CN203608443U - 印刷电路和包括该印刷电路的电子模块 - Google Patents

印刷电路和包括该印刷电路的电子模块 Download PDF

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CN203608443U
CN203608443U CN201320451883.9U CN201320451883U CN203608443U CN 203608443 U CN203608443 U CN 203608443U CN 201320451883 U CN201320451883 U CN 201320451883U CN 203608443 U CN203608443 U CN 203608443U
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material layer
conductive material
printed circuit
conjugate foramen
complex
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S·迪厄-戈蒙
B·霍夫曼
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Linxens Holding SAS
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Abstract

本实用新型提供了一种印刷电路和包括该印刷电路的电子模块。本实用新型涉及制造用于智能卡模块的印刷电路的处理。该处理在于：生产通过绝缘材料层而彼此绝缘的两个导电材料层、穿过绝缘材料层延伸的并且被导电材料层中的一个导电材料层封闭的接合孔、在接合孔周围的没有另一个导电材料层中提供的导电材料的区域。本实用新型还涉及利用该处理模块制造的用于智能卡的印刷电路和包括这种印刷电路的智能卡模块。

Description

印刷电路和包括该印刷电路的电子模块
技术领域
本实用新型涉及印刷电路领域。这种印刷电路可以用于例如生产用于智能卡、RFID天线、发光二极管的电子模块。
以下使用用于智能卡的电子模块的示例对本实用新型进行了例示，但是容易转用到包括上述应用的印刷电路的其它应用。
背景技术
智能卡是公众已知的，其具有很多用途：信用卡、用于移动电话的SIM卡、交通卡、身份证等。
智能卡通常由组成大部分卡的刚塑性基板型PVC、PVC/ABS或者聚碳酸酯构成，在卡中包括有单独制造的电子模块。电子模块包括配备有电子芯片（集成电路）的总体上柔性的印刷电路，以及用于从芯片向智能卡读卡器设备发送数据（读取）或者从设备向卡发送数据（写入）的传送装置。这些数据传送装置可以是“接触式”、“非接触式”或者当组合“接触式”和“非接触式”两个模式时的“双模式”。
在“接触式”智能卡中，连接器具有电气连接到位于电子模块的表面处的芯片的接触区域，用于通过电气接触与读卡器设备连接。在“非接触式”智能卡中，数据通过在位于读卡器内的天线与位于卡本身中的天线之间操作的无线电波发送到芯片。在“双模式”智能卡中，传送装置既是“接触式”又是“非接触式”的，包括配备有唯一微芯片电子芯片的柔性电路的电子模块可以管理两种数据传送模式。
在下文，尤其关注包括通过绝缘材料层彼此隔离的多个导电材料层的印刷电路。更具体地，我们将关注在绝缘材料层中形成接合孔（连接孔）的这种印刷电路。这些电路例如是双面或者多层电路，其中图案（诸如导电导轨、电接触件、天线或者这些不同图案的组合）被蚀刻在这些层中的至少一个层中。
接合孔的优点之一是尤其允许导电导线穿过绝缘层。实际上，导电材料层中的一个层可以用于将芯片或者二极管连接到位于印刷电路的与设置芯片的面相对的一面上的接触焊盘。导线连接（例如，导线接合）到导电材料层的接合孔周围的导轨或者焊盘。或者导电导线直接连接到导电材料层中至少部分地填充接合孔的一部分。在此情况下，位于接合孔的正面的该层的表面可以用于连接导线的一个端部，而另一个端部连接到诸如芯片或者二极管这样的电子部件。
现有技术电路遇到的问题是：除了填充接合孔的那些处理之外的在导电材料层中的图案处理导致在接合孔周围形成导电材料环。实际上，除封闭接合孔的处理之外的在导电材料层中的图案处理需要蚀刻步骤。因此，在蚀刻步骤期间，接合孔必须被填充以保护（至少部分地）密封这些孔的导电材料层。为了确保蚀刻液不渗入接合孔，在每个接合孔周围维持大约50到250微米的光敏树脂环。在这些环的下方，将不去除导电材料层，因而在接合孔周围保留了导电材料环。如果在这些环中的一个环与导电导线之间建立了电气接触，则这些环可能是有问题的。
实用新型内容
本实用新型的目的是至少部分克服这个问题。这就是为何根据本实用新型提出印刷电路的制造处理，制造处理包括制造包含附接到绝缘基板的第一导电材料层和第二导电材料层在内的复合体。这些导电材料层可以覆盖绝缘基板的两个主表面以形成双面印刷电路。它们还可以提供两个多层印刷电路层（具有两个以上的导电材料层）。在此情况下，它们可以位于其上叠置了一个或几个其它绝缘或导电层的中间复合体（两个导电材料层通过绝缘基板彼此绝缘）中，或者它们可以位于已经包括两个以上的导电材料层的复合体中。在根据本实用新型的处理中，制造第一导电材料层和第二导电材料层的步骤的顺序并非总是特定的。在一些情况下，第一导电材料层可以在第二导电材料层之前或者之后进行。在一些其它情况下，根据本实用新型的处理的步骤可以插入在制造第一导电材料层和第二导电材料层的步骤之间。措辞“第一”或者“第二”并非必须指步骤的时序顺序。
