CN105047796B - 一种全周光led光源及其制备方法 - Google Patents

一种全周光led光源及其制备方法 Download PDF

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CN105047796B
CN105047796B CN201510554129.1A CN201510554129A CN105047796B CN 105047796 B CN105047796 B CN 105047796B CN 201510554129 A CN201510554129 A CN 201510554129A CN 105047796 B CN105047796 B CN 105047796B
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魏武兴
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Ruilong Optoelectronic Technology Co ltd
Zhongshan Quanxin Intelligent Lighting Co ltd
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    • HELECTRICITY
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • HELECTRICITY
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    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
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    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/42Wire connectors; Manufacturing methods related thereto
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    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
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    • HELECTRICITY
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Abstract

本发明提供了一种全周光LED光源及其制备方法,全周光LED光源包括引脚支架,所述引脚支架由一个平面主体和两个引脚组成;LED芯片;波长转换部;LED芯片通过焊接导线固定于所述引脚支架的平面主体上;与平面主体一起封装于波长转换部中间,所述引脚支架的两个引脚伸出波长转换部的外部,分别与电源的正、负极连接。本发明的全周光LED光源,通过将LED芯片整个封装于波长转换部内,实现360°全周光发光,结构简单,同时由于改善了波长转换部的结构,使其体积增大,尤其当多个芯片一起封装时,这样在制造过程中,精度便于控制,色温一致性得以提高。本发明的制备方法简单,易于质控,产品精度好,色温均匀,一致性得到提高。

