.0mm, 2.3mm and 3.0mm respectively.
  • the area of top surface a 2 is larger than that of bottom surface b.
  • the size of the top surface a 2 is greater than the size of the bottom surface b 2 ;
  • the size of the left side c 2 can be smaller than the size of the right side d 2 , for example, as shown in Figures 4 and 5, the left side c
  • the side lengths of the four sides of 2 can be 1.5mm, 2.0mm, 1.5mm, and 1.8mm respectively.
  • the side lengths of the four sides of the right side d2 can be 1.5mm, 2.8mm, 1.5mm, and 2.3mm respectively.
  • the area of the left side c 2 is smaller than the area of the right side d 2 , that is, the size of the left side c 2 is smaller than the size of the right side d 2 .
  • the shape and size of the front side e 2 and the rear side f 2 can be the same.
  • the side lengths of the four sides of the front side e 2 and the rear side f 2 can be 1.5mm, 3.5mm, 1.5mm, 3.0mm, the areas of the front side e2 and the rear side f2 are the same, that is, the dimensions of the front side e2 and the rear side f2 are the same.
  • a new LED packaging structure as shown in Figure 7 may include a substrate with an insulating area and first and second bonding wire areas, as well as LED chip A 3 , positive electrode B 3 and negative electrode C 3 , the outer It is wrapped with fluorescent colloid, and a packaging structure is set outside the fluorescent colloid.
  • the packaging structure may include a top surface a 3 , a bottom surface b 3 , a left side c 3 , a right side d 3 , a front side e 3 and a rear side f 3 .
  • the shapes of c 3 , right side d 3 , front side e 3 and rear side f 3 can all be right-angled trapezoids, and the left side c 3 , right side d 3 , front side e 3 and rear side f 3 are connected end to end.
  • the left side c 3 is connected to the rear side d 3 , that is, the left side c 3 , the front side e 3 , the right side d 3 and the rear side f 3 shown in Figure 7 are connected end to end to form a circle.
  • the dimensions of the top surface a 2 and the bottom surface b 2 may be different, and the dimensions of the left side c 3 , the right side d 3 , the front side 3 and the rear side f 3 may be different.
  • This kind of design can also directly identify the light-emitting surface of the LED according to the shape of each surface during the packaging process, and judge the positive and negative electrodes of the LED according to the length of each side of the light-emitting surface. There is no need to tape the LED package, which reduces the manufacturing of application products. processes and costs.
  • the size of the top surface a3 can be larger than the size of the bottom surface b3 .
  • the side lengths of the four sides of the top surface a3 can be 2.3mm respectively. , 4.0mm, 2.8mm, 3.5mm.
  • the side lengths of the four sides of bottom surface b 3 can be 2.0mm, 3.5mm, 2.3mm, 3.0mm respectively.
  • the area of top surface a 3 is greater than the area of bottom surface b 3 , that is, the top surface
  • the size of surface a 3 is larger than the size of bottom surface b 3 ; the size of left side c 3 can be smaller than the size of right side d 3.
  • the four sides of left side c 3 The side lengths can be 1.8mm, 2.3mm, 1.5mm, and 2.0mm respectively.
  • the side lengths of the four sides of the right side d3 can be 1.7mm, 2.8mm, 2.0mm, and 2.3mm respectively.
  • the side lengths of the left side c3 The area is smaller than the area of the right side d3 , that is, the size of the left side c3 is smaller than the size of the right side d3 ; the size of the front side e3 is smaller than the size of the rear side f3 , for example, as shown in Figures 12 and 13 , the side lengths of the four sides of the front side e 3 can be 1.5mm, 3.5mm, 1.7mm, and 3.0mm respectively, and the side lengths of the four sides of the back side f 3 can be respectively 1.8mm, 4.0mm, 2.0mm, 3.5mm, the area of the front side e 3 is smaller than the area of the rear side f 3 , that is, the size of the front side e 3 is larger than the size of the rear side f 3 .
  • the new LED packaging structure as shown in Figure 14 can include a substrate with an insulating area and first and second bonding wire areas, as well as LED chip A 4 , positive electrode B 4 and negative electrode C 4 , and the outside is wrapped with fluorescent colloid, a packaging structure is set outside the fluorescent colloid.
