CN202736917U - 一种led封装结构 - Google Patents

一种led封装结构 Download PDF

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Publication number
CN202736917U
CN202736917U CN2012202693133U CN201220269313U CN202736917U CN 202736917 U CN202736917 U CN 202736917U CN 2012202693133 U CN2012202693133 U CN 2012202693133U CN 201220269313 U CN201220269313 U CN 201220269313U CN 202736917 U CN202736917 U CN 202736917U
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Prior art keywords
led
wiring board
packaging structure
encapsulating structure
wafers
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Expired - Lifetime
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CN2012202693133U
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Inventor
钟志杰
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JINGZHOU HONGSHENG OPTOELECTRONICS TECHNOLOGY Co Ltd
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JINGZHOU HONGSHENG OPTOELECTRONICS TECHNOLOGY Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

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  • Led Device Packages (AREA)

Abstract

本实用新型适用于LED领域，提供了一种LED的封装结构，其包括一布有电子线路的线路板、设于线路板之上的胶体层，所述胶体层上设有一杯体容腔，所述杯体容腔内布有多个晶片以及电性连接所述晶片和线路板上电子线路的导电引线，所述杯体容腔用雾状半透明扩散胶体封住。该LED封装结构通过紧凑严密的设计以及采用防潮性能好的材料，提高了LED整体的防潮性能，且在体积上可以做到比传统封装结构的LED要小，能更好地适应于一些需要小体积、密距间距的使用场合，例如LED显示屏等。

Description

一种LED封装结构
技术领域
本实用新型属于LED领域，尤其涉及一种LED的封装结构。
背景技术
LED，即发光二级管，因其体积小、能耗低、寿命长，越来越受到人们的重视，其作为光源的应用也越来越广泛，以LED为光源的既有各种照明灯具、广告招牌，还有显示屏等等。如图1所示，现有LED的封装一般是在注塑好的塑胶支架1上直接固定晶片2、焊接导电引线3，注塑灌胶胶体层4，这种封装结构因塑胶材料易吸湿的特性因而LED灯珠防潮能力差，容易造成LED死灯现象；且这种封装结构使得单颗LED体积大，不能适应电子元器件向小型化、超薄化的发展，不能满足一些需要小体积、密间距的场合来使用（例如LED显示屏）。
实用新型内容
本实用新型的目的在于克服上述现有技术的不足，提供了一种防潮能力较好、体积小的LED封装结构。
本实用新型是这样实现的：一种LED封装结构，包括一布有电子线路的线路板、设于线路板之上的胶体层，所述胶体层上设有一杯体容腔，所述杯体容腔内布有多个晶片以及电性连接所述晶片和线路板上电子线路的导电引线，所述杯体容腔封有雾状半透明扩散胶体。
具体地，所述晶片为红、绿、蓝三种晶片，所述红、绿、蓝三种晶片一字排开。
具体地，所述扩散胶体包覆所述晶片及导电引线。
具体地，所述线路板底部设有焊盘，所述焊盘电性连接所述线路板上的电子线路。
具体地，所述线路板上还设有导电孔，所述导电孔电性连接所述线路板上的电子线路和焊盘。
本实用新型提供的LED封装结构，其通过将电子线路、线路板、封装胶体、焊盘严密而紧凑的集结于一体，而线路板和封装胶体同时采用防潮性能较好的材料制成，故其整体防潮能力较好，且此种封装结构使单颗LED体积更小，可使其能更好地应用于某些需要小体积、密距间距的特殊场合（例如LED显示屏）。
附图说明
图1是本实用新型提供的现有技术的LED封装结构图；
图2是本实用新型实施例提供的LED封装结构的正视剖视图；
图3是本实用新型实施例提供的LED封装结构的俯视示意图；
图4是本实用新型实施例提供的LED封装结构的仰视示意图。
具体实施方式
为了使本实用新型的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本实用新型进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本实用新型，并不用于限定本实用新型。
如图2-4所示，为本实用新型实施例提供的LED封装结构，包括一布有电子线路的线路板5、设于线路板5之上的胶体层6，胶体层6上设有一杯体容腔，杯体容腔内布有多个晶片2以及电性连接晶片2和线路板上电子线路的导电引线3，杯体容腔用雾状半透明扩散胶体4封住。本实施例提供的LED封装结构，其体积小，结构紧凑严密，再加上线路板1所用材料和胶体层6所采用的材料防潮性能比传统支架封装所采用的PPA材料要好，故本实用新型提供的LED封装结构整体防潮性能较好，且其体积小、轻薄，能更好地适应于一些需要小体积、密距间距的使用场合，例如LED显示屏。
晶片2为红、绿、蓝三种晶片一字排开构成一个晶片矩阵，利用三原基色的原理可使LED发出各种不同颜色的光。
扩散胶体4可采用环氧树脂胶，也可采用硅胶，其包覆晶片2及导电引线3。
线路板5下还设有焊盘51，焊盘51为平面镀铜结构，焊盘51电性连接线路板5上的电子线路，在实际使用中，将焊盘51对准基板上的焊点，采用表面焊接即可，方便快捷，而不需要像传统的LED那样需要先用外力折弯引脚然后进行焊接。
线路板5上还设有导电孔52，导电孔52电性连接线路板上的电子线路和焊盘51，使焊盘和线路板5上的电子线路导通。
以上所述仅为本实用新型的较佳实施例而已，并不用以限制本实用新型，凡在本实用新型的精神和原则之内所作的任何修改、等同替换或改进等，均应包含在本实用新型的保护范围之内。

Claims (5)

1.一种LED封装结构，其特征在于：包括一布有电子线路的线路板、设于线路板之上的胶体层，所述胶体层上设有一杯体容腔，所述杯体容腔内布有多个晶片以及电性连接所述晶片和线路板上电子线路的导电引线，所述杯体容腔封有雾状半透明扩散胶体。
2.如权利要求1所述的LED封装结构，其特征在于，所述晶片为红、绿、蓝三种晶片，所述红、绿、蓝三种晶片一字排开。
3.如权利要求1所述的LED封装结构，其特征在于，所述扩散胶体包覆所述晶片及导电引线。
4.如权利要求1-3任一项所述的LED封装结构，其特征在于，所述线路板底部设有焊盘，所述焊盘电性连接所述线路板上的电子线路。
5.如权利要求1所述的LED封装结构，其特征在于，所述线路板上还设有导电孔，所述导电孔电性连接所述线路板上的电子线路和焊盘。
CN2012202693133U 2012-06-08 2012-06-08 一种led封装结构 Expired - Lifetime CN202736917U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106195659A (zh) * 2016-07-27 2016-12-07 佛山市国星光电股份有限公司 一种cob光源及集成模块及灯具

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106195659A (zh) * 2016-07-27 2016-12-07 佛山市国星光电股份有限公司 一种cob光源及集成模块及灯具
CN106195659B (zh) * 2016-07-27 2020-03-20 佛山市国星光电股份有限公司 一种cob光源及集成模块及灯具

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