CN101994913A - Led电子显示屏用3528rgb三合一led封装结构的改良 - Google Patents
Led电子显示屏用3528rgb三合一led封装结构的改良 Download PDFInfo
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- CN101994913A CN101994913A CN2009100344268A CN200910034426A CN101994913A CN 101994913 A CN101994913 A CN 101994913A CN 2009100344268 A CN2009100344268 A CN 2009100344268A CN 200910034426 A CN200910034426 A CN 200910034426A CN 101994913 A CN101994913 A CN 101994913A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Abstract
本发明公开了一种LED电子显示屏用3528RGB三合一LED封装结构的改良,采用两颗9mil红光晶片并联的方式取代了传统采用一颗12mil红光晶片,即两颗9mil红光晶片与一颗蓝光晶片及一颗绿光晶片四者并联固晶封装,两颗9mil红光晶片分别通过底部的银胶导电并通过上层的金线与正极连接,从本发明封装成品测试结果来看,本发明封装成品红、绿、蓝的亮度比接近于3∶6∶1,因此本发明有效克服了红光亮度不足的问题;因为12mil红光晶片的价格一般在150元/k左右,而9mil红光晶片的价格一般在20元/k左右,因此用两颗9mil红光晶片替代一颗12mil红光晶片可以使成本大大降低,可节约成本约1/2。
Description
技术领域
本发明涉及一种LED电子显示屏用3528RGB三合一LED的封装结构。
背景技术
目前习用的LED电子显示屏用3528RGB三合一LED(3528RGB是行业术语,3528指封装形式,R、G、B分别指红、绿、蓝)的封装结构如图5所示,采用三晶PLCC支架,分别将红光(辐射波段620~627nm)晶片、绿光(辐射波段520~525nm)晶片和蓝光(辐射波段465~470nm)晶片这三个晶片贴装于三晶PLCC支架的相应固晶位上,通过电流控制实现三原色混光,产生65536×65536×65536种颜色,应用于全彩显示。
由于目前正极性晶片发展的限制与成本应用的考量,目前3528RGB三合一LED混白光呈现红光亮度不足的情形,一般RGB混白光亮度要求比为3∶6∶1,而实际上封装成品亮度比约1.8∶6∶1,红光亮度明显不足,故造成需同时降低蓝、绿光光亮度以达到白平衡。
发明内容
为了克服上述缺陷,本发明提供了一种LED电子显示屏用3528RGB三合一LED封装结构的改良,此结构可以有效克服红光亮度不足的问题,同时还可以节约成本约1/2,且结构简单、易于实施。
本发明为了解决其技术问题所采用的技术方案是:
一种LED电子显示屏用3528RGB三合一LED封装结构的改良,蓝光晶片固晶位上贴装有一颗蓝光晶片,绿光晶片固晶位上贴装有一颗绿光晶片,所述蓝光晶片与绿光晶片并联且皆与正极电性连接,红光晶片固晶位上贴装有两颗9mil红光晶片,两颗9mil红光晶片并联且皆与正极电性连接,两颗9mil红光晶片与所述蓝光晶片和所述绿光晶片并联。(mil即密耳,指千分之一英寸。)
该LED电子显示屏用3528RGB三合一LED封装结构的改良采用两颗9mil红光晶片并联的方式取代了传统的一颗12mil红光晶片,即两颗9mil红光晶片与一颗蓝光晶片及一颗绿光晶片四者并联固晶封装,两颗9mil红光晶片分别通过底部的银胶导电并通过上层的金线与正极连接。
本发明的有益效果是:该LED电子显示屏用3528RGB三合一LED封装结构的改良采用两颗9mil红光晶片并联的方式取代了传统采用一颗12mil红光晶片,即两颗9mil红光晶片与一颗蓝光晶片及一颗绿光晶片四者并联固晶封装,两颗9mil红光晶片分别通过底部的银胶导电并通过上层的金线与正极连接,从本发明封装成品测试结果来看,本发明封装成品红、绿、蓝的亮度比接近于3∶6∶1,因此本发明有效克服了红光亮度不足的问题;因为12mil红光晶片的价格一般在150元/k左右,而9mil红光晶片的价格一般在20元/k左右,因此用两颗9mil红光晶片替代一颗12mil红光晶片可以使成本大大降低,可节约成本约1/2。