  • the shape of the packaging structure may be a truncated rectangular parallelepiped. The advantage of this design is that it is easy to identify and thus easy to use.
  • Figure 15 shows a schematic structural diagram of the bottom surface of the packaging structure in Figure 14.
  • Figure 16 shows a schematic diagram of the LED package structure in the prior art, including a substrate with an insulating area and first and second bonding wire areas, as well as LED chip A 4 , anode B 4 and cathode C 4 , with a phosphor wrapped outside
  • a packaging structure is set outside the colloid and fluorescent colloid.
  • the shape of the packaging structure is a rectangular parallelepiped. Compared with the shape of the packaging structure in Figure 16, the shape of the new LED packaging structure provided in Figure 14 makes it easier to identify the glossy surface and the positive and negative electrodes.
  • the top surface of the above-mentioned packaging structure can be the surface of the packaging structure opposite to the LED chip, and the bottom surface is the surface exposing the positive electrode and the negative electrode.
  • the top surface and the bottom surface are arranged oppositely, and the left side, right side, front side and rear side are located at Between the top surface and the bottom surface, the left side and the right side are arranged oppositely, and the front side and the rear side are arranged oppositely.
  • the new LED packaging structure provided in this application can have the following implementation modes:
  • a new type of LED packaging structure including a substrate with an insulating area and first and second bonding wire areas, an LED chip and fluorescent colloid.
  • the material of the first and second bonding wire areas of the substrate can be copper, aluminum, iron or alloy materials. One or more of them.
  • the material of the insulating area of the substrate can be resin, silica gel or ceramic material.
  • a packaging structure is provided outside the substrate, LED chip and fluorescent colloid. The packaging structure does not have complete mirror symmetry.
  • the packaging structure has at least six The shape of at least one of all the faces of the packaging structure is not square or rectangular, and the shape of at least one of all the faces of the packaging structure is trapezoid; one or more LED cores can be placed in the packaging structure, and multiple LEDs The color of the chip can be one color or a combination of multiple different colors; at least one of the faces of the packaging structure must be transparent.
  • This application uses an asymmetric packaging structure.
  • the light-emitting surface and positive and negative electrodes of the LED can be directly identified from the vibrating table.
  • the judgment is mainly based on the shape and size of the light-emitting surface of the packaging structure.
  • the package structure includes a top surface a 2 , a bottom surface b 2 , a left side c 2 , a right side d 2 , a front side e 2 and a rear side f 2 .
  • the shapes of the left side c 2 , right side d 2 , front side e 2 and back side f 2 are all isosceles trapezoids, and the left side c 2 , right side d 2 , front side e 2 and back side f 2 Connected end to end, the left side c 2 is connected to the back side f 2 , the top side a 2 and the bottom side b 2 are different in size, the left side c 2 , the right side d 2 and the back side f 2 are different in size.
  • This kind of design can directly identify the light-emitting surface of the LED according to the shape of each surface during the packaging process. It can also determine the positive and negative electrodes of the LED based on the length of each side of the light-emitting surface. There is no need to tape the LED package, which reduces application Product manufacturing processes and costs.
  • the packaging structure includes a top surface a3, a bottom surface b3 , a left side c3 , a right side d3 , a front side e3 and a rear side f3 .
  • the shapes of the top surface a 3 , the bottom surface b 3 , the left side c 3 , the right side d 3 , the front side e 3 and the rear side f 3 are all right-angled trapezoids.
  • the left side c 3 , the right side d 3 , the front side The side e 3 and the back side f 3 are connected end to end, the left side c 3 is connected to the back side f 3 , the top side a 3 and the bottom side b 3 are different in size, the left side c 3 , the right side d 3 , and the front side e 3 and rear side f 3 are different in size.
  • This kind of design can also directly identify the light-emitting surface of the LED according to the shape of each surface during the packaging process, and judge the positive and negative electrodes of the LED according to the length of each side of the light-emitting surface. There is no need to tape the LED package, which reduces the manufacturing of application products. processes and costs.