其中第一导电材料层和第二导电材料层通过绝缘材料层彼此绝缘的复合体包括穿过绝缘材料层的至少一个接合孔。每个接合孔在隔离基板中延伸并且位于由第一导电材料层至少部分地封闭的底部与通向基板的面的开口之间。例如，第一导电材料层被布置在绝缘基板的先前已被穿孔以形成接合孔的一个面上。因此，第一导电材料层封闭接合孔。被涂覆和/或层压到基板上的第一导电材料层的这侧接着形成接合孔的底部。第一导电材料层可以是导电网格引线结构。接合孔的与形成底部的端部相对的相对端部被设计为保持开口以允许随后的连接导线通过。
根据本实用新型的处理包括通过光刻和蚀刻来制造第二导电材料层上的图案。如果电接触件被蚀刻到第一导电材料层中（接着构成用于智能卡模块的双面电路的接触面），则这些图案可以例如是第二导电材料层中的导电导轨和/或蚀刻的天线。
根据本实用新型的处理还包括对结合孔的保护操作。如上面所说明的，该操作对于在第二导电材料层的图案的蚀刻期间保护第一导电材料层是必需的。这种保护可以通过多种方式实现：涂覆树脂以填充接合孔、通过电泳或者喷墨法沉积光敏合成物等。在所有情况下，我们使用可溶材料，以便之后将其去除以清洁接合孔并且能够使其用于连接导线穿过。
根据本实用新型，在第二导电材料层上生成图案的独立步骤期间执行借助可溶材料对接合孔的保护。因而，可以用与限定第二导电材料层的图案的光敏膜不同的另一种材料来保护接合孔。通过解除这个限制，按步骤或者按照一系列特定步骤处理接合孔的保护和图案制造也变得可能。尤其是，在第二导电材料层上的图案制造期间，可以在第二导电材料层上清除接合孔周围至少10微米的没有导电材料的区域。
连接到接合孔的底部的导线将不再具有触及留在接合孔的边缘周围的导电环的风险。
根据第一种情形，通过在绝缘基板上涂覆和/或层压第一导电材料层后在该第一导电材料层上进行光刻来形成图案。在第二导电材料层上的图案制造之后进行对接合孔的保护操作。在此情况下，在第二导电材料层上的图案制造之后并且在绝缘基板上涂覆和/或层压第一导电材料层之前，还可以在绝缘材料基板中打接合孔（在本文中，当使用措辞“层压”或者“层压的”时，是指叠合层或者涂覆的和层压的）。
根据另一种情形，在第二导电材料层上制造图案之前进行对接合孔的保护操作。接着可以在第一导电材料层和第二导电材料层上于相同的步骤期间进行构图。用于保护接合孔的可溶材料可以是树脂，并且微显影（micro-development）的步骤可以位于在第一导电材料层和第二导电材料层上制造图案之前。
根据另一个方面，本实用新型涉及通过上述处理获得的印刷电路。该印刷电路包括复合体，该复合体包括：
-附接到绝缘基板的第一导电材料层和第二导电材料层，
-位于由第一导电材料层至少部分地封闭的底部与通向基板的面的开口之间在绝缘基板中延伸的至少一个接合孔，以及
-在第二导电材料层中的蚀刻图案。
另外，在接合孔周围存在没有第二导电材料层的导电材料的至少10微米的区域。
根据另一个方面，实用新型涉及包括如以上限定的印刷电路的智能卡模块。
本实用新型提供了一种包括复合体的印刷电路板，该复合体具有：
-附接到绝缘基板（20）的第一导电材料层（80）和第二导电材料层（10），
-位于由所述第一导电材料层（80）至少部分地封闭的底部（82）与通向所述绝缘基板（20）的一个面的开口（22）之间在所述绝缘基板（20）中延伸的至少一个接合孔（70），以及
-所述第二导电材料层（10）中的蚀刻的图案（50），其特征在于，所述复合体包括在所述接合孔（70）周围的没有所述第二导电材料层（10）的导电材料的至少10微米的区域（12）。
本实用新型提供了一种包括柔性印刷电路（3）的电子模块，所述柔性印刷电路（3）包括复合体，所述复合体具有：
-附接到绝缘基板（20）的第一导电材料层（80）和第二导电材料层（10），
-位于由所述第一导电材料层（80）至少部分地封闭的底部（82）与通向所述绝缘基板（20）的表面的开口（22）之间延伸到所述绝缘基板的至少一个接合孔（70），以及
-第二导电材料层（10）中的蚀刻的图案（50），其特征在于，所述复合体具有在所述接合孔（70）周围的没有所述第二导电材料层（10）的导电材料的至少10微米的区域（12）。
附图说明
本实用新型的其它规格和优点将在阅读以下详细描述和附图后变得清楚，其中：
-图1示出根据本实用新型的用于容纳印刷电路的智能卡的示意立体图；
-图2A到图2N示意地示出根据本实用新型的处理示例的不同步骤；
-图3A到图3I示意地示出根据本实用新型的另一个处理示例的不同步骤。
具体实施方式
以下将描述用于实现根据本实用新型的处理的多种方式。全部属于智能卡领域，但是如已经提到的，可以容易地转用到其它领域（RFID天线、LED等）中。如图1所示，智能卡1具有模块2。模块2包括印刷电路3和芯片100。模块2一般被制造为被插入到设置在卡1中的空腔4中的独立元件，
