CN205508862U - 一种视觉均匀的白光led封装装置 - Google Patents

一种视觉均匀的白光led封装装置 Download PDF

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Publication number
CN205508862U
CN205508862U CN201620115093.7U CN201620115093U CN205508862U CN 205508862 U CN205508862 U CN 205508862U CN 201620115093 U CN201620115093 U CN 201620115093U CN 205508862 U CN205508862 U CN 205508862U
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square cavity
light
single electrode
cavity
electrode chip
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CN201620115093.7U
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李俊东
李绍军
张仲元
张钟文
柳欢
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SHENZHEN SMALITE OPTO-ELECTRONIC Co Ltd
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SHENZHEN SMALITE OPTO-ELECTRONIC Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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Abstract

本实用新型公开了一种视觉均匀的白光LED封装装置,它涉及LED封装领域,大方形凹腔的底部设置有垂直单电极芯片,通过导线将垂直单电极芯片表面电极与小方形凹腔的底部连接,大方形凹腔和小方形凹腔的上表面设有圆形碗杯,垂直单电极芯片的表面涂敷有荧光胶,并与大方形凹腔平齐,圆形碗杯和小方形凹腔内涂覆有透明封装胶。它所涉及到的垂直单电极芯片为正表面发光,其余表面不发光,由此所发出的光激发表面的荧光物质,所得到光线比较均匀,光线经过圆形碗杯内透明封装胶的二次折射,使得整体出光光斑更加均匀,无炫光,无杂光,解决了现有技术上的不足。

Description

一种视觉均匀的白光LED封装装置
技术领域
本实用新型涉及一种视觉均匀的白光LED封装装置,属于LED封装技术领域。
背景技术
LED发光二极管是一种新型表面贴装式半导体发光器件,具有体积小、散射角大、发光均匀性好、可靠性高、低功耗、响应速度快等优点,发光颜色包括白光在内的各种颜色,因此被广泛应用在各种电子产品上。主要包括以下几个方面的应用:中小型背光源、照明领域、装饰灯、仪器仪表显示灯等。LED封装过程既是完成芯片与支架的电气连接,又能起到保护芯片和导线的正常工作,以实现产品稳定性工作。
现有行业上LED封装结构虽然能够获得白光,但是由于封装胶水上表面为水平状,芯片上表面和侧面发出的光所激发的荧光粉量不一致,侧面激发的荧光粉相对较多,上表面激发的荧光粉相对较少,造成整体发光颜色不均匀,形成黄色光斑。
发明内容
针对上述问题,本实用新型要解决的技术问题是提供一种视觉均匀的白光LED封装装置。
本实用新型的一种视觉均匀的白光LED封装装置,它包含封装支架、垂直单电极芯片、导线、荧光胶、透明封装胶、大方形凹腔、小方形凹腔和圆形碗杯,大方形凹腔的底部设置有垂直单电极芯片,通过导线将垂直单电极芯片表面电极与小方形凹腔的底部连接,大方形凹腔和小方形凹腔的上表面设有圆形碗杯,垂直单电极芯片的表面涂敷有荧光胶,并与大方形凹腔平齐,圆形碗杯和小方形凹腔内涂覆有透明封装胶。
本实用新型的有益效果:它所涉及到的垂直单电极芯片为正表面发光,其余表面不发光,由此所发出的光激发表面的荧光物质,所得到光线比较均匀,光线经过圆形碗杯内透明封装胶的二次折射,使得整体出光光斑更加均匀,无炫光,无杂光,解决了现有技术上的不足。
附图说明:
为了易于说明,本实用新型由下述的具体实施及附图作以详细描述。
图1为本实用新型的结构示意图;
图2为本实用新型的剖视图。
1-封装支架;2-垂直单电极芯片;3-导线;4-荧光胶;5-透明封装胶;6-大方形凹腔;7-小方形凹腔;8-圆形碗杯。
具体实施方式:
如图1,图2所示,本具体实施方式采用以下技术方案:它包含封装支架1、垂直单电极芯片2、导线3、荧光胶4、透明封装胶5、大方形凹腔6、小方形凹腔7和圆形碗杯8,大方形凹腔6的底部设置有垂直单电极芯片2,通过导线3将垂直单电极芯片2表面电极与小方形凹腔7的底部连接,大方形凹腔6和小方形凹腔7的上表面设有圆形碗杯8,垂直单电极芯片2的表面涂敷有荧光胶4,并与大方形凹腔6平齐,圆形碗杯8和小方形凹腔7内涂覆有透明封装胶5。
本具体实施方式所涉及到的垂直单电极芯片为正表面发光,其余表面不发光,由此所发出的光激发表面的荧光物质,所得到光线比较均匀,光线经过圆形碗杯内透明封装胶的二次折射,使得整体出光光斑更加均匀,无炫光,无杂光,解决了现有技术上的不足。
以上显示和描述了本实用新型的基本原理和主要特征和本实用新型的优点。本行业的技术人员应该了解,本实用新型不受上述实施例的限制,上述实施例和说明书中描述的只是说明本实用新型的原理,在不脱离本实用新型精神和范围的前提下,本实用新型还会有各种变化和改进,这些变化和改进都落入要求保护的本实用新型范围内。本实用新型要求保护范围由所附的权利要求书及其等效物界定。

Claims (1)

1.一种视觉均匀的白光LED封装装置,其特征在于:它包含封装支架(1)、垂直单电极芯片(2)、导线(3)、荧光胶(4)、透明封装胶(5)、大方形凹腔(6)、小方形凹腔(7)和圆形碗杯(8),大方形凹腔(6)的底部设置有垂直单电极芯片(2),通过导线(3)将垂直单电极芯片(2)表面电极与小方形凹腔(7)的底部连接,大方形凹腔(6)和小方形凹腔(7)的上表面设有圆形碗杯(8),垂直单电极芯片(2)的表面涂敷有荧光胶(4),并与大方形凹腔(6)平齐,圆形碗杯(8)和小方形凹腔(7)内涂覆有透明封装胶(5)。
CN201620115093.7U 2016-02-05 2016-02-05 一种视觉均匀的白光led封装装置 Active CN205508862U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107195754A (zh) * 2017-06-30 2017-09-22 深圳市宇亮光电技术有限公司 一种消除黄色光斑的led封装结构及封装方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107195754A (zh) * 2017-06-30 2017-09-22 深圳市宇亮光电技术有限公司 一种消除黄色光斑的led封装结构及封装方法

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