CN201490191U - Led电子显示屏用3528rgb三合一led封装结构的改良 - Google Patents

Led电子显示屏用3528rgb三合一led封装结构的改良 Download PDF

Info

Publication number
CN201490191U
CN201490191U CN2009200480893U CN200920048089U CN201490191U CN 201490191 U CN201490191 U CN 201490191U CN 2009200480893 U CN2009200480893 U CN 2009200480893U CN 200920048089 U CN200920048089 U CN 200920048089U CN 201490191 U CN201490191 U CN 201490191U
Authority
CN
China
Prior art keywords
wafer
9mil
red light
red
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009200480893U
Other languages
English (en)
Inventor
黄敏精
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MYLIGHT PRECISION ELECTRON CO Ltd
Original Assignee
MYLIGHT PRECISION ELECTRON CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MYLIGHT PRECISION ELECTRON CO Ltd filed Critical MYLIGHT PRECISION ELECTRON CO Ltd
Priority to CN2009200480893U priority Critical patent/CN201490191U/zh
Application granted granted Critical
Publication of CN201490191U publication Critical patent/CN201490191U/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Landscapes

  • Electroluminescent Light Sources (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本实用新型公开了一种LED电子显示屏用3528RGB三合一LED封装结构的改良，采用两颗9mil红光晶片并联的方式取代了传统采用一颗12mil红光晶片，即两颗9mil红光晶片与一颗蓝光晶片及一颗绿光晶片四者并联固晶封装，两颗9mil红光晶片分别通过底部的银胶导电并通过上层的金线与正极连接，从本实用新型封装成品测试结果来看，本实用新型封装成品红、绿、蓝的亮度比接近于3∶6∶1，因此本实用新型有效克服了红光亮度不足的问题；因为12mil红光晶片的价格一般在150元/k左右，而9mil红光晶片的价格一般在20元/k左右，因此用两颗9mil红光晶片替代一颗12mil红光晶片可以使成本大大降低，可节约成本约1/2。

Description

LED电子显示屏用3528RGB三合一LED封装结构的改良
技术领域
本实用新型涉及一种LED电子显示屏用3528RGB三合一LED的封装结构。
背景技术
目前习用的LED电子显示屏用3528RGB三合一LED(3528RGB是行业术语，3528指封装形式，R、G、B分别指红、绿、蓝)的封装结构如图5所示，采用三晶PLCC支架，分别将红光(辐射波段620～627nm)晶片、绿光(辐射波段520～525nm)晶片和蓝光(辐射波段465～470nm)晶片这三个晶片贴装于三晶PLCC支架的相应固晶位上，通过电流控制实现三原色混光，产生65536×65536×65536种颜色，应用于全彩显示。
由于目前正极性晶片发展的限制与成本应用的考量，目前3528RGB三合一LED混白光呈现红光亮度不足的情形，一般RGB混白光亮度要求比为3∶6∶1，而实际上封装成品亮度比约1.8∶6∶1，红光亮度明显不足，故造成需同时降低蓝、绿光光亮度以达到白平衡。
发明内容
为了克服上述缺陷，本实用新型提供了一种LED电子显示屏用3528RGB三合一LED封装结构的改良，此结构可以有效克服红光亮度不足的问题，同时还可以节约成本约1/2，且结构简单、易于实施。
本实用新型为了解决其技术问题所采用的技术方案是：
一种LED电子显示屏用3528RGB三合一LED封装结构的改良，蓝光晶片固晶位上贴装有一颗蓝光晶片，绿光晶片固晶位上贴装有一颗绿光晶片，所述蓝光晶片与绿光晶片并联且皆与正极电性连接，红光晶片固晶位上贴装有两颗9mil红光晶片，两颗9mil红光晶片并联且皆与正极电性连接，两颗9mil红光晶片与所述蓝光晶片和所述绿光晶片并联。(mil即密耳，指千分之一英寸。)
该LED电子显示屏用3528RGB三合一LED封装结构的改良采用两颗9mil红光晶片并联的方式取代了传统的一颗12mil红光晶片，即两颗9mil红光晶片与一颗蓝光晶片及一颗绿光晶片四者并联固晶封装，两颗9mil红光晶片分别通过底部的银胶导电并通过上层的金线与正极连接。
本实用新型的有益效果是：该LED电子显示屏用3528RGB三合一LED封装结构的改良采用两颗9mil红光晶片并联的方式取代了传统采用一颗12mil红光晶片，即两颗9mil红光晶片与一颗蓝光晶片及一颗绿光晶片四者并联固晶封装，两颗9mil红光晶片分别通过底部的银胶导电并通过上层的金线与正极连接，从本实用新型封装成品测试结果来看，本实用新型封装成品红、绿、蓝的亮度比接近于3∶6∶1，因此本实用新型有效克服了红光亮度不足的问题；因为12mil红光晶片的价格一般在150元/k左右，而9mil红光晶片的价格一般在20元/k左右，因此用两颗9mil红光晶片替代一颗12mil红光晶片可以使成本大大降低，可节约成本约1/2。
附图说明
图1为本实用新型结构示意图；
图2为本实用新型封装成品测试的蓝光光强变化曲线；
图3为本实用新型封装成品测试的绿光光强变化曲线；
图4为本实用新型封装成品测试的红光光强变化曲线；
图5为习用的LED电子显示屏用3528RGB三合一LED封装结构。
具体实施方式
实施例：一种LED电子显示屏用3528RGB三合一LED封装结构的改良，蓝光晶片固晶位上贴装有一颗蓝光晶片3，绿光晶片固晶位上贴装有一颗绿光晶片2，所述蓝光晶片与绿光晶片并联且皆与正极电性连接，红光晶片固晶位上贴装有两颗9mil红光晶片1，两颗9mil红光晶片并联且皆与正极电性连接，两颗9mil红光晶片与所述蓝光晶片和所述绿光晶片并联。(mil即密耳，指千分之一英寸。)
该LED电子显示屏用3528RGB三合一LED封装结构的改良采用两颗9mil红光晶片并联的方式取代了传统的一颗12mil红光晶片，即两颗9mil红光晶片与一颗蓝光晶片及一颗绿光晶片四者并联固晶封装，两颗9mil红光晶片分别通过底部的银胶4导电并通过上层的金线5与正极连接。从本实用新型封装成品测试结果来看(如图2、3、4所示)，本实用新型封装成品红、绿、蓝的亮度比接近于3∶6∶1，因此本实用新型有效克服了红光亮度不足的问题。因为12mil红光晶片的价格一般在150元/k左右，而9mil红光晶片的价格一般在20元/k左右，因此用两颗9mil红光晶片替代一颗12mil红光晶片可以使成本大大降低，可节约成本约1/2。

