CN203733831U - Led封装支架模组及其单体、led封装结构 - Google Patents
Led封装支架模组及其单体、led封装结构 Download PDFInfo
- Publication number
- CN203733831U CN203733831U CN201320865069.1U CN201320865069U CN203733831U CN 203733831 U CN203733831 U CN 203733831U CN 201320865069 U CN201320865069 U CN 201320865069U CN 203733831 U CN203733831 U CN 203733831U
- Authority
- CN
- China
- Prior art keywords
- metal lead
- lead wire
- pole plate
- monomer
- leg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320865069.1U CN203733831U (zh) | 2013-12-25 | 2013-12-25 | Led封装支架模组及其单体、led封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320865069.1U CN203733831U (zh) | 2013-12-25 | 2013-12-25 | Led封装支架模组及其单体、led封装结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN203733831U true CN203733831U (zh) | 2014-07-23 |
Family
ID=51203879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201320865069.1U Expired - Fee Related CN203733831U (zh) | 2013-12-25 | 2013-12-25 | Led封装支架模组及其单体、led封装结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN203733831U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103855275A (zh) * | 2013-12-25 | 2014-06-11 | 深圳市瑞丰光电子股份有限公司 | Led封装支架模组及其单体、led封装结构 |
CN108735874A (zh) * | 2018-08-09 | 2018-11-02 | 东莞市欧思科光电科技有限公司 | 热固型封装支架与嵌入式通讯ic集成封装的led及其工艺 |
-
2013
- 2013-12-25 CN CN201320865069.1U patent/CN203733831U/zh not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103855275A (zh) * | 2013-12-25 | 2014-06-11 | 深圳市瑞丰光电子股份有限公司 | Led封装支架模组及其单体、led封装结构 |
CN108735874A (zh) * | 2018-08-09 | 2018-11-02 | 东莞市欧思科光电科技有限公司 | 热固型封装支架与嵌入式通讯ic集成封装的led及其工艺 |
CN108735874B (zh) * | 2018-08-09 | 2024-02-13 | 东莞市欧思科光电科技有限公司 | 热固型封装支架与嵌入式通讯ic集成封装的led及其工艺 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160425 Address after: 201306, Shanghai, Nanhui, Pudong New Area new town, 1758 Hong Kong Road, No. 1, room 8650 Patentee after: SHANGHAI RUIFENG OPTOELECTRONICS Co.,Ltd. Address before: Shenzhen Nanshan District City, Guangdong province 518000 White Pine Road Baiwang letter Industrial Park two District Sixth. Patentee before: Shenzhen Refond Optoelectronics Co.,Ltd. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20210108 Address after: 518000, 6th floor, building 1, Tianliao community, Gongming office, Guangming New District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Refond Optoelectronics Co.,Ltd. Address before: 201306 room 8650, building 1, 1758 Luchaogang Road, Nanhui new town, Pudong New Area, Shanghai Patentee before: SHANGHAI RUIFENG OPTOELECTRONICS Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140723 Termination date: 20211225 |
|
CF01 | Termination of patent right due to non-payment of annual fee |