附图说明
图1为本发明结构示意图;
图2为本发明封装成品测试的蓝光光强变化曲线;
图3为本发明封装成品测试的绿光光强变化曲线;
图4为本发明封装成品测试的红光光强变化曲线;
图5为习用的LED电子显示屏用3528RGB三合一LED封装结构。
具体实施方式
实施例:一种LED电子显示屏用3528RGB三合一LED封装结构的改良,蓝光晶片固晶位上贴装有一颗蓝光晶片3,绿光晶片固晶位上贴装有一颗绿光晶片2,所述蓝光晶片与绿光晶片并联且皆与正极电性连接,红光晶片固晶位上贴装有两颗9mil红光晶片1,两颗9mil红光晶片并联且皆与正极电性连接,两颗9mil红光晶片与所述蓝光晶片和所述绿光晶片并联。(mil即密耳,指千分之一英寸。)
该LED电子显示屏用3528RGB三合一LED封装结构的改良采用两颗9mil红光晶片并联的方式取代了传统的一颗12mil红光晶片,即两颗9mil红光晶片与一颗蓝光晶片及一颗绿光晶片四者并联固晶封装,两颗9mil红光晶片分别通过底部的银胶4导电并通过上层的金线5与正极连接。从本发明封装成品测试结果来看(如图2、3、4所示),本发明封装成品红、绿、蓝的亮度比接近于3∶6∶1,因此本发明有效克服了红光亮度不足的问题。因为12mil红光晶片的价格一般在150元/k左右,而9mil红光晶片的价格一般在20元/k左右,因此用两颗9mil红光晶片替代一颗12mil红光晶片可以使成本大大降低,可节约成本约1/2。
Claims (1)
1.一种LED电子显示屏用3528RGB三合一LED封装结构的改良,蓝光晶片固晶位上贴装有一颗蓝光晶片(3),绿光晶片固晶位上贴装有一颗绿光晶片(2),所述蓝光晶片与绿光晶片并联且皆与正极电性连接,其特征在于:红光晶片固晶位上贴装有两颗9mil红光晶片(1),两颗9mil红光晶片并联且皆与正极电性连接,两颗9mil红光晶片与所述蓝光晶片和所述绿光晶片并联。
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103423649A (zh) * | 2013-08-20 | 2013-12-04 | 揭阳市利业光电有限公司 | 一种免分压电阻的led灯珠串 |
TWI556478B (zh) * | 2014-06-30 | 2016-11-01 | 億光電子工業股份有限公司 | 發光二極體裝置 |
CN110854254A (zh) * | 2019-10-25 | 2020-02-28 | 深圳市鑫和众电子科技有限公司 | 一种密集型led封装方式 |
-
2009
- 2009-08-28 CN CN2009100344268A patent/CN101994913A/zh active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103423649A (zh) * | 2013-08-20 | 2013-12-04 | 揭阳市利业光电有限公司 | 一种免分压电阻的led灯珠串 |
TWI556478B (zh) * | 2014-06-30 | 2016-11-01 | 億光電子工業股份有限公司 | 發光二極體裝置 |
US9653653B2 (en) | 2014-06-30 | 2017-05-16 | Everlight Electronics Co., Ltd. | Light emitting diode device |
US9972608B2 (en) | 2014-06-30 | 2018-05-15 | Everlight Electronics Co., Ltd. | Light emitting diode device |
CN110854254A (zh) * | 2019-10-25 | 2020-02-28 | 深圳市鑫和众电子科技有限公司 | 一种密集型led封装方式 |
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