CN103423649A - 一种免分压电阻的led灯珠串 - Google Patents

一种免分压电阻的led灯珠串 Download PDF

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CN103423649A
CN103423649A CN2013103641760A CN201310364176A CN103423649A CN 103423649 A CN103423649 A CN 103423649A CN 2013103641760 A CN2013103641760 A CN 2013103641760A CN 201310364176 A CN201310364176 A CN 201310364176A CN 103423649 A CN103423649 A CN 103423649A
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led lamp
led
lamp pearl
divider resistance
pearl string
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陈跃
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JIEYANG LIYE OPTOELECTRONICS Co Ltd
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JIEYANG LIYE OPTOELECTRONICS Co Ltd
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    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
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    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
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    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
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Abstract

本发明公开了一种免分压电阻的LED灯珠串，所述LED灯珠串至少由两路LED支路并联构成；所述LED灯珠串包括多个不同颜色的LED灯珠；所述LED灯珠发出的颜色是由蓝色LED发出的蓝光透过封装胶调制而成。本发明是利用填充了特制封装胶的蓝色LED额定电压一致性，从而免除LED灯珠串的分压电阻。具有降低LED电路对电源接口的要求，提高LED电路的工作效率，解决了由于电流不一致引起的光亮一致性问题，节省了LED安装空间以及减少光衰，从而延长了LED使用寿命的特点。