Description

一种全周光LED光源及其制备方法
技术领域
本发明涉及LED领域,尤其涉及一种全周光LED光源及其制备方法。
背景技术
LED 发光二极管已被全球公认为最高效的人造照明技术。具有寿命长、能耗低等优点,在通用照明领域,逐步显现出使用LED 替代传统的发光器件的趋势。
但是目前大部分的LED 光源的自身发光具有指向性,如图1所示,现有的LED光源封装结构如下,包括 LED芯片1’、支架 2’、波长转换部3’、透光部4’,LED芯片1’安装在支架2’上表面中部,LED芯片1’之上覆盖有波长转换部3’,LED芯片1’发出的光能够激发该波长转换部3’使其受激发射受激光。透光部4’位于波长转换部3’的外部。
由于波长转换部3’仅覆盖LED芯片1’的上表面,因此经过激发转化后的所发出的光线具有方向性,即使是经过透光部4’扩散后,配光角一般都在120°以下,光线不能达到的背部,会形成暗影。
而且由于波长转换层3’通常是以膜或者片的形态存在,厚度较薄,体积较小,在制备过程中,由于荧光粉和胶体等材料比重和性质不一致,容易出现沉降、分散不匀等现象,导致产品一致性较差,同一批封装的光源,色温偏差较大,难以控制。
发明内容
为解决上述问题,本发明提供一种可以360°发光的全周光LED光源及其制备方法。
本发明解决其技术问题所采用的技术方案是:一种全周光LED光源,包括:
引脚支架,所述引脚支架由一个平面主体和两个引脚组成;
LED芯片;
波长转换部;
所述LED芯片通过焊接导线固定于所述引脚支架的平面主体上;与平面主体一起封装于波长转换部内部,所述引脚支架的两个引脚伸出波长转换部的外部,分别与电源的正、负极连接。
作为对本发明所述技术方案的一种改进,为了保护波长转换部,还包括一透明保护层,包覆于波长转换部的外侧。优选地,所述透明保护层为透明硅胶保护层、透明硅树脂保护层或透明环氧树脂保护层。
作为对本发明所述技术方案的一种改进,所述波长转换部为圆柱形、棱柱形、球形或异形多面体中的任意一种。
本发明的另一方面,还提供了一种全周光LED光源的制备方法,包括以下步骤:
1)将LED芯片通过焊接导线固定于引脚支架的平面主体上。
2)在真空条件下,将荧光粉、扩散粉和胶体搅拌、混合均匀,得到浆料;然后将浆料注入模具内,其中浆料中扩散粉的含量为0.01-0.5wt%。优选地,混合后浆料的粘度为2000-5000mpa.S。优选地,浆料的混合转速为1500-4500r/min,混合时间为5-15min。
3)将步骤1)中得到的引脚支架插入步骤2)中的模具内,使固定有LED芯片的引脚支架的平面主体完全浸入浆料中。
4)固化、脱模。优选地,固化为加热固化,固化温度为80-150℃,固化时间4-8h。
作为对本发明所述技术方案的一种改进,本发明的制备方法,还包括将步骤4)得到的LED光源置于填充有透明保护层材料溶液的模具中,然后进一步固化、脱模的步骤。优选地,所述透明保护层材料溶液为硅胶溶液、硅树脂溶液或环氧树脂溶液。
本发明的全周光LED光源,通过改变封装结构,将LED芯片整个封装于波长转换部内,芯片发出的光学经过波长转换部的转化,实现360°全周光发光,无直射光,使人眼不产生炫晕感,保护了视力,同时改变了传统LED光源单面或平面的发光效果,提升了亮度。进一步,还设有透明保护层,延缓老化,增长使用寿命。
本发明的光源结构简单,同时由于改善了波长转换部的结构,使其体积增大,这样在制造过程中,精度便于控制,色温一致性得以提高,尤其是当多个芯片一起封装时。
本发明的全周光LED光源,不仅仅限于白光光源,可以根据需要变换芯片类型,其波长转换部的荧光粉组合等来实现不同颜色,不同色温和显色指数的光。可以实现如红色、黄色、兰色、绿色、紫色及各配合双色的全周光LED,色温范围可以在1400K---100000K之间。
本发明的全周光光源可以广泛应用于各种透明或雾状的灯具内。如球泡灯、小夜灯、太阳能灯、蜡烛灯、筒灯、吊灯、吸顶灯、交通信号灯、广告灯等。
附图说明
下面将结合附图及实施例对本发明作进一步说明,附图中:
图1是现有技术的LED光源的封装结构;
图2是本发明实施例1的LED光源的结构示意图;
图3是本发明实施例2的LED光源的结构示意图;
图4是本发明实施例3的LED光源的结构示意图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅用以解释本发明,并不用于限定本发明。
实施例1