  • the shape of the packaging structure is a truncated rectangular parallelepiped.
  • the advantage of this design is that it is easy to identify and thus easy to use.

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  • Microelectronics & Electronic Packaging (AREA)
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Abstract

本发明公开了一种新型LED封装结构，涉及到LED封装技术领域，包括带有绝缘区域和第一、二焊线区域的基板、LED芯片及荧光胶体，所述基板、所述LED芯片及所述荧光胶体外设置有封装结构，所述封装结构不具有完全的镜面对称性，所述封装结构至少有六个面，所述封装结构的所有面中至少有一个面的形状不是正方形或者长方形，所述封装结构内可以放置一个或者多个LED芯片。本申请提供的新型LED封装结构使用非对称封装结构，其在安放时可以直接从振动台上辨别LED的出光面和正负极，主要根据封装结构的出光面的形状大小来判断，不用对LED封装进行编带，可以缩减显示屏或者灯具制造的流程和成本。

Description

一种新型LED封装结构
相关申请的交叉引用
本申请要求在2022年03月24日提交中国专利局、申请号为202210302194.5、申请名称为“一种新型LED封装结构”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及LED封装技术领域，特别涉及一种新型LED封装结构。
背景技术
LED以其节能、色彩丰富、体积小、寿命长等优点，在照明和显示领域得到广泛应用，LED的发光波长可以覆盖整个可见光波段，具有重要的应用价值，特别是在大型显示屏应用中具有不可替代的地位。
目前行业中常用的LED封装形式主要有直插式、表贴式(SMD)及COB(Chip on Board)，随着封装设备的进步，表面贴装结构SMD已成为LED封装形式的主流技术，如图4所示，传统的SMD封装体一般是长方体或者正方体，这种封装形式制造时加工模具比较简单，但使用时不容易判断出光面和电极正负，因此需要精确编带，安放到编带中固定位置的凹陷中，以便于贴装时用机械吸嘴选取贴装，这一过程增加了显示屏或者灯具制造时的复杂性和成本，为此我们提出了一种新型LED封装结构。
发明内容
本申请的目的在于提供一种新型LED封装结构，本申请提供的一种新型LED封装结构中使用非对称封装结构，其在安放时可以直接从振动台上辨别LED的出光面和正负极，主要根据封装结构的出光面的形状大小来判断，不用对LED封装进行编带，可以缩减显示屏或者灯具制造的流程和成本。
为实现上述目的，本申请提供如下技术方案：一种新型LED封装结构，包括带有绝缘区域和第一、二焊线区域的基板、LED芯片及荧光胶体，所述基板、所述LED芯片及所述荧光胶体外设置有封装结构，所述封装结构不具有完全的镜面对称性，所述封装结构至少有六个面，所述封装结构的所有面中至少有一个面的形状不是正方形或者长方形。
本申请使用非对称封装结构，其在安放时可以直接从振动台上辨别LED的出光面和正负极，主要根据封装结构的出光面的形状大小来判断，不用对LED封装进行编带，可以缩减显示屏或者灯具制造的流程和成本。
优选地，所述封装结构的所有面中至少有一个面的形状为梯形。
