CN202120985U - 一种表面贴装型全彩led - Google Patents

一种表面贴装型全彩led Download PDF

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Publication number
CN202120985U
CN202120985U CN 201120178141 CN201120178141U CN202120985U CN 202120985 U CN202120985 U CN 202120985U CN 201120178141 CN201120178141 CN 201120178141 CN 201120178141 U CN201120178141 U CN 201120178141U CN 202120985 U CN202120985 U CN 202120985U
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China
Prior art keywords
chip
model
utility
resin plate
color led
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Expired - Fee Related
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CN 201120178141
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English (en)
Inventor
龚文
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SHENZHEN JINGTAI CO., LTD.
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Shenzhen Jingtai Optoelectronics Co Ltd
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Priority to CN 201120178141 priority Critical patent/CN202120985U/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

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Abstract

本实用新型提供一种表面贴装型全彩LED，包括黑色BT树脂板、固定设置在所述BT树脂板上的芯片、用于连接所述芯片与所述BT树脂板的金线和用于密封保护所述芯片的封装胶体。本实用新型提供的表面贴装型全彩LED，其对比度高、成本更低、生产效率更高、一致性更好、质量更稳定且是模造一次成型。

Description

一种表面贴装型全彩LED
技术领域
本实用新型涉及LED制造技术领域，特别涉及一种表面贴装型全彩LED。
背景技术
传统型三合一表贴LED(发光二极管)灯，多采用PPA(聚对苯二甲酰对苯二胺)塑胶加镀银铜片合成底座，用液态环氧树脂采用滴胶工艺灌封成型，其中三合一是指将红色、绿色、蓝色三种不同颜色的LED芯片封装在同一PPA合成的底座内；采用上述结构的三合一表贴LED灯，存在下述问题：
1、采用滴胶工艺灌封成型，生产效率较低；
2、PPA塑胶加镀银铜片合成底座(支架)，成本高昂，整体LED价格偏贵，产品价格缺乏竞争力；
3、做成显示屏后因为是滴胶工艺灌封成型，单颗成品LED胶量差异较大，所以产品一致性较差；
4、PPA底座(支架)容易吸湿，导致胶体与PPA支架剥离，大大增加了显示屏死灯风险。
实用新型内容
本实用新型提供一种表面贴装型全彩LED，其对比度高、成本更低、生产效率更高、一致性更好、质量更稳定且是模造一次成型。
为了实现上述目的，本实用新型提供以下技术方案：
一种表面贴装型全彩LED，其特征在于，包括黑色BT(bismaleimidetriazine resin)树脂板、固定设置在所述BT树脂板上的芯片、用于连接所述芯片与所述BT树脂板的金线和用于密封保护所述芯片的封装胶体。
优选地，所有所述黑色BT树脂板组成在一起形成一个矩形BT树脂整体板，所述矩形BT树脂整体板的长度为2.0毫米，宽度2.0毫米。
通过实施以上技术方案，具有以下技术效果：本实用新型提供的表面贴装型全彩LED，其对比度高、成本更低、生产效率更高、一致性更好、质量更稳定且是模造一次成型。
附图说明
图1为本实用新型实施例提供的表面贴装型全彩LED的结构示意图(未封装)；
图2为本实用新型例提供的芯片封装结构示意图。
具体实施方式
为了更好的理解本实用新型的技术方案，下面结合附图详细描述本实用新型提供的实施例。
如图1和图2所示，本实用新型实施例提供的表面贴装型全彩LED，其包括全黑BT树脂板01、固定设置在所述BT树脂板01上的芯片02、用于连接所述芯片02与所述BT树脂板01的金线03、以及用于密封保护所述芯片02的封装胶体04。该芯片可以为红色、蓝色、绿色的芯片等。可以与全黑的BT树脂板01形成鲜明的对比，有利于使该表面贴装型全彩LED做成显示屏后对比度提高。
在本实施例中，优选的，所述所有全黑BT树脂板组成在一起形成的矩形BT树脂板整体的长度为2.0毫米，宽度2.0毫米。
该实施例提供的表面贴装型全彩LED的对比度高、成本更低、生产效率更高、一致性更好、质量更稳定且是模造一次成型，并完全可以替代PPA底座(TOP类【顶级类】)产品型号为2121的产品。
以上对本实用新型实施例所提供的一种表面贴装型全彩LED进行了详细介绍，对于本领域的一般技术人员，依据本实用新型实施例的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本实用新型的限制。

Claims (2)

1.一种表面贴装型全彩LED，其特征在于，包括黑色BT树脂板、固定设置在所述BT树脂板上的芯片、用于连接所述芯片与所述BT树脂板的金线和用于密封保护所述芯片的封装胶体。
2.如权利要求1所述所述表面贴装型全彩LED，其特征在于，所有所述黑色BT树脂板组成在一起形成一个矩形BT树脂整体板，所述矩形BT树脂整体板的长度为2.0毫米，宽度2.0毫米。
CN 201120178141 2011-05-27 2011-05-27 一种表面贴装型全彩led Expired - Fee Related CN202120985U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103247751A (zh) * 2012-02-07 2013-08-14 苏州东山精密制造股份有限公司 芯片封装结构及其方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103247751A (zh) * 2012-02-07 2013-08-14 苏州东山精密制造股份有限公司 芯片封装结构及其方法

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Owner name: SHENZHEN KINGLIGHT CO., LTD.

Free format text: FORMER NAME: JINGTAI OPTOELECTRONICS CO., LTD.

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Address after: 518000, Guangdong, Baoan District, Fuyong Shenzhen Street (Fu Garden Road on the west side) run Heng Industrial Plant No. 4 factory floor third, fourth, fifth

Patentee after: SHENZHEN JINGTAI CO., LTD.

Address before: 518000 Guangdong city of Shenzhen province Baoan District Xixiang Baoan Avenue Fisheries Industrial Park Building 4 floor B measurements

Patentee before: Shenzhen Jingtai Optoelectronics Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120118

Termination date: 20160527