如图2所示,一种全周光LED光源,包括引脚支架1,引脚支架1由一个平面主体11和两个引脚12组成;一个LED芯片2;波长转换部3;LED芯片2通过焊接导线6固定于所述引脚支架1的平面主体11上;与平面主体11一起封装在波长转换部3内部,引脚支架1的两个引脚12伸出波长转换部3的外部,分别与电源的正、负极连接。
实施例2
如图3所示,一种全周光LED光源,包括引脚支架11,引脚支架11由一个平面主体111和两个引脚121组成;两个串联LED芯片21;波长转换部31;LED芯片21通过焊接导线61固定于所述引脚支架11的平面主体111上;与平面主体111一起封装在波长转换部31内部,引脚支架11的两个引脚121伸出波长转换部31的外部,分别与电源的正、负极连接。
实施例3
如图4所示,一种全周光LED光源,包括引脚支架12,引脚支架12由一个平面主体112和两个引脚122组成;两个串联LED芯片22;波长转换部32;LED芯片22通过焊接导线62固定于所述引脚支架12的平面主体112上;与平面主体112一起封装在波长转换部32内部,引脚支架12的两个引脚122伸出波长转换部32的外部,分别与电源的正、负极连接。
还包括一透明保护层5,包覆于波长转换部32的外侧。透明保护层5为透明硅胶保护层、硅树脂保护层或者透明环氧树脂保护层,起到保护波长转换部32,延缓其老化的作用;而且可以通过选择和波长转换部32不同折射率的材料,来改善出光率。
本发明实施例中的全周光LED光源中LED芯片(2,21,22)的个数可以有一个或者多个,彼此间串联或并联。
波长转换部(3,31,32)的形状不限于图2-4所示的情况,也可以是棱柱形、异形多面体等。只要能够实现对LED芯片(2,21,22)的全面包裹,实现360°全面发光,便于制造即可。
上述实施例中的全周光LED光源,可以通过以下方法制备。
1)将LED芯片(2,21,22)通过焊接导线(6,61,62)固定于引脚支架(1,11,12)的平面主体(11,111,112)上。
LED芯片(2,21,22)可以是紫外芯片、蓝光芯片、黄光芯片、红光芯片或白光芯片中的任意一种,可以是多个或者单个芯片的组合,LED芯片(2,21,22)之间彼此串联或者并联。
引脚支架(1,11,12)的材质可以为铁、铝、铜或表面镀银等。
焊接导线(6,61,62)可以为金导线、银导线、铝导线、铜导线或其合金导线。
2)在真空条件下,将荧光粉、扩散粉和胶体搅拌、混合均匀,得到浆料;然后将浆料注入模具内。
荧光粉可以是一种或者多种的混合,可以常用的硅酸盐,铝酸盐或氮化物荧光粉中的任意一种或者一种以上组合。
扩散粉可以是纳米二氧化硅、或者由树脂和硅胶组成的扩散材料,含量通常在0.01-0.5wt%之间,以达到良好的扩光效果,使光线均匀,避免眩光。
胶体可以是硅胶、硅树脂或者环氧胶等,如可以采用环氧AB胶。
模具的形状由最终得到的光源的形状来决定,可以是圆柱形、棱柱形、球形或任意的异形多面体等。
混合浆料时,必须在真空条件下进行,避免引入气泡,优选地,浆料的混合转速为1500-4500r/min,混合时间为5-15min。优选地,混合后浆料的粘度为2000-5000mpa.S,以便于注入模具,同时避免其中的荧光粉、扩散粉等沉降。
以环氧AB胶为例,可以在真空条件下,先将荧光粉与A胶混合,扩散粉与B胶混合,然后再将混有荧光粉的A胶和混有扩散粉的B胶混合,注入模具内。
3)将步骤1)中得到的引脚支架(1,11,12)插入步骤2)中的模具内,使固定有LED芯片(2,21,22)的引脚支架的平面主体(11,111,112)完全浸入浆料中。
4)固化、脱模。
固化可以为加热固化,但并不限于此。为了避免固化过程中开裂,优选地,固化温度为80-150℃,固化时间4-8h,具体可以是4h、6h、8h等,依浆料的粘度和种类设定。
若采用AB胶,混合后,浆料会逐步固化,但速度较慢,为了加快速度,优选进行加热固化。
对于实施例3中的光源,还包括步骤5),将步骤4)得到的LED光源置于填充有透明保护层5材料溶液的模具中,然后进一步固化、脱模的步骤。优选地,所述透明保护层5材料溶液为硅胶溶液、硅树脂溶液或环氧树脂溶液。
本发明的制备工艺,通过选择合适的扩散剂添加范围,控制扩光效果,优化工艺条件,得到全角度发光,光线均匀的光源。本发明的LED光源,结构简单,通过将LED芯片整体封装与波长转换部内部,可以充分利用芯片发出的光线,一方面提高光线利用率,提升光效;另一方面也使得光线柔和均匀,便于配光。本发明的LED光源可以广泛应用于各种灯具中,如球泡灯、小夜灯、太阳能灯、蜡烛灯、筒灯、吊灯、吸顶灯、交通信号灯、广告灯等。
应当理解的是,对本领域普通技术人员来说,可以根据上述说明加以改进或变换,而所有这些改进和变换都应属于本发明所附权利要求的保护范围。