优选的，所述封装结构包括顶面、底面、左侧面、右侧面、前侧面和后侧面，所述顶面、所述底面、所述左侧面、所述右侧面、所述前侧面和所述后侧面的形状均为等腰梯形，所述左侧面、右侧面、前侧面和后侧面首尾依次连接，所述左侧面与所述后侧面连接，所述顶面和所述底面的尺寸不同，所述左侧面、所述右侧面和所述后侧面的尺寸不同。这样的设计在封装流程中可以根据各面的形状可以直接辨别LED的出光面，也可以根据出光面各边长的大小来判断LED的正负极，不用对LED封装体进行编带，减少应用产品制造的流程和成本。
优选地，所述顶面的尺寸大于所述底面的尺寸，所述左侧面的尺寸小于所述右侧面的尺寸。
优选的，所述封装结构包括顶面、底面、左侧面、右侧面、前侧面和后侧面，所述顶面、所述底面、所述左侧面、所述右侧面、所述前侧面和所述后侧面的形状均为直角梯形，所述左侧面、右侧面、前侧面和后侧面首尾依次连接，所述左侧面与所述后侧面连接，所述顶面和所述底面的尺寸不同，所述左侧面、所述右侧面、所述前侧面和所述后侧面的尺寸不同。这样的设计在封装流程中也可以根据各面的形状直接辨别LED的出光面，根据出光面各边长的大小来判断LED的正负极，不用对LED封装体进行编带，减少应用产品制造的流程和成本。
优选地，所述顶面的尺寸大于所述底面的尺寸，所述左侧面的尺寸小于所述右侧面的尺寸，所述前侧面的尺寸小于所述后侧面的尺寸。
优选的，所述封装结构的形状为截角长方体。这样设计的好处是，便于进行识别，从而便于使用。
优选的，所述封装结构内放置一个或者多个LED芯片。
优选的，所述封装结构的面中至少有一个面是透明设置。
综上，本发明的技术效果和优点：
本申请提供的一种新型LED封装结构中，使用非对称封装结构，其在安放时可以直接从振动台上辨别LED的出光面和正负极，主要根据封装结构的出光面的形状大小来判断，不用对LED封装进行编带，可以缩减显示屏或者灯具制造的流程和成本，从而便于使用。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是实施例1中一种具有非对称形状的LED封装结构的立体图；
图2为实施例1中顶面a 2的平面图；
图3为实施例1中底面b 2的平面图；
图4为实施例1中左侧面c 2的平面图；
图5为实施例1中右侧面d 2的平面图；
图6为实施例1中前侧面e 2、后侧面f 2的平面图；
图7是实施例2中一种具有非对称形状的LED封装结构的立体图；
图8为实施例2中顶面a 3的平面图；
图9为实施例2中底面b 3的平面图；
图10为实施例2中左侧面c 3的平面图；
图11为实施例2中右侧面d 3的平面图；
图12为实施例2中前侧面e 3的平面图；
图13为实施例2中后侧面f 3的平面图；
图14是实施例3中一种具有非对称形状的LED封装结构的立体图；
图15为实施例3中截角封装结构底面的图形；
图16是传统LED封装结构的立体图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参考图1、图7和图14，本发明提供一种新型LED封装结构，包括带有绝缘区域和第一、二焊线区域的基板、LED芯片及荧光胶体，基板、LED芯片及荧光胶体外设置有封装结构，封装结构不具有完全的镜面对称性，封装结构至少有六个面，封装结构的所有面中至少有一个面的形状不是正方形或者长方形。
本申请提供的新型LED封装结构中，设置于基板、LED芯片和荧光胶体之外的封装结构不具有完全的镜面对称性，使用非对称封装结构，在安放时可以直接从振动台上辨别LED的出光面和正负极，主要根据封装结构的出光面的形状大小来判断，不用对LED封装进行编带，可以缩减显示屏或者灯具制造的流程和成本。
需要说明的，上述新型LED封装结构指的是表面贴装式LED封装的整体结构，而上述设置于基板、LED芯片和荧光胶体外的封装结构指的是包裹基板、LED芯片和荧光胶体的封装壳体。
