CN202749413U - 表面贴装型led - Google Patents

表面贴装型led Download PDF

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Publication number
CN202749413U
CN202749413U CN 201220346561 CN201220346561U CN202749413U CN 202749413 U CN202749413 U CN 202749413U CN 201220346561 CN201220346561 CN 201220346561 CN 201220346561 U CN201220346561 U CN 201220346561U CN 202749413 U CN202749413 U CN 202749413U
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China
Prior art keywords
wafer
utility
model
support
led
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Expired - Lifetime
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CN 201220346561
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English (en)
Inventor
龚文
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Shenzhen Jingtai Co ltd
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Shenzhen Jingtai Optoelectronics Co Ltd
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Priority to CN 201220346561 priority Critical patent/CN202749413U/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Abstract

本实用新型公开一种表面贴装型LED，包括黑色支架、设置在该支架上的发光晶片，以及用于连接所述支架与发光晶片的金线，其中所述发光晶片和金线通过封装胶体封装。本实用新型提供的贴片式LED由黑色支架、发光晶片、金线和封装胶体组成，结构简单，该发光晶片呈一字型固晶排列，可以提高LED的清晰度和对比度。

Description

表面贴装型LED
技术领域
本实用新型涉及LED技术领域，尤其涉及一种表面贴装型LED。
背景技术
LED(发光二极管)应用非常广泛，由于现有技术提供的全彩SMD(表面贴装型，Surface Mounted Devices)，对比度，清晰度不高，图像逼真程度不高，只能应用于清晰度要求不高的LED显示屏。而高清LED显示屏，对比度，清晰度，像素要求较高。所以像这种高清LED显示屏，现有的全彩SMDLED无法满足要求。
实用新型内容
本实用新型的主要目的是提供一种结构简单而且具有清晰度和对比度的表面贴装型LED。
本实用新型提供的一种表面贴装型LED，包括黑色支架、设置在该支架上的发光晶片，以及用于连接所述支架与发光晶片的金线，其中所述发光晶片和金线通过封装胶体封装。
优选地，所述发光晶片包括红光晶片、绿光晶片或蓝光晶片，所述红光晶片、绿光晶片或蓝光晶片按顺序一字型排列。
优选地，所述黑色支架呈长为3mm，宽为2mm的长方形设置。
本实用新型提供的贴片式LED由黑色支架、发光晶片、金线和封装胶体组成，结构简单，该发光晶片呈一字型固晶排列，可以提高LED的清晰度和对比度。
附图说明
图1为本实用新型表面贴装型LED的结构示意图。
本实用新型目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
下面结合附图及具体实施例就本实用新型的技术方案做进一步的说明。应当理解，此处所描述的具体实施例仅仅用以解释本实用新型，并不用于限定本实用新型。
本实用新型提出一种表面贴装型LED。
参照图1，图1为本实用新型表面贴装型LED的结构示意图。
在本实施例中，表面贴装型LED包括黑色支架101、发光晶片102、金线103以及封装胶体104，其中，发光晶片102通过固晶胶105固定于黑色支架101上，发光晶片102通过金线103与支架101连接，封装胶体104将发光晶片102和金线103封装在黑色支架101上，以保护发光晶片102和金线103不被损坏。
上述支架101优选为黑色PPA支架。
上述金线103用于连接发光晶片102表面电极和支架101。
在上述实施例中，发光晶片102包括红光晶片、绿光晶片和蓝光晶片，红光晶片、绿光晶片和蓝光晶片按顺序一字型排列。
在上述实施例中，上述黑色支架101呈长为3mm，宽为2mm的长方形设置。
本实用新型提供的贴片式LED由黑色支架101、发光晶片102、金线103和封装胶体104组成，结构简单，发光晶片102呈一字型固晶排列，可以提高LED的清晰度和对比度。
以上所述仅为本实用新型的优选实施例，并非因此限制本实用新型的专利范围，凡是利用本实用新型说明书及附图内容所作的等效结构变换，或直接或间接运用在其他相关的技术领域，均同理包括在本实用新型的专利保护范围内。

Claims (3)

1.一种表面贴装型LED，其特征在于，包括黑色支架、设置在该支架上的发光晶片，以及用于连接所述支架与发光晶片的金线，其中所述发光晶片和金线通过封装胶体封装。
2.如权利要求1所述的表面贴装型LED，所述发光晶片包括红光晶片、绿光晶片或蓝光晶片，所述红光晶片、绿光晶片或蓝光晶片按顺序一字型排列。
3.如权利要求1或2所述的表面贴装型LED，其特征在于，所述黑色支架呈长为3mm，宽为2mm的长方形设置。
CN 201220346561 2012-07-17 2012-07-17 表面贴装型led Expired - Lifetime CN202749413U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220346561 CN202749413U (zh) 2012-07-17 2012-07-17 表面贴装型led

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220346561 CN202749413U (zh) 2012-07-17 2012-07-17 表面贴装型led

Publications (1)

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CN202749413U true CN202749413U (zh) 2013-02-20

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104979338A (zh) * 2014-04-10 2015-10-14 光宝光电(常州)有限公司 发光二极管封装结构

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104979338A (zh) * 2014-04-10 2015-10-14 光宝光电(常州)有限公司 发光二极管封装结构
CN104979338B (zh) * 2014-04-10 2018-07-27 光宝光电(常州)有限公司 发光二极管封装结构

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: SHENZHEN KINGLIGHT CO., LTD.

Free format text: FORMER NAME: JINGTAI OPTOELECTRONICS CO., LTD.

CP03 Change of name, title or address

Address after: 518000, Guangdong, Baoan District, Fuyong Shenzhen Street (west side of Fu Garden Road) run Heng Industrial plant 4, plant third, fourth, fifth floor

Patentee after: SHENZHEN JINGTAI Co.,Ltd.

Address before: 518000 Guangdong city of Shenzhen province Baoan District Xixiang Baoan Avenue Fisheries Industrial Park Building 4 floor B measurements

Patentee before: SHENZHEN JINGTAI OPTOELECTRONICS Co.,Ltd.

CX01 Expiry of patent term

Granted publication date: 20130220

CX01 Expiry of patent term