CN203367352U - 一种防眩光雾化led灯 - Google Patents

一种防眩光雾化led灯 Download PDF

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CN203367352U
CN203367352U CN2013203138476U CN201320313847U CN203367352U CN 203367352 U CN203367352 U CN 203367352U CN 2013203138476 U CN2013203138476 U CN 2013203138476U CN 201320313847 U CN201320313847 U CN 201320313847U CN 203367352 U CN203367352 U CN 203367352U
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led
led lamp
atomization
glare
colloid
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林介本
郭震宁
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FUJIAN QUANZHOU WORLDSLIGHTING Co Ltd
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FUJIAN QUANZHOU WORLDSLIGHTING Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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Abstract

本实用新型公开一种防眩光雾化LED灯，包括LED基架、LED芯片及荧光胶层；该LED芯片通过引线与所述LED基架的焊盘相电连接，所述荧光胶层封装在所述LED芯片外围处；在所述荧光胶层外围封装有乳白色的光学胶体。采用乳白色的光学胶体替代传统的透明胶体，有效改善了LED灯的光斑和眩光问题，使LED灯出光柔和，光色均匀、饱满，是制造LED灯具的最佳选择。

Description

一种防眩光雾化LED灯
技术领域
本实用新型涉及一种LED灯，具体是指一种防眩光雾化LED灯。
背景技术
随着LED外延与芯片技术的发展，LED灯也从直插式(包含F5草帽型）、贴片式（包含3528、5050、3535等）、大功率（包含仿流明型、集成大功率）发展到2010年以来成为行业焦点的COB封装形式。不论是上述的任何一种LED灯都遇到一个非常棘手并亟待解决的问题，即：当LED灯应用于LED灯具时，LED灯的光强分布满足朗伯型分布，在灯具组装时，人们往往采用二次光学（透镜或反光杯等手段）进行均匀照明、蝙蝠翼型等配光设计，而LED灯的颜色空间均匀性却长期得不到有效的解决，工厂生产出来的LED灯照射时往往有中间暖外圈冷，或者中间冷外圈暖的光斑不均匀问题，而且容易产生眩光问题，给人眼造成不舒适感。
为了解决上述问题，目前业者采取的办法是：（1）在荧光胶内混合扩散粉，使LED芯片激发黄色荧光粉时光散射，消除LED灯出射白光的光斑问题；（2）在LED灯具的外罩上采用扩散亚克力或玻璃罩子，使人们可以直接对视LED灯具，看不到LED灯颗粒，同时在一定程度上消除近LED灯产生的眩光。然而，方法（1）所制造的LED灯近似为点光源，且其光学胶体部分(即环氧树脂)为透明，容易产生眩光，给人不舒适感。方法（2）虽然一定程度上消除了眩光问题，但其需要借助外界辅助配件，实质上未真正解决LED灯出光的光斑及眩光问题。
有鉴于此，为了解决LED灯的光斑和眩光问题是LED瓶颈技术问题，本发明人针对LED灯的封装工艺和材料深入研究，发明一种防眩光雾化LED灯，本案由此产生。
实用新型内容
本实用新型的目的在于提供一种防眩光雾化LED灯，其具有雾化外观特征，并达到使LED灯光斑均匀、消除眩光问题的优良效果。
为了达成上述目的，本实用新型的解决方案是：
一种防眩光雾化LED灯，包括LED基架、LED芯片及荧光胶层；该LED芯片通过引线与所述LED基架的焊盘相电连接，所述荧光胶层封装在所述LED芯片外围处；在所述荧光胶层外围封装有乳白色的光学胶体。
所述LED基架为LED支架或者LED基板。
采用上述方案后，本新型相对于现有技术的有益效果在于：采用乳白色的光学胶体替代传统的透明胶体，使LED灯消除了传统封装工艺形成的黄圈或蓝圈问题，实现光斑均匀，且照射范围内点与点之间的色温差值小于200K，有利于光环境和人眼视觉健康。而且还使LED灯消除了传统由于采用透明胶体形成的眩光现象，在LED点亮时，人眼可直接对视LED灯，LED灯光线饱满、柔和。故而本新型LED灯有效改善了LED灯的光斑和眩光问题，使LED灯出光柔和、光色均匀，是制造LED灯具的最佳选择。
附图说明
图1是本新型实施例一的结构示意图；
图2是本新型实施例二的结构示意图；
图3是本新型实施例三的结构示意图。
标号说明
LED基架    1   LED芯片   2
荧光胶层   3   引线      4
光学胶体   5
具体实施方式
下面结合附图和具体实施方式对本作进一步详细的说明。
本新型涉及一种防眩光雾化LED灯，如图1-3所示，主要包括LED基架1、LED芯片2及荧光胶层3。LED芯片2通过引线4与LED基架1的焊盘相电连接，荧光胶层3封装在LED芯片2外围处。
本新型的主要创新点在于：在荧光胶层3外围封装有乳白色的光学胶体5。该乳白色的光学胶体5为公知产品，呈乳白状，具体为在环氧树脂或硅胶内混合光扩散粉制备而成，所述光扩散粉为纳米扩散材料，主要成分为硅元素，具有抗UV，高温下无黄变或变色现象。光线从乳白色的光学胶体5内透射出，在不降低照明度前提下，带来一种雾化搬的饱满且柔和的视觉效果。
本案采用乳白色的光学胶体5替代传统的透明胶体，使LED灯消除了传统封装工艺形成的黄圈或蓝圈问题，实现光斑均匀，且照射范围内点与点之间的色温差值小于200K，有利于光环境和人眼视觉健康。而且还使LED灯消除了传统由于采用透明胶体形成的眩光现象，在LED点亮时，光饱满地分布于乳白色的光学胶体5，照射光斑分布均匀，LED灯光线饱满、柔和，人眼可直接对视LED灯。故而本新型LED灯有效改善了LED灯的光斑和眩光问题，使LED灯出光柔和、光色均匀，是制造LED灯具的最佳选择。
本新型防眩光雾化LED灯可应用于直插式、贴片式、大功率和COB等各种形式的封装结构，对应LED基架1呈现不同的结构，如图2-4给出三种实施例，图1为直插式DIP雾化LED光源，LED基架1为直插式LED支架，图2为大功率雾化LED光源，LED基架1为座式LED支架，图3为COB雾化LED光源，LED基架1为LED基板。
以上所述仅为本新型的优选实施例，凡跟本新型权利要求范围所做的均等变化和修饰，均应属于本新型权利要求的范围。