Description

一种免分压电阻的LED灯珠串
技术领域
本发明涉及LED照明领域，尤其涉及一种免分压电阻的LED灯珠串。
背景技术
LED灯具有亮度高、使用寿命长、节能环保等优点，呈现逐渐取代传统照明灯的趋势，在照明装饰市场得到广泛的应用。
在LED的应用中，由于所采用的芯片外延衬底材料不一样和内在的电子特性不同，不同颜色的LED工作电压和电流有差别。比如红色LED的额定电压通常在1.8至2.2伏、蓝色LED的额定电压通常在3.2至3.5伏等。不同的额定电压导致不同颜色的LED连接成灯珠串时，为保证每一支路的LED都在自己额定电压下工作，需要在不同的支路中串联不同阻值的分压电阻。分压电阻的阻值需要根据实际应用情况，并经过计算得到，这就使得LED灯珠接入电源时对电源接口要求提高了，以保证每颗LED灯珠正常工作。
传统LED灯珠串的每条支路，采用3L+1R结构，即3个LED串联后再串上1个分压电阻900（如图1所示）。分压电阻用来保证与其串联的LED在额定工作状态下工作，阻值大小受与其串联的LED的颜色的影响。串联在每一支路的分压电阻消耗的是有功功率，且不断发热，严重影响整个LED电路的工作效率。
传统LED灯珠串的每条支路，由于颜色不同的LED额定电压不一致，分压电阻阻值的不一致，容易导致各支路电流的不一致，从而容易引起光亮不一致问题。
传统LED灯珠串需要串入分压电阻，其数量随着支路数的增加而增加，使得LED灯珠组装成LED灯珠串时，工作量提高了，同时也要考虑给分压电阻预留安装空间。
LED经过一段时间使用后，其光强会比原来的要低，这就是LED光衰。LED光衰与LED散热有很大关系。传统LED灯珠串中的分压电阻，不仅消耗有功功率，而且还发出热，如果不考虑好散热问题，将影响到LED光衰的大小，间接影响到LED的使用寿命。
发明内容
为解决上述技术问题，本发明的目的是提供一种免分压电阻的LED灯珠串，该灯珠串利用填充特制封装胶的颜色使LED额定电压一致性，从而免除LED灯珠串的分压电阻。
本发明的目的通过以下的技术方案来实现：
一种免分压电阻的LED灯珠串，所述LED灯珠串至少由两路LED支路并联构成；所述LED灯珠串包括多个不同颜色的LED灯珠；所述LED灯珠发出的颜色是由蓝色LED发出的蓝光透过封装胶调制而成。
与现有技术相比，本发明的一个或多个实施例可以具有如下优点：
由于本发明采用的LED颜色是由蓝色晶片发出的蓝光经过特制的封装胶调制而成的，因此本质上每颗LED灯珠都是蓝色LED，所以每个LED的额定电压相同，接入电源时，无需再计算每个分压电阻的阻值，大大方便了灯珠串的连接，降低了LED灯珠接入电源时对电源接口的要求。同时，由于每个LED额定电压相同，各支路电流相同，容易保障光亮一致性。
现有的LED灯珠串中串联在每一支路的分压电阻消耗的是有功功率，且不断发热，严重影响整个LED电路的工作效率。本发明为免分压电阻LED灯珠串，与现有的LED灯珠串相比免除了众多分压电阻，因此也免除了每一支路分压电阻消耗的有功功率，提高了整个LED电路的工作效率。
本发明LED灯珠串不需串入分压电阻，降低了LED灯珠组装成LED灯珠串时的工作量，同时无需考虑给分压电阻预留安装空间。
本发明LED灯珠串不需串入分压电阻，使得灯珠串减少了由分压电阻引起的那部分热量，降低了LED光衰，延长了LED的使用寿命。
本发明的其它特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本发明而了解。本发明的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。
附图说明
附图用来提供对本发明的进一步理解，并且构成说明书的一部分，与本发明的实施例共同用于解释本发明，并不构成对本发明的限制。在附图中：
图1是现有技术LED灯珠串电路图；
图2是免分压电阻LED灯珠串电路图；
图3是设置有封装胶的LED结构示意图。
具体实施方式
容易理解，根据本发明的技术方案，在不变更本发明的实质精神下，本领域的一般技术人员可以提出本发明的多个结构方式和制作方法。因此以下具体实施方式以及附图仅是本发明的技术方案的具体说明，而不应当视为本发明的全部或者视为本发明技术方案的限定或限制。
下面结合实施例及附图对本发明作进一步详细的描述。
图2是免分压电阻LED灯珠串电路结构，LED灯珠串至少由两路LED支路并联构成；所述LED灯珠串包括多个不同颜色的LED灯珠；所述LED灯珠发出的颜色是由蓝色LED发出的蓝光透过封装胶调制而成。
上述LED灯珠内设置有蓝色晶片，LED发出的颜色是由蓝色晶片发出蓝光，蓝光透过包含有荧光粉的封装胶变成多种颜色。
图3所示为设置有封装胶的LED结构示意图，LED灯珠包括晶片500、支架、银胶300、金线400、封装胶200和增透薄膜600；所述支架包括正极101、负极102和外壳103；所述晶片通过银胶固定在所述支架的负极上；所述金线通过焊接将晶片与支架正极连接；所述封装胶由荧光粉与硅胶构成，并覆盖于所述支架外壳的凹槽内，且与外壳上端面相平；所述增透薄膜设于封装胶与所述支架外壳的上方。
上述实施例提供的免分压电阻LED灯珠串所使用的LED灯珠提供多种颜色选择，LED灯珠的颜色是由蓝色LED发出的蓝光透过特制的封装胶200调制而成。
制作免分压电阻LED灯珠串的方法具体是利用填充了特制封装胶200的蓝色LED额定电压一致性，从而免除LED灯珠串的分压电阻。
一种免分压电阻LED灯珠串至少由两路LED支路700并联构成。
上述每一LED支路由三颗LED灯珠800串联而成，且不需要串联分压电阻。
所述透明支架外壳凹槽为从上而下边形收缩结构，且拔模角度为35～40°。
虽然本发明所揭露的实施方式如上，但所述的内容只是为了便于理解本发明而采用的实施方式，并非用以限定本发明。任何本发明所属技术领域内的技术人员，在不脱离本发明所揭露的精神和范围的前提下，可以在实施的形式上及细节上作任何的修改与变化，但本发明的专利保护范围，仍须以所附的权利要求书所界定的范围为准。

Claims (7)

