CN103020694B - 无铜环双界面智能卡封装框架 - Google Patents
无铜环双界面智能卡封装框架 Download PDFInfo
- Publication number
- CN103020694B CN103020694B CN201210508249.4A CN201210508249A CN103020694B CN 103020694 B CN103020694 B CN 103020694B CN 201210508249 A CN201210508249 A CN 201210508249A CN 103020694 B CN103020694 B CN 103020694B
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- Prior art keywords
- contact layer
- basic unit
- copper ring
- smart card
- packaging frame
- Prior art date
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 45
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 23
- 238000003466 welding Methods 0.000 claims abstract description 25
- 239000004020 conductor Substances 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 8
- 241000218202 Coptis Species 0.000 claims description 5
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 2
- 238000012545 processing Methods 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 10
- 238000013461 design Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
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Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210508249.4A CN103020694B (zh) | 2012-12-03 | 2012-12-03 | 无铜环双界面智能卡封装框架 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210508249.4A CN103020694B (zh) | 2012-12-03 | 2012-12-03 | 无铜环双界面智能卡封装框架 |
Publications (2)
Publication Number | Publication Date |
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CN103020694A CN103020694A (zh) | 2013-04-03 |
CN103020694B true CN103020694B (zh) | 2015-08-26 |
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CN201210508249.4A Active CN103020694B (zh) | 2012-12-03 | 2012-12-03 | 无铜环双界面智能卡封装框架 |
Country Status (1)
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CN (1) | CN103020694B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3006551B1 (fr) | 2013-05-30 | 2016-12-09 | Linxens Holding | Procede de fabrication d'un circuit imprime, circuit imprime obtenu par ce procede et module electronique comportant un tel circuit imprime |
CN115939074B (zh) * | 2023-03-13 | 2023-08-22 | 新恒汇电子股份有限公司 | 一种新型双面柔性引线框架结构及其制备工艺 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6049463A (en) * | 1997-07-25 | 2000-04-11 | Motorola, Inc. | Microelectronic assembly including an antenna element embedded within a polymeric card, and method for forming same |
CN1386396A (zh) * | 2000-07-13 | 2002-12-18 | 三井金属鉱业株式会社 | 覆铜箔层压板的制造方法 |
CN1640216A (zh) * | 2002-02-22 | 2005-07-13 | 株式会社藤仓 | 多层线路基板、多层线路基板用基材、印刷线路基板及其制造方法 |
CN102446868A (zh) * | 2011-12-28 | 2012-05-09 | 上海长丰智能卡有限公司 | 一种新型双界面智能卡模块及其实现方式 |
CN102664176A (zh) * | 2012-03-24 | 2012-09-12 | 上海祯显电子科技有限公司 | 载带 |
CN203012762U (zh) * | 2012-12-03 | 2013-06-19 | 山东恒汇电子科技有限公司 | 无铜环双界面智能卡封装框架 |
-
2012
- 2012-12-03 CN CN201210508249.4A patent/CN103020694B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6049463A (en) * | 1997-07-25 | 2000-04-11 | Motorola, Inc. | Microelectronic assembly including an antenna element embedded within a polymeric card, and method for forming same |
CN1386396A (zh) * | 2000-07-13 | 2002-12-18 | 三井金属鉱业株式会社 | 覆铜箔层压板的制造方法 |
CN1640216A (zh) * | 2002-02-22 | 2005-07-13 | 株式会社藤仓 | 多层线路基板、多层线路基板用基材、印刷线路基板及其制造方法 |
CN102446868A (zh) * | 2011-12-28 | 2012-05-09 | 上海长丰智能卡有限公司 | 一种新型双界面智能卡模块及其实现方式 |
CN102664176A (zh) * | 2012-03-24 | 2012-09-12 | 上海祯显电子科技有限公司 | 载带 |
CN203012762U (zh) * | 2012-12-03 | 2013-06-19 | 山东恒汇电子科技有限公司 | 无铜环双界面智能卡封装框架 |
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Address after: 255086 No. 187, run Avenue, Zibo hi tech Industrial Development Zone, Shandong, China Applicant after: HENGHUI ELECTRONICS TECHNOLOGY CO., LTD. Address before: 255086 No. 187, run Avenue, Zibo hi tech Industrial Development Zone, Shandong, China Applicant before: Henghui Electronics Technology Co., Ltd. |
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Address after: 255088 No. 187 middle run road, hi tech Zone, Zibo, Shandong Patentee after: New Henghui Electronics Co.,Ltd. Address before: 255088 No. 187 middle run road, hi tech Zone, Zibo, Shandong Patentee before: SHANDONG XINHENGHUI ELECTRONICS TECHNOLOGY Co.,Ltd. |
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