印刷电路3具有与芯片100连接的多个接触件5。印刷电路3由接触面6（正面）的图（在顶部）表示。还由其接合面7的图（在底部）表示。所示的印刷电路3对应于用于“双模式”卡的双面印刷电路，具有位于正面6上的接触件5和在接合面7上的天线8。
图2A到图2D示意性例示用于制造印刷电路3的根据本实用新型的示例处理的不同步骤。
如图2A所示，提供包括层压在电绝缘材料基板层20上的导电材料层10的结构。导电材料10可以是诸如铜钢、铝或者其合金的金属。导电材料层10的厚度例如是18μm或者25μm。绝缘材料20可以是电介质材料（玻璃-环氧树脂）或者塑料（PET、PEN、聚酰亚胺等）的复合类型。绝缘材料基板20通常较薄（其厚度例如在100微米量级）以持续地维持与电子模块3的制造处理相兼容的柔性。由被导电材料层10覆盖的绝缘材料基板20组成的组件形成柔性电路。导电材料层10和绝缘材料基板20形成层状复合体，根据英语术语还被称为“铜箔（copper clad）”（如果导电材料层10基本上由铜组成）。
在下一步骤中，如图2B所示，在导电材料层10上层压或者涂覆光敏树脂膜或层30。
该光敏树脂膜30接着通过掩模40被曝光（图2C），并且被显影（图2D），以允许树脂延伸到导电层10的要变为图案50（导电导轨、天线等）的区域。
蚀刻（图2E）之后，除了要变为图案50的区域之外，绝缘材料基板20再次露出。保护树脂30接着被去除以允许图案50露出（图2F）。
在未示出的步骤中，在绝缘材料基板20的与承载图案50的面相对的的面上沉积粘结层60（具有例如20μm的数量级的厚度）。
接着穿过绝缘材料基板20和粘结层60打出接合孔70（图2G）。接着，在粘结材料层60上层压另一个导电材料层80（图2H）。新的导电材料层80可以由上述提到的形成先前的导电材料层10的材料中的一种材料组成。如所例示的，接合孔70在其一个端部处被新的导电材料层80覆盖和封闭。新的导电材料层80可以由上述提到的先前形成导电材料层10的材料中的一种材料组成。如所例示的，接合孔70在其一个端部处被新的导电材料层80覆盖和封闭。
在图2I所示的步骤中，两个光敏树脂膜32、34分别被层压到由两个导电层10、80和绝缘材料基板20组成的复合体的一个面上。
两个光敏树脂膜32、34中的一个（34）接着通过掩模42被曝光（图2J），接着被显影（图2K），以允许树脂延伸到导电层80的要变为图案50（导电导轨、天线等）区域。
在蚀刻（图2L）并去除两个光敏树脂膜32、34（图2M）之后，获得包括复合体的印刷电路，该复合体具有：
-附接到绝缘基板20的第一导电材料层80和第二导电材料层10，
-在绝缘基板20中延伸的位于被第一导电材料层80至少部分地封闭的底部82与通向绝缘基板20的一个面的开口22之间的至少一个接合孔70，以及
-在第二导电材料层10中的蚀刻的图案50。
该复合体具有在接合孔70周围没有第二导电材料层10的导电材料的至少10微米的区域12。
该复合体可以用于生产模块2（图2N），其中连接导线90在接合孔70的底部82通过它们的一个端部焊接到第一导电材料层80的接合面，而连接导线90的另一个端部焊接到芯片100。
图3A到图3I示意性例示用于制造印刷电路3的根据本实用新型的另一个处理示例的不同步骤。
如图3A所示，提供包括层压在电绝缘材料基板20上的两个导电材料层10、80的结构。导电材料和电绝缘材料的特性和厚度可以与关于实现以上方法的方法提到的材料的特性和厚度相似。图3A的结构基本上与图2H的结构相同。差别主要由于第二导电材料层10不包括图案50。
在图3B中例示的下一步骤中，接合孔70被树脂36保护。该树脂36可以通过涂覆、喷射或者电泳而被设置或者沉积在接合孔70中。树脂36对用于制造印刷电路的蚀刻槽有抵抗力。其可以是光敏的或者也可以不是。
接着光敏树脂36可以经受微显影。
根据树脂36在接合孔70中的沉积方法，可以在第二导电材料层10的表面上保留小的厚度。通过微显影的步骤去除该剩余沉积物，使得第二导电材料层10的表面清洁。微显影的特性依赖于树脂36。例如，其可以是化学的。
在图3D所示的步骤中，两个光敏树脂膜32、34分别被层压在由两个导电层10、80和绝缘材料基板20组成的复合体的一个面上。
树脂36在树脂32、34的显影槽中一定不能是可溶的。
两个光敏树脂膜32、34接着通过掩模40、42被曝光（图3E），接着被显影（图3F），以留下导电材料的导电材料层10、80的要变为图案50（接触件、导电导轨、天线等）的区域上的树脂32、34。
在蚀刻（图3G）并去除两个光敏树脂膜32、34和树脂36（图3H）之后，获得包括与图2M的复合体相同的复合体的印刷电路。
如之前所述，该复合体可以用于生产与图2N的模块相似的模块2（图3I）。
另选地，光敏树脂36通过电泳被涂覆在所有导电表面上。因此，在孔中以及在第一导电材料层80和第二导电材料层10的每个面上存在树脂36。微显影的步骤允许去除在第二导电材料层10的面上的树脂36。另一方面，树脂36保留在第一导电材料层80上。接着在第二导电材料层10的表面上层压与树脂36具有相反极性（正或者负）的膜或者树脂。接着，实现步骤3E和以下步骤。
通过上述一个或者另一个实现模式获得的模块2与智能卡模块组装的公共处理和技术（芯片附接、引线接合、UV或热封装）持续地兼容，并且与将模块插入卡体的通常处理兼容。

