CN203012762U - 无铜环双界面智能卡封装框架 - Google Patents
无铜环双界面智能卡封装框架 Download PDFInfo
- Publication number
- CN203012762U CN203012762U CN 201220654242 CN201220654242U CN203012762U CN 203012762 U CN203012762 U CN 203012762U CN 201220654242 CN201220654242 CN 201220654242 CN 201220654242 U CN201220654242 U CN 201220654242U CN 203012762 U CN203012762 U CN 203012762U
- Authority
- CN
- China
- Prior art keywords
- contact layer
- copper ring
- smart card
- basic unit
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 49
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 13
- 239000010949 copper Substances 0.000 title claims abstract description 13
- 238000003466 welding Methods 0.000 claims abstract description 27
- 239000004020 conductor Substances 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 8
- 238000004806 packaging method and process Methods 0.000 claims description 22
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 8
- 241000218202 Coptis Species 0.000 claims description 5
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000000034 method Methods 0.000 description 10
- 238000005530 etching Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000004080 punching Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Images
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220654242 CN203012762U (zh) | 2012-12-03 | 2012-12-03 | 无铜环双界面智能卡封装框架 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220654242 CN203012762U (zh) | 2012-12-03 | 2012-12-03 | 无铜环双界面智能卡封装框架 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN203012762U true CN203012762U (zh) | 2013-06-19 |
Family
ID=48604335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201220654242 Expired - Lifetime CN203012762U (zh) | 2012-12-03 | 2012-12-03 | 无铜环双界面智能卡封装框架 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN203012762U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103020694A (zh) * | 2012-12-03 | 2013-04-03 | 山东恒汇电子科技有限公司 | 无铜环双界面智能卡封装框架 |
-
2012
- 2012-12-03 CN CN 201220654242 patent/CN203012762U/zh not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103020694A (zh) * | 2012-12-03 | 2013-04-03 | 山东恒汇电子科技有限公司 | 无铜环双界面智能卡封装框架 |
CN103020694B (zh) * | 2012-12-03 | 2015-08-26 | 恒汇电子科技有限公司 | 无铜环双界面智能卡封装框架 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9272370B2 (en) | Laser ablating structures for antenna modules for dual interface smartcards | |
CN103020694B (zh) | 无铜环双界面智能卡封装框架 | |
US10706346B2 (en) | Method for manufacturing a smart card module and a smart card | |
CN203012762U (zh) | 无铜环双界面智能卡封装框架 | |
CN102446868A (zh) | 一种新型双界面智能卡模块及其实现方式 | |
CN105990269A (zh) | 一种指纹识别芯片封装结构及其封装方法 | |
CN203312286U (zh) | 一种全卡支付智能卡载带 | |
CN102013418B (zh) | 一种手机卡封装用pcb载带 | |
CN209447207U (zh) | 一种智能卡模块 | |
CN205211727U (zh) | 一种指纹识别多芯片封装结构 | |
CN103746181A (zh) | Nfc天线及其制作方法 | |
CN104167403A (zh) | 多脚封装的引线框架 | |
CN208752661U (zh) | 一种双界面卡条带 | |
CN102376012B (zh) | 一种双界面智能卡 | |
CN102013419A (zh) | 一种微型射频模块封装用载带 | |
JP2003531033A (ja) | モジュールカード及びその製造方法 | |
CN220064833U (zh) | 一种双界面模块结构 | |
CN202306619U (zh) | 一种基于金凸点封装的非接触式智能卡 | |
CN109800845A (zh) | 一种智能卡模块的实现方法及一种智能卡模块 | |
CN102955976B (zh) | 一种易碎防伪rfid蚀刻电子标签及其制造工艺 | |
CN208752663U (zh) | 一种双界面卡的ic卡芯片结构 | |
CN109086856A (zh) | 一种双界面卡条带及其制备方法 | |
CN206179828U (zh) | 新型无腔体智能卡 | |
CN202930375U (zh) | 一种小型模塑封装卡用框架以及框架带 | |
CN103887268B (zh) | 一种微型模塑封装手机卡用框架以及框架带 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 255086 No. 187, run Avenue, Zibo hi tech Industrial Development Zone, Shandong, China Patentee after: HENGHUI ELECTRONICS TECHNOLOGY Co.,Ltd. Address before: 255086 No. 187, run Avenue, Zibo hi tech Industrial Development Zone, Shandong, China Patentee before: HENGHUI ELECTRONICS TECHNOLOGY Co.,Ltd. |
|
PP01 | Preservation of patent right |
Effective date of registration: 20160617 Granted publication date: 20130619 |
|
RINS | Preservation of patent right or utility model and its discharge | ||
PD01 | Discharge of preservation of patent |
Date of cancellation: 20161217 Granted publication date: 20130619 |
|
PP01 | Preservation of patent right |
Effective date of registration: 20161215 Granted publication date: 20130619 |
|
PD01 | Discharge of preservation of patent | ||
PD01 | Discharge of preservation of patent |
Date of cancellation: 20180213 Granted publication date: 20130619 |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180726 Address after: 255088 No. 187 middle run road, hi tech Zone, Zibo, Shandong Patentee after: SHANDONG XINHENGHUI ELECTRONICS TECHNOLOGY Co.,Ltd. Address before: 255086 No. 187, Zhong run Avenue, high tech Industrial Development Zone, Zibo, Shandong. Patentee before: HENGHUI ELECTRONICS TECHNOLOGY Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 255088 No. 187 middle run road, hi tech Zone, Zibo, Shandong Patentee after: New Henghui Electronics Co.,Ltd. Address before: 255088 No. 187 middle run road, hi tech Zone, Zibo, Shandong Patentee before: SHANDONG XINHENGHUI ELECTRONICS TECHNOLOGY Co.,Ltd. |
|
CX01 | Expiry of patent term |
Granted publication date: 20130619 |
|
CX01 | Expiry of patent term |