CN2901581Y - 双晶混色发光二极管 - Google Patents
双晶混色发光二极管 Download PDFInfo
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- CN2901581Y CN2901581Y CNU2005201445899U CN200520144589U CN2901581Y CN 2901581 Y CN2901581 Y CN 2901581Y CN U2005201445899 U CNU2005201445899 U CN U2005201445899U CN 200520144589 U CN200520144589 U CN 200520144589U CN 2901581 Y CN2901581 Y CN 2901581Y
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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Abstract
本实用新型涉及固体电光源,是一双晶混色发光二极管,由支架1、引脚8、银/绝缘胶2、晶片3、荧光胶5、金线6和环氧树脂9组成,其特征在于:支架1上固定有两颗晶片,晶片3和晶片4,晶片3串联或并联晶片4后,再在上面涂覆一层荧光胶,通过高温烤干后,再用金线5连接引脚8和晶片上的晶片焊垫7(即正/负极焊点),使其形成一个串联或并联的电路,用环氧树脂9封装,即成不同形状的发光二极管。晶片3是蓝色晶片,晶片4是黄绿色晶片或红色晶片。双晶混色发光二极管的优点是:1是由于采用双晶混色可减少颜色及亮度的衰减;2是用不同波长的晶片可相互混和成不同颜色的光。
Description
技术领域:
本实用新型涉及固体电光源,是指双晶混色发光二极管。
背景技术:
目前,发光二极管(见图1)是由支架、引脚、晶片、金线、晶片焊垫、银/绝缘胶、荧光胶和环氧树脂组成,其中,晶片上设有晶片焊垫,通过银/绝缘胶烘烤固定在支架上,一只晶片焊垫用金线与引脚连接,另一只晶片焊垫用金线与支架(支架作为引脚之一)连接,其上面灌封荧光胶,最后用环氧树脂塑封制成发光二极管,特殊颜色的发光二极管,例如白光、粉红光,晶片是用蓝色晶片,并在蓝色晶片上覆盖一层荧光粉,激发出白光或粉红光,这种产品单颗使用电压在2~4.5V之间。
发明内容:
本实用新型的目的是提供一种双晶混色发光二极管,它由支架、引脚、晶片、金线、晶片焊垫、银/绝缘胶、荧光胶和环氧树脂组成,其中,晶片上设有晶片焊垫,其特征在于:支架上通过银/绝缘胶固有蓝色、黄绿色或蓝色、红色两颗晶片,用金线将两晶片串联或并联后,再在上面涂覆一层荧光胶,烘烤固定后,再用金线将两晶片上的晶片焊垫(即正、负极)与引脚连接起来,形式成串或并联的电路,用环氧树脂封装成不同形状的发光二极管,单颗的使用电压在2-6v,通过电流为20mA。引脚数可为2~3只(含支架作为引脚之一)。
双晶混色发光二极管的优点是:1是由于采用双晶混色可减少颜色及亮度的衰减;2是用不同波长的晶片可相互混和成不同颜色的光,可灵活搭配;3是可根据应用电路改变成串/并联连接,其单颗使用电压可在2~6V之间变动。
附图说明:
图1、图2是现有发光二极管结构图;
图3、图4是双晶混色二极管的结构图;
图5、图6、图7是双晶混色二极管3支引脚(含支架)型的结构图。
图8是3支引脚双晶混色二极管串接的电路原理图。
图9是3支引脚双晶混色二极管并接的电路原理图。
具体实施方式:
见图3~图9,双晶混色发光二极管,由支架1、引脚8、银/绝缘胶2、晶片3、荧光胶5、金线6和环氧树脂8组成,其特征在于:支架1通过银/绝缘胶2固定有晶片3和晶片4,金线6连接晶片3和晶片4,晶片3和晶片4上面涂覆有一层荧光胶5,金线6连接引脚8和晶片上的晶片焊垫7(引脚是正极,焊垫是负极,形成一个串联或并联的电路),外层包有环氧树脂9,即成不同形状的发光二极管。
晶片3是蓝色晶片,晶片4是黄绿色晶片或红色晶片。覆盖一层荧光胶5,是使光色更为均匀一致。
支架1是镀银的铁材或铜材。支架1内固定有2片发光晶片,用金线连接后形成串联/并联后形成混色光。双晶混色发光二极管,有2~3支脚(含支架作为引脚之一)。
选用不同波段范围的晶片和不同配比、不同用量的荧光胶来调色,双晶混色发光二极管可发出各种不同颜色的光。
Claims (3)
1、一种双晶混色发光二极管,由支架(1)、银/绝缘胶(2)、晶片(3)、荧光胶(5)、金线(6)和环氧树脂(9)组成,其中,晶片上设有晶片焊垫(7),其特征在于:支架(1)通过银/绝缘胶(2)固定有晶片(3)和晶片(4),金线(6)连接晶片(3)和晶片(4),晶片(3)和晶片(4)上面涂覆有一层荧光胶(5),金线(6)连接引脚(8)和晶片上的晶片焊垫(7),外层包有环氧树脂(9)。
2、按权利要求1所述的双晶混色发光二极管,其特征在于:晶片(3)是蓝色晶片,主波长在430-480nm;晶片(4)是主波长在560-575nm的黄绿色晶片或主波长在620-660nm的红色晶片。
3、按权利要求1所述的双晶混色发光二极管,其特征在于:双晶混色发光二极管,有2~3只引脚(8)。
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CNU2005201445899U CN2901581Y (zh) | 2005-12-13 | 2005-12-13 | 双晶混色发光二极管 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102024881A (zh) * | 2009-09-15 | 2011-04-20 | 名硕电脑(苏州)有限公司 | 发光二极管 |
CN102299248A (zh) * | 2010-06-25 | 2011-12-28 | 惟昌企业股份有限公司 | Led封装支架改良制造方法及由此制得的封装结构 |
CN102454945A (zh) * | 2010-10-27 | 2012-05-16 | 深圳市日上光电有限公司 | 一种获得高显色性暖白光的方法及其封装结构 |
CN108023007A (zh) * | 2017-11-09 | 2018-05-11 | 江苏稳润光电科技有限公司 | 一种Lamp白光灯及其封装方式 |
-
2005
- 2005-12-13 CN CNU2005201445899U patent/CN2901581Y/zh not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102024881A (zh) * | 2009-09-15 | 2011-04-20 | 名硕电脑(苏州)有限公司 | 发光二极管 |
CN102299248A (zh) * | 2010-06-25 | 2011-12-28 | 惟昌企业股份有限公司 | Led封装支架改良制造方法及由此制得的封装结构 |
CN102299248B (zh) * | 2010-06-25 | 2014-04-23 | 惟昌企业股份有限公司 | Led封装支架改良制造方法及由此制得的封装结构 |
CN102454945A (zh) * | 2010-10-27 | 2012-05-16 | 深圳市日上光电有限公司 | 一种获得高显色性暖白光的方法及其封装结构 |
CN108023007A (zh) * | 2017-11-09 | 2018-05-11 | 江苏稳润光电科技有限公司 | 一种Lamp白光灯及其封装方式 |
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