1.一种免分压电阻的LED灯珠串，其特征在于，所述LED灯珠串至少由两路LED支路并联构成；所述LED灯珠串包括多个不同颜色的LED灯珠；所述LED灯珠发出的颜色是由蓝色LED发出的蓝光透过封装胶调制而成。
2.根据权利要求1所述的免分压电阻的LED灯珠串，其特征在于，所述封装胶为荧光粉和硅胶的混合物，该混合物覆盖于LED灯珠串透明支架外壳的凹槽内。
3.根据权利要求1所述的免分压电阻的LED灯珠串，所述LED灯珠内设置有蓝色晶片，LED发出的颜色是由蓝色晶片发出蓝光，蓝光透过包含有荧光粉的封装胶变成多种颜色。
4.根据权利要求1所述的免分压电阻的LED灯珠串，其特征在于，所述LED支路至少由三颗LED灯珠串联而成。
5.根据权利要求1所述的免分压电阻的LED灯珠串，其特征在于，所述LED灯珠包括晶片、支架、银胶、金线和增透薄膜；
所述支架包括正极、负极和外壳；
所述晶片通过银胶固定在所述支架的负极上；
所述金线通过焊接将晶片与支架正极连接；
所述增透薄膜设于封装胶与所述支架外壳的上方。
6.根据权利要求1所述的免分压电阻的LED灯珠串，其特征在于，所述透明支架外壳凹槽为从上而下边形收缩结构，且拔模角度为35～40°。
7.根据权利要求1所述的免分压电阻的LED灯珠串，其特征在于，所述封装胶后的LED额定电压相同。
CN2013103641760A 2013-08-20 2013-08-20 一种免分压电阻的led灯珠串 Pending CN103423649A (zh)

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Publication number Priority date Publication date Assignee Title
CN101075609A (zh) * 2006-05-15 2007-11-21 宏齐科技股份有限公司 发光二极管芯片的封装结构及其方法
CN101392892A (zh) * 2007-09-18 2009-03-25 华兴电子工业股份有限公司 具有高演色性的数组式发光装置
CN101826590A (zh) * 2010-04-20 2010-09-08 北京朗波尔光电股份有限公司 一种透镜注荧光胶的led灯及其封装方法
CN101994913A (zh) * 2009-08-28 2011-03-30 昆山冠辉精密电子有限公司 Led电子显示屏用3528rgb三合一led封装结构的改良
CN202058785U (zh) * 2010-09-19 2011-11-30 木林森股份有限公司 一种依靠荧光胶调色的新型led
CN102454909A (zh) * 2010-10-27 2012-05-16 展晶科技(深圳)有限公司 发光二极管灯条
CN202855798U (zh) * 2012-11-06 2013-04-03 南昌绿扬光电科技有限公司 一种可调光cob封装结构
CN202977524U (zh) * 2012-11-14 2013-06-05 深圳市深沃光电有限公司 贴片式led灯珠

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101075609A (zh) * 2006-05-15 2007-11-21 宏齐科技股份有限公司 发光二极管芯片的封装结构及其方法
CN101392892A (zh) * 2007-09-18 2009-03-25 华兴电子工业股份有限公司 具有高演色性的数组式发光装置
CN101994913A (zh) * 2009-08-28 2011-03-30 昆山冠辉精密电子有限公司 Led电子显示屏用3528rgb三合一led封装结构的改良
CN101826590A (zh) * 2010-04-20 2010-09-08 北京朗波尔光电股份有限公司 一种透镜注荧光胶的led灯及其封装方法
CN202058785U (zh) * 2010-09-19 2011-11-30 木林森股份有限公司 一种依靠荧光胶调色的新型led
CN102454909A (zh) * 2010-10-27 2012-05-16 展晶科技(深圳)有限公司 发光二极管灯条
CN202855798U (zh) * 2012-11-06 2013-04-03 南昌绿扬光电科技有限公司 一种可调光cob封装结构
CN202977524U (zh) * 2012-11-14 2013-06-05 深圳市深沃光电有限公司 贴片式led灯珠

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Application publication date: 20131204