Claims (9)

1.一种全周光LED光源,其特征在于,包括
引脚支架,所述引脚支架由一个平面主体和两个引脚组成;
LED芯片,所述LED芯片具有一个或者多个,彼此之间串联或者并联;
波长转换部;所述波长转换部由荧光粉、扩散粉和胶体组成;
所述LED芯片通过焊接导线固定于所述引脚支架的平面主体上;与平面主体一起封装于波长转换部内部,所述引脚支架的两个引脚伸出波长转换部的外部,分别与电源的正、负极连接;所述波长转换部外侧还设置有透明保护层,所述保护层折射率不同于波长转换部;
所述全周光LED光源的制备方法如下:
1)将LED芯片通过焊接导线固定于引脚支架的平面主体上;
2)在真空条件下,将荧光粉、扩散粉和胶体搅拌、混合均匀,得到浆料;然后将浆料注入模具内,其中浆料中扩散粉含量为0.01-0.5wt%,混合浆料时,必须在真空条件下进行,避免引入气泡,浆料的混合转速为1500-4500r/min,混合时间为5-15min,混合后浆料的粘度为2000-5000mpa.S,以便于注入模具,同时避免其中的荧光粉、扩散粉沉降;
3)将步骤1)中得到的引脚支架插入步骤2)中的模具内,使固定有LED芯片的引脚支架的平面主体完全浸入浆料中;
4)固化、脱模。
2.根据权利要求1所述的全周光LED光源,其特征在于,所述透明保护层为透明硅胶保护层、透明硅树脂保护层或透明环氧树脂保护层。
3.根据权利要求1-2任一项所述的全周光LED光源,其特征在于,所述波长转换部为圆柱形、棱柱形、球形或异形多面体中的任意一种。
4.一种如权利要求1-3中任一项所述的全周光LED光源的制备方法,其特征在于,包括以下步骤:
1)将LED芯片通过焊接导线固定于引脚支架的平面主体上;
2)在真空条件下,将荧光粉、扩散粉和胶体搅拌、混合均匀,得到浆料;然后将浆料注入模具内,其中浆料中扩散粉含量为0.01-0.5wt%;
3)将步骤1)中得到的引脚支架插入步骤2)中的模具内,使固定有LED芯片的引脚支架的平面主体完全浸入浆料中;
4)固化、脱模。
5.根据权利要求4所述的全周光LED光源的制备方法,其特征在于,所述步骤2)中,混合后浆料的粘度为2000-5000mpa.S。
6.根据权利要求5所述的全周光LED光源的制备方法,其特征在于,所述步骤2)中,浆料的混合转速为1500-4500r/min,混合时间为5-15min。
7.根据权利要求6所述的全周光LED光源的制备方法,其特征在于,所述步骤4)中,固化为加热固化,固化温度为80-150℃,固化时间4-8h。
8.根据权利要求4-7任一项所述的全周光LED光源的制备方法,其特征在于,还包括将步骤4)得到的LED光源置于填充有透明保护层材料溶液的模具中,然后进一步固化、脱模的步骤。
9.根据权利要求8所述的全周光LED光源的制备方法,其特征在于:所述透明保护层材料溶液为硅胶溶液、硅树脂溶液或者环氧树脂溶液。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3683849A1 (en) * 2019-01-16 2020-07-22 Zhejiang Hongda Optoelectronics Technology Co., Ltd. In-line led lamp bead and packaging process thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117393678A (zh) * 2023-11-15 2024-01-12 深圳市富斯迈电子有限公司 一种led发光管及其封装工艺

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1770482A (zh) * 2005-09-30 2006-05-10 陈泽 发光二极管
CN1776924A (zh) * 2005-07-12 2006-05-24 陈建伟 360度(体发光)单色发光二极管
CN101510579A (zh) * 2008-02-13 2009-08-19 财团法人工业技术研究院 发光元件及其制作方法
CN103208578A (zh) * 2013-03-21 2013-07-17 杭州杭科光电股份有限公司 一种全角度发光的led光源
CN205016557U (zh) * 2015-09-02 2016-02-03 深圳市瑞隆光电科技有限公司 一种全周光led光源

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1776924A (zh) * 2005-07-12 2006-05-24 陈建伟 360度(体发光)单色发光二极管
CN1770482A (zh) * 2005-09-30 2006-05-10 陈泽 发光二极管
CN101510579A (zh) * 2008-02-13 2009-08-19 财团法人工业技术研究院 发光元件及其制作方法
CN103208578A (zh) * 2013-03-21 2013-07-17 杭州杭科光电股份有限公司 一种全角度发光的led光源
CN205016557U (zh) * 2015-09-02 2016-02-03 深圳市瑞隆光电科技有限公司 一种全周光led光源

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3683849A1 (en) * 2019-01-16 2020-07-22 Zhejiang Hongda Optoelectronics Technology Co., Ltd. In-line led lamp bead and packaging process thereof

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