Claims (2)

1.一种印刷电路（3），该印刷电路包括复合体，该复合体具有： 
-附接到绝缘基板（20）的第一导电材料层（80）和第二导电材料层（10）， 
-位于由所述第一导电材料层（80）至少部分地封闭的底部（82）与通向所述绝缘基板（20）的一个面的开口（22）之间在所述绝缘基板（20）中延伸的至少一个接合孔（70），以及 
-在所述第二导电材料层（10）中的蚀刻的图案（50），其特征在于，所述复合体包括在所述接合孔（70）周围的没有所述第二导电材料层（10）的导电材料的至少10微米的区域（12）。 
2.一种包括印刷电路（3）的电子模块，所述印刷电路（3）是柔性印刷电路并且包括复合体，所述复合体具有： 
-附接到绝缘基板（20）的第一导电材料层（80）和第二导电材料层（10）， 
-位于由所述第一导电材料层（80）至少部分地封闭的底部（82）与通向所述绝缘基板（20）的表面的开口（22）之间延伸到所述绝缘基板的至少一个接合孔（70），以及 
-所述第二导电材料层（10）中的蚀刻的图案（50），其特征在于，所述复合体具有在所述接合孔（70）周围的没有所述第二导电材料层（10）的导电材料的至少10微米的区域（12）。 
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CN105637984B (zh) 2018-10-02
FR3006551B1 (fr) 2016-12-09
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EP3005846A1 (fr) 2016-04-13
FR3006551A1 (fr) 2014-12-05
KR20160014009A (ko) 2016-02-05
CN105637984A (zh) 2016-06-01
WO2014191428A1 (fr) 2014-12-04
US9583459B2 (en) 2017-02-28
EP3005846B1 (fr) 2023-12-13
KR102271136B1 (ko) 2021-06-29

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