具体地，如图1所示，上述新型LED封装结构中包括基板，基板具有第一焊线区域、第二焊线区域以及第一焊线区域和第二焊线区域以外的绝缘区 域，基板的一侧具有LED芯片A 2，而基板的另一侧连接有正极和负极，正极B 2和负极C 2分别与基板的第一焊线区域和第二焊线区连接，以能实现LED芯片A 2发光，荧光胶体包裹于基板和LED芯片外部，封装结构设置于荧光胶体的外部，以对LED芯片进行封装，正极B 2和负极C 2需要露出封装结构的表面。
其中，基板的第一焊线区域和第二焊线区域的材料可以是铜、铝、铁或者合金材料的一种或者几种，基板的绝缘区域的材料可以是树脂、硅胶或者陶瓷材料，具体第一焊线区域、第二焊线区域以及绝缘区域的材料在这里可以不做限制，可以根据实际情况选择。
其中，封装结构内可以放置一个或者多个LED芯片。当封装结构中放置多个LED芯片时，多个LED芯片的颜色可以是一种颜色，也可以是多种不同颜色的组合。
其中，封装结构的面中可以至少有一个面是透明设置。封装结构透明设置的那一面可以为新型LED封装结构的出光面。具体地，可以将封装结构中与LED芯片相对的面设置为透明面，封装结构中与LED芯片相对的面为出光面(发光面)。或者，封装结构中可以多个面为透明设置或者全部面为透明设置，这样多个面可以为出光面，还能够通过观察内部结构来辨别LED封装结构的出光面和正、负极。
上述新型LED封装结构中，封装结构的所有面中可以至少有一个面的形状为梯形，能够使得封装结构不具有完全的镜面对称性，可以方向区分LED封装结构的出光面和正负极。
可选地，如图1所示的一种新型LED封装结构中，封装结构可以包括顶面a 2、底面b 2、左侧面c 2、右侧面d 2、前侧面e 2和后侧面f 2，其中，顶面a 2、底面b 2、左侧面c 2、右侧面d 2、前侧面e 2和后侧面f 2的形状均可以为等腰梯形，左侧面c 2、右侧面d 2、前侧面e 2和后侧面f 2首尾依次连接，左侧面c 2与后侧面d 2连接，即图1中所示的左侧面、前侧面、右侧面和后侧面首尾依次相接围成一圈，顶面a 2和底面b 2的尺寸可以不同，左侧面c 2、右侧面d 2和后 侧面f 2的尺寸可以不同。这样的设计在封装流程中可以根据各面的形状可以直接辨别LED的出光面，也可以根据出光面各边长的大小来判断LED的正负极，不用对LED封装体进行编带，减少应用产品制造的流程和成本。
具体地，为了判断LED的封装结构的正极和负极，上述顶面a 2的尺寸可以大于底面b 2的尺寸，例如，如图2和图3所示，顶面a 2的4个边的边长可以分别为2.0mm、3.5mm、2.8mm以及3.5mm，底面b 2的4个边的边长可以分别为1.8mm、3.0mm、2.3mm以及3.0mm，顶面a 2的面积大于底面b 2的面积，即顶面a 2的尺寸大于底面b 2的尺寸；左侧面c 2的尺寸可以小于右侧面d 2的尺寸，例如，如图4和图5所示，左侧面c 2的4个边的边长可以分别为1.5mm、2.0mm、1.5mm、1.8mm，右侧面d 2的4个边的边长可以为分别为1.5mm、2.8mm、1.5mm、2.3mm，左侧面c 2的面积小于右侧面d 2的面积，即左侧面c 2的尺寸小于右侧面d 2的尺寸。而前侧面e 2和后侧面f 2的形状与尺寸可以相同，例如，如图6所示，前侧面e 2和后侧面f 2的四个边的边长可以分别为1.5mm、3.5mm、1.5mm、3.0mm，前侧面e 2和后侧面f 2的面积相同，即前侧面e 2和后侧面f 2的尺寸相同。
可选地，如图7所示的一种新型LED封装结构中，可以包括带有绝缘区域和第一、二焊线区域的基板、以及LED芯片A 3、正极B 3和负极C 3，外侧包裹有荧光胶体，荧光胶体外侧设置封装结构。具体地，封装结构可以包括顶面a 3、底面b 3、左侧面c 3、右侧面d 3、前侧面e 3和后侧面f 3，顶面a 3、底面b 3、左侧面c 3、右侧面d 3、前侧面e 3和后侧面f 3的形状可以均为直角梯形，左侧面c 3、右侧面d 3、前侧面e 3和后侧面f 3首尾依次连接，左侧面c 3与后侧面d 3连接，即图7中所示的左侧面c 3、前侧面e 3、右侧面d 3和后侧面f 3首尾依次相接围成一圈，顶面a 2和底面b 2的尺寸可以不同，左侧面c 3、右侧面d 3、前侧面3和后侧面f 3的尺寸可以不同。这样的设计在封装流程中也可以根据各面的形状直接辨别LED的出光面，根据出光面各边长的大小来判断LED的正负极，不用对LED封装体进行编带，减少应用产品制造的流程和成本。
