CN104518069B - 一种红色荧光胶固晶led灯丝 - Google Patents
一种红色荧光胶固晶led灯丝 Download PDFInfo
- Publication number
- CN104518069B CN104518069B CN201410649547.4A CN201410649547A CN104518069B CN 104518069 B CN104518069 B CN 104518069B CN 201410649547 A CN201410649547 A CN 201410649547A CN 104518069 B CN104518069 B CN 104518069B
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- Prior art keywords
- substrate
- led chip
- adhesive layer
- led
- filament
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000003292 glue Substances 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 239000012790 adhesive layer Substances 0.000 claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000010410 layer Substances 0.000 claims abstract description 16
- 238000007788 roughening Methods 0.000 claims description 8
- 238000004020 luminiscence type Methods 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 abstract description 5
- 230000008901 benefit Effects 0.000 abstract description 2
- 239000006185 dispersion Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000001976 improved effect Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000009877 rendering Methods 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 238000012356 Product development Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410649547.4A CN104518069B (zh) | 2014-11-14 | 2014-11-14 | 一种红色荧光胶固晶led灯丝 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410649547.4A CN104518069B (zh) | 2014-11-14 | 2014-11-14 | 一种红色荧光胶固晶led灯丝 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104518069A CN104518069A (zh) | 2015-04-15 |
CN104518069B true CN104518069B (zh) | 2017-08-25 |
Family
ID=52793068
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410649547.4A Active CN104518069B (zh) | 2014-11-14 | 2014-11-14 | 一种红色荧光胶固晶led灯丝 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104518069B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107516707A (zh) * | 2017-08-11 | 2017-12-26 | 安徽新瑞重工股份有限公司 | 一种点胶工艺 |
CN109713106A (zh) * | 2018-11-15 | 2019-05-03 | 浙江英特来光电科技有限公司 | 一种led光源及其点胶方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201985162U (zh) * | 2011-01-04 | 2011-09-21 | 鹤山市银雨照明有限公司 | 一种led封装固晶结构 |
CN103762293A (zh) * | 2014-01-20 | 2014-04-30 | 江苏华英光宝科技股份有限公司 | 强力结合式透明多角度发光led灯条及其制备方法 |
CN104078548A (zh) * | 2013-03-29 | 2014-10-01 | 易美芯光(北京)科技有限公司 | 一种全角度发光led白光光源及其制造方法 |
CN204271125U (zh) * | 2014-11-14 | 2015-04-15 | 浙江英特来光电科技有限公司 | 红色荧光胶固晶led灯丝 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5426481B2 (ja) * | 2010-05-26 | 2014-02-26 | 株式会社東芝 | 発光装置 |
-
2014
- 2014-11-14 CN CN201410649547.4A patent/CN104518069B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201985162U (zh) * | 2011-01-04 | 2011-09-21 | 鹤山市银雨照明有限公司 | 一种led封装固晶结构 |
CN104078548A (zh) * | 2013-03-29 | 2014-10-01 | 易美芯光(北京)科技有限公司 | 一种全角度发光led白光光源及其制造方法 |
CN103762293A (zh) * | 2014-01-20 | 2014-04-30 | 江苏华英光宝科技股份有限公司 | 强力结合式透明多角度发光led灯条及其制备方法 |
CN204271125U (zh) * | 2014-11-14 | 2015-04-15 | 浙江英特来光电科技有限公司 | 红色荧光胶固晶led灯丝 |
Also Published As
Publication number | Publication date |
---|---|
CN104518069A (zh) | 2015-04-15 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Red fluorescent glue solid crystal led filament Effective date of registration: 20220111 Granted publication date: 20170825 Pledgee: Yiwu Branch of China Construction Bank Co.,Ltd. Pledgor: ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022330000050 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230720 Granted publication date: 20170825 Pledgee: Yiwu Branch of China Construction Bank Co.,Ltd. Pledgor: ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022330000050 |