CN202308050U - 一种表面贴片型led - Google Patents

一种表面贴片型led Download PDF

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Publication number
CN202308050U
CN202308050U CN 201120429112 CN201120429112U CN202308050U CN 202308050 U CN202308050 U CN 202308050U CN 201120429112 CN201120429112 CN 201120429112 CN 201120429112 U CN201120429112 U CN 201120429112U CN 202308050 U CN202308050 U CN 202308050U
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China
Prior art keywords
resin plate
type led
wafer
led
surface mount
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Expired - Lifetime
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CN 201120429112
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English (en)
Inventor
龚文
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SHENZHEN JINGTAI CO., LTD.
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Shenzhen Jingtai Optoelectronics Co Ltd
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Priority to CN 201120429112 priority Critical patent/CN202308050U/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本实用新型提供一种表面贴片型LED，包括：BT树脂板，所述BT树脂板的上固定设置有晶片，所述晶片与所述BT树脂板之间连接有金线，所述晶片和金线被封装胶封装在所述BT树脂板上。本实用新型提供的LED由带散热片的BT树脂板、晶片、金线和封装胶体组成，结构简单，实现尺寸小型化，做成显示屏后，提高了的高对比度和大大提高了显示屏的图像逼真程度。

Description

一种表面贴片型LED
技术领域
本实用新型涉及LED技术领域，特别涉及一种表面贴片型LED。
背景技术
LED(发光二极管)应用非常广泛，由于现有技术提供的全彩SMD(表面贴装型，Surface Mounted Devices)尺寸相对较大，只能应用于清晰度要求不高的LED显示屏。SMD LED尺寸越大，用其做出的LED显示屏像素就越低，显示的图像清晰度也就越低。而高清LED显示屏，像素要求较高，而现有的全彩SMD LED无法满足要求。
实用新型内容
本实用新型提供一种结构简单、尺寸小的表面贴片型LED，该LED做成显示屏后，提高了的高对比度和大大提高了显示屏的图像逼真程度。
为了实现上述目的，本实用新型提供以下技术方案：
一种表面贴片型LED，其包括：BT树脂板，所述BT树脂板的上固定设置有晶片，所述晶片与所述BT树脂板之间连接有金线，所述晶片和金线被封装胶封装在所述BT树脂板上。
优选地，所述晶片通过固定胶固定在所述BT树脂板上。
优选地，所述BT树脂板为正方形，且该BT树脂板的边长为1.2毫米。
通过实施以上技术方案，具有以下技术效果：本实用新型提供的LED由带散热片的BT树脂板、晶片、金线和封装胶组成，结构简单，实现尺寸小型化，该LED做成显示屏后，提高了的高对比度和大大提高了显示屏的图像逼真程度。
附图说明
图1为本实用新型实施例提供的表面贴片型LED的结构示意图。
具体实施方式
为了更好的理解本实用新型的技术方案，下面结合附图详细描述本实用新型提供的实施例。
本实用新型实施例提供一种表面贴片型LED，如图1所示，包括：BT(环氧)树脂板101，该树脂板101为黑色的树脂板，所述BT树脂板101的上固定设置有晶片102，所述晶片102与所述BT树脂板101之间连接有金线103。所述晶片102和金线103被封装胶封装在所述BT树脂板101上，以保护所述晶片102和金线103。如图1所示，该BT树脂板101可以为多块，一个树脂板101上的晶片还通过金线103连接另一树脂板101。所述晶片102也可以为多个，如：包括红色、绿色和蓝色晶片，以示区别。
在上述实施例中，优选地，所述晶片102通过固定胶固定在所述BT树脂板101上。
优选地，所述BT树脂板101为正方形，且该BT树脂板的边长为1.2毫米。在其他实施例中，BT树脂板也可以为其他尺寸的长度和宽度。
该实施例提供的LED为表面贴装型LED，由带散热片的BT树脂板、晶片、金线和封装胶体组成，结构简单，实现尺寸小型化，该LED做成显示屏后，提高了的高对比度和大大提高了显示屏的图像逼真程度。
以上对本实用新型实施例所提供的一种表面贴片型LED进行了详细介绍，对于本领域的一般技术人员，依据本实用新型实施例的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本实用新型的限制。

Claims (3)

1.一种表面贴片型LED，其特征在于，包括：BT树脂板，所述BT树脂板的上固定设置有晶片，所述晶片与所述BT树脂板之间连接有金线，所述晶片和金线被封装胶封装在所述BT树脂板上。
2.如权利要求1所述表面贴片型LED，其特征在于，所述晶片通过固定胶固定在所述BT树脂板上。
3.如权利要求1或2所述表面贴片型LED，其特征在于，所述BT树脂板为正方形，且该BT树脂板的边长为1.2毫米。
CN 201120429112 2011-11-02 2011-11-02 一种表面贴片型led Expired - Lifetime CN202308050U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201120429112 CN202308050U (zh) 2011-11-02 2011-11-02 一种表面贴片型led

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201120429112 CN202308050U (zh) 2011-11-02 2011-11-02 一种表面贴片型led

Publications (1)

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CN202308050U true CN202308050U (zh) 2012-07-04

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Country Status (1)

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CN (1) CN202308050U (zh)

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C56 Change in the name or address of the patentee

Owner name: SHENZHEN KINGLIGHT CO., LTD.

Free format text: FORMER NAME: JINGTAI OPTOELECTRONICS CO., LTD.

CP03 Change of name, title or address

Address after: 518000, Guangdong, Baoan District, Fuyong Shenzhen Street (west side of Fu Garden Road) run Heng Industrial plant 4, plant third, fourth, fifth floor

Patentee after: SHENZHEN JINGTAI CO., LTD.

Address before: 518000 Guangdong city of Shenzhen province Baoan District Xixiang Baoan Avenue Fisheries Industrial Park Building 4 floor B measurements

Patentee before: Shenzhen Jingtai Optoelectronics Co., Ltd.

CX01 Expiry of patent term

Granted publication date: 20120704

CX01 Expiry of patent term