CN203165933U - 表面贴装型led - Google Patents

表面贴装型led Download PDF

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Publication number
CN203165933U
CN203165933U CN2013200236053U CN201320023605U CN203165933U CN 203165933 U CN203165933 U CN 203165933U CN 2013200236053 U CN2013200236053 U CN 2013200236053U CN 201320023605 U CN201320023605 U CN 201320023605U CN 203165933 U CN203165933 U CN 203165933U
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China
Prior art keywords
type led
ppa support
wafer
utility
support rack
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Expired - Lifetime
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CN2013200236053U
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English (en)
Inventor
龚文
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Shenzhen Jingtai Co ltd
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Shenzhen Jingtai Optoelectronics Co Ltd
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Priority to CN2013200236053U priority Critical patent/CN203165933U/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H01L2224/48097—Kinked the kinked part being in proximity to the bonding area outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4846—Connecting portions with multiple bonds on the same bonding area

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  • Led Device Packages (AREA)

Abstract

本实用新型公开一种表面贴装型LED，包括表面设有遮光层的PPA支架、设置在该PPA支架上的发光晶片和连接所述PPA支架与发光晶片的金线，其中，所述发光晶片和金线封装在封装胶体内。本实用新型提供的表面贴装型LED由PPA支架、金线、发光晶片和封装胶体组成，结构简单，发光晶片呈一字型固晶排列，可以提高LED的清晰度、对比度和亮度，防水和抗紫外线能力也大大提升。

Description

表面贴装型LED
技术领域
本实用新型涉及LED技术领域，尤其涉及一种表面贴装型LED。
背景技术
LED(发光二极管)应用非常广泛，由于现有技术提供的全彩SMD(SurfaceMounted Devices，表面贴装型)，对比度，清晰度不高，图像逼真程度不高，只能应用于清晰度要求不高的LED显示屏。而高清LED显示屏，对比度，清晰度，像素要求较高。所以像这种高清LED显示屏，现有的全彩SMD LED无法满足要求。
实用新型内容
本实用新型的主要目的是提供一种结构简单而且具有清晰度和对比度的表面贴装型LED。
本实用新型提供的一种表面贴装型LED，包括表面设有遮光层的PPA支架、设置在该PPA支架上的发光晶片和连接所述PPA支架与发光晶片的金线，其中，所述发光晶片和金线封装在封装胶体内。
优选地，所述发光晶片包括一字型排列红光晶片、绿光晶片或蓝光晶片。
优选地，所述PPA支架的长为3.5mm，宽为3.5mm，厚为2.5mm。
本实用新型提供的表面贴装型LED由PPA支架、金线、发光晶片和封装胶体组成，结构简单，发光晶片呈一字型固晶排列，可以提高LED的清晰度、对比度和亮度，防水和抗紫外线能力也大大提升。
附图说明
图1为本实用新型表面贴装型LED的结构示意图。
本实用新型目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
下面结合附图及具体实施例就本实用新型的技术方案做进一步的说明。应当理解，此处所描述的具体实施例仅仅用以解释本实用新型，并不用于限定本实用新型。
本实用新型提出一种表面贴装型LED。
参照图1，图1为本实用新型表面贴装型LED的结构示意图。
在本实施例中，表面贴装型LED包括表面设有遮光层的PPA支架101、金线102、发光晶片103以及封装胶体104，其中，发光晶片103通过固晶胶105固定于PPA支架101上，金线102连接发光晶片103表面电极与PPA支架101，封装胶体104将发光晶片103和金线102封装在PPA支架101上，以保护金线102和发光晶片103不被损坏。
在上述实施例中，发光晶片103包括一字型排列红光晶片、绿光晶片或蓝光晶片。
在上述实施例中，上述PPA支架101长为3.5mm，宽为3.5mm，厚为2.5mm。
本实用新型提供的表面贴装型LED由PPA支架101、金线102、发光晶片103和封装胶体104组成，结构简单，发光晶片103呈一字型固晶排列，可以提高LED的清晰度、对比度和亮度，防水和抗紫外线能力也大大提升。
以上所述仅为本实用新型的优选实施例，并非因此限制本实用新型的专利范围，凡是利用本实用新型说明书及附图内容所作的等效结构变换，或直接或间接运用在其他相关的技术领域，均同理包括在本实用新型的专利保护范围内。

Claims (3)

1.一种表面贴装型LED，其特征在于，包括表面设有遮光层的PPA支架、设置在该PPA支架上的发光晶片和连接所述PPA支架与发光晶片的金线，其中，所述发光晶片和金线封装在封装胶体内。
2.如权利要求1所述的表面贴装型LED，所述发光晶片包括一字型排列红光晶片、绿光晶片或蓝光晶片。
3.如权利要求1或2所述的表面贴装型LED，其特征在于，所述PPA支架的长为3.5mm，宽为3.5mm，厚为2.5mm。
CN2013200236053U 2013-01-15 2013-01-15 表面贴装型led Expired - Lifetime CN203165933U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2013200236053U CN203165933U (zh) 2013-01-15 2013-01-15 表面贴装型led

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2013200236053U CN203165933U (zh) 2013-01-15 2013-01-15 表面贴装型led

Publications (1)

Publication Number Publication Date
CN203165933U true CN203165933U (zh) 2013-08-28

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CN2013200236053U Expired - Lifetime CN203165933U (zh) 2013-01-15 2013-01-15 表面贴装型led

Country Status (1)

Country Link
CN (1) CN203165933U (zh)

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C56 Change in the name or address of the patentee

Owner name: SHENZHEN KINGLIGHT CO., LTD.

Free format text: FORMER NAME: JINGTAI OPTOELECTRONICS CO., LTD.

CP03 Change of name, title or address

Address after: 518000, Guangdong, Baoan District, Fuyong Shenzhen Street (Fu Garden Road on the west side) run Heng Industrial Plant No. 4 factory floor third, fourth, fifth

Patentee after: SHENZHEN JINGTAI Co.,Ltd.

Address before: 518000 Guangdong city of Shenzhen province Baoan District Xixiang Baoan Avenue Fisheries Industrial Park Building 4 floor B measurements

Patentee before: SHENZHEN JINGTAI OPTOELECTRONICS Co.,Ltd.

CX01 Expiry of patent term

Granted publication date: 20130828

CX01 Expiry of patent term