具体地，如图7所示，顶面a 3的尺寸可以大于底面b 3的尺寸，例如，如 图8和图9所示，顶面a 3的4个边的边长可以分别为2.3mm、4.0mm、2.8mm、3.5mm，底面b 3的4个边的边长可以分别为2.0mm、3.5mm、2.3mm、3.0mm，顶面a 3的面积大于底面b 3的面积，即顶面a 3的尺寸大于底面b 3的尺寸；左侧面c 3的尺寸可以小于右侧面d 3的尺寸，例如，如图10和图11所示，左侧面c 3的4个边的边长可以分别为1.8mm、2.3mm、1.5mm、2.0mm，右侧面d 3的4个边的边长可以分别为1.7mm、2.8mm、2.0mm、2.3mm，左侧面c 3的面积小于右侧面d 3的面积，即左侧面c 3的尺寸小于右侧面d 3的尺寸；前侧面e 3的尺寸小于后侧面f 3的尺寸，例如，如图12和13所示，前侧面e 3的4个边的边长可以分别为1.5mm、3.5mm、1.7mm、3.0mm，后侧面f 3的4个边的边长可以分别为1.8mm、4.0mm、2.0mm、3.5mm，前侧面e 3的面积小于后侧面f 3的面积，即前侧面e 3的尺寸大于后侧面f 3的尺寸。
可选地，如图14所示的新型LED封装结构，可以包括带有绝缘区域和第一、二焊线区域的基板、以及LED芯片A 4、正极B 4和负极C 4，外侧包裹有荧光胶体，荧光胶体外侧设置封装结构。封装结构的形状可以为截角长方体。这样设计的好处是，便于进行识别，从而便于使用，图15所示为图14中封装结构底面的结构示意图。如图16所示为现有技术中的LED封装结构示意图，包括带有绝缘区域和第一、二焊线区域的基板、以及LED芯片A 4、正极B 4和负极C 4，外侧包裹有荧光胶体，荧光胶体外侧设置封装结构，封装结构的形状为长方体，图14中提供的新型LED封装结构的形状与图16中封装结构的形状相比，更易于识别出光面和正负极。
其中，上述封装结构的顶面可以为封装结构与LED芯片相对的面，而底面为露出正极和负极的面，顶面和底面相对设置，左侧面、右侧面、前侧面和后侧面位于顶面与底面之间，左侧面与右侧面相对设置，前侧面和后侧面相对设置。
具体地，本申请中提供的新型LED封装结构可以具有以下实施方式：
实施例一
一种新型LED封装结构，包括带有绝缘区域和第一、二焊线区域的基板、 LED芯片及荧光胶体，基板的第一、二焊线区域的材料可以是铜、铝、铁或者合金材料的一种或者几种，基板的绝缘区域的材料可以是树脂、硅胶或者陶瓷材料，基板、LED芯片及荧光胶体外设置有封装结构，封装结构不具有完全的镜面对称性，封装结构至少有六个面，封装结构的所有面中至少有一个面的形状不是正方形或者长方形，封装结构的所有面中至少有一个面的形状为梯形；封装结构内可以放置一个或者多个LED芯，多个LED芯片的颜色可以是一种颜色，也可以是多种不同颜色的组合；封装结构的面中至少有一个面是透明设置。
本申请使用非对称封装结构，其在安放时可以直接从振动台上辨别LED的出光面和正负极，主要根据封装结构的出光面的形状大小来判断，不用对LED封装进行编带，可以缩减显示屏或者灯具制造的流程和成本。
参考图1至图6，封装结构包括顶面a 2、底面b 2、左侧面c 2、右侧面d 2、前侧面e 2和后侧面f 2，顶面a 2、底面b 2、左侧面c 2、右侧面d 2、前侧面e 2和后侧面f 2的形状均为等腰梯形，左侧面c 2、右侧面d 2、前侧面e 2和后侧面f 2首尾依次连接，左侧面c 2与后侧面f 2连接，顶面a 2和底面b 2的尺寸不同，左侧面c 2、右侧面d 2和后侧面f 2的尺寸不同。这样的设计在封装流程中可以根据各面的形状可以直接辨别LED的出光面，也可以根据出光面各边长的大小来判断LED的正负极，不用对LED封装体进行编带，减少应用产品制造的流程和成本。