Claims (1)

1.一种LED电子显示屏用3528RGB三合一LED封装结构的改良，蓝光晶片固晶位上贴装有一颗蓝光晶片(3)，绿光晶片固晶位上贴装有一颗绿光晶片(2)，所述蓝光晶片与绿光晶片并联且皆与正极电性连接，其特征在于：红光晶片固晶位上贴装有两颗9mil红光晶片(1)，两颗9mil红光晶片并联且皆与正极电性连接，两颗9mil红光晶片与所述蓝光晶片和所述绿光晶片并联。
CN2009200480893U 2009-08-28 2009-08-28 Led电子显示屏用3528rgb三合一led封装结构的改良 Expired - Fee Related CN201490191U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009200480893U CN201490191U (zh) 2009-08-28 2009-08-28 Led电子显示屏用3528rgb三合一led封装结构的改良

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009200480893U CN201490191U (zh) 2009-08-28 2009-08-28 Led电子显示屏用3528rgb三合一led封装结构的改良

Publications (1)

Publication Number Publication Date
CN201490191U true CN201490191U (zh) 2010-05-26

Family

ID=42429058

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009200480893U Expired - Fee Related CN201490191U (zh) 2009-08-28 2009-08-28 Led电子显示屏用3528rgb三合一led封装结构的改良

Country Status (1)

Country Link
CN (1) CN201490191U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102136471A (zh) * 2010-12-23 2011-07-27 常州欧密格光电科技有限公司 大型显示屏的led元件

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102136471A (zh) * 2010-12-23 2011-07-27 常州欧密格光电科技有限公司 大型显示屏的led元件

Similar Documents

Publication Publication Date Title
CN203800046U (zh) 一种灯驱合一的led封装器件
CN101783099B (zh) 自带驱动控制的led平板显示单元及其生产方法
WO2012079217A1 (zh) 一种led灯串
CN204067334U (zh) 光电半导体的灯条结构
CN208970508U (zh) 发光器件及led显示屏
CN103824848B (zh) Led显示屏及其制作方法
CN203787424U (zh) 一种led显示屏
CN101994913A (zh) Led电子显示屏用3528rgb三合一led封装结构的改良
CN201490191U (zh) Led电子显示屏用3528rgb三合一led封装结构的改良
CN201163632Y (zh) 一种大功率led器件
CN106229312B (zh) 一种全光谱csp封装光源及其制造方法
CN203205454U (zh) 一种led光源的封装结构
CN206098444U (zh) 一种多晶led封装支架及多晶led封装体
CN201093360Y (zh) R、g、b三合一全彩屏用led灯珠
CN205956829U (zh) 一种光电一体化cob光源
CN203787420U (zh) 可变换连接的阵列式cob光源
CN202126810U (zh) 一种新型户外三合一led全彩显示屏
CN204143793U (zh) 一种led集成像素封装模组及其高清显示屏
CN203659856U (zh) 一种贴片led
CN206907379U (zh) Led显示模组及显示屏
CN208189582U (zh) 一种共阴共阳一体化全户外smd-led结构
CN204991755U (zh) 一种多晶led封装支架、三芯led封装体及四芯led封装体
CN201845774U (zh) 高显白光led模组
CN206921861U (zh) 一种倒装红光led晶片
CN204991754U (zh) 一种芯片级led封装支架、led拼板、芯片级led封装体及led板

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100526

Termination date: 20120828