Claims (2)

1.一种防眩光雾化LED灯，包括LED基架、LED芯片及荧光胶层；该LED芯片通过引线与所述LED基架的焊盘相电连接；其特征在于：所述荧光胶层封装在所述LED芯片外围处，在所述荧光胶层外围封装有乳白色的光学胶体。
2.如权利要求1所述的一种防眩光雾化LED灯，其特征在于：所述LED基架为LED支架或者LED基板。
CN2013203138476U 2013-06-03 2013-06-03 一种防眩光雾化led灯 Expired - Fee Related CN203367352U (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104900790A (zh) * 2015-05-13 2015-09-09 福建泉州世光照明科技有限公司 一种led光源雾化封装胶体及雾化led光源
CN106601897A (zh) * 2017-01-10 2017-04-26 蔡艺伟 一种板上集成光源cob封装白色胶面的制作方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104900790A (zh) * 2015-05-13 2015-09-09 福建泉州世光照明科技有限公司 一种led光源雾化封装胶体及雾化led光源
CN106601897A (zh) * 2017-01-10 2017-04-26 蔡艺伟 一种板上集成光源cob封装白色胶面的制作方法
CN106601897B (zh) * 2017-01-10 2018-11-13 蔡艺伟 一种板上集成光源cob封装白色胶面的制作方法

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