实施例二
与实施例1不同的是，参考图7至图13所示，封装结构包括顶面a3、底面b 3、左侧面c 3、右侧面d 3、前侧面e 3和后侧面f 3，顶面a 3、底面b 3、左侧面c 3、右侧面d 3、前侧面e 3和后侧面f 3的形状均为直角梯形，左侧面c 3、右侧面d 3、前侧面e 3和后侧面f 3首尾依次连接，左侧面c 3与后侧面f 3连接，顶面a 3和底面b 3的尺寸不同，左侧面c 3、右侧面d 3、前侧面e 3和后侧面f 3的尺寸不同。这样的设计在封装流程中也可以根据各面的形状直接辨别LED的出光面，根据出光面各边长的大小来判断LED的正负极，不用对LED封装体进 行编带，减少应用产品制造的流程和成本。
实施例三
与实施例1不同的是，参考图14和图15所示，封装结构的形状为截角长方体。这样设计的好处是，便于进行识别，从而便于使用。
最后应说明的是：以上仅为本发明的优选实施例而已，并不用于限制本发明，尽管参照前述实施例对本发明进行了详细的说明，对于本领域的技术人员来说，其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (9)

  1. 一种新型LED封装结构，包括带有绝缘区域和第一、二焊线区域的基板、LED芯片及荧光胶体，其特征在于：所述基板、所述LED芯片及所述荧光胶体外设置有封装结构，所述封装结构不具有完全的镜面对称性，所述封装结构至少有六个面，所述封装结构的所有面中至少有一个面的形状不是正方形或者长方形。
  2. 根据权利要求1所述的一种新型LED封装结构，其特征在于，所述封装结构的所有面中至少有一个面的形状为梯形。
  3. 根据权利要求2所述的一种新型LED封装结构，其特征在于：所述封装结构包括顶面、底面、左侧面、右侧面、前侧面和后侧面，所述顶面、所述底面、所述左侧面、所述右侧面、所述前侧面和所述后侧面的形状均为等腰梯形，所述左侧面、右侧面、前侧面和后侧面首尾依次连接，所述左侧面与所述后侧面连接，所述顶面和所述底面的尺寸不同，所述左侧面、所述右侧面和所述后侧面的尺寸不同。
  4. 根据权利要求3所述的一种新型LED封装结构，其特征在于：所述顶面的尺寸大于所述底面的尺寸，所述左侧面的尺寸小于所述右侧面的尺寸。
  5. 根据权利要求2所述的一种新型LED封装结构，其特征在于：所述封装结构包括顶面、底面、左侧面、右侧面、前侧面和后侧面，所述顶面、所述底面、所述左侧面、所述右侧面、所述前侧面和所述后侧面的形状均为直角梯形，所述左侧面、右侧面、前侧面和后侧面首尾依次连接，所述左侧面与所述后侧面连接，所述顶面和所述底面的尺寸不同，所述左侧面、所述右侧面、所述前侧面和所述后侧面的尺寸不同。
  6. 根据权利要求5所述的一种新型LED封装结构，其特征在于：所述顶面的尺寸大于所述底面的尺寸，所述左侧面的尺寸小于所述右侧面的尺寸，所述前侧面的尺寸小于所述后侧面的尺寸。
  7. 根据权利要求1所述的一种新型LED封装结构，其特征在于：所述 封装结构的形状为截角长方体。
  8. 根据权利要求1-7任一项所述的一种新型LED封装结构，其特征在于：所述封装结构内放置一个或者多个LED芯片。
  9. 根据权利要求1-7任一项所述的一种新型LED封装结构，其特征在于：所述封装结构的面中至少有一个面是透明设置。
PCT/CN2022/098151 2022-03-24 2022-06-10 一种新型led封装结构 WO2023178844A1 (zh)

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