CN105047796B - 一种全周光led光源及其制备方法 - Google Patents
一种全周光led光源及其制备方法 Download PDFInfo
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- CN105047796B CN105047796B CN201510554129.1A CN201510554129A CN105047796B CN 105047796 B CN105047796 B CN 105047796B CN 201510554129 A CN201510554129 A CN 201510554129A CN 105047796 B CN105047796 B CN 105047796B
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- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510554129.1A CN105047796B (zh) | 2015-09-02 | 2015-09-02 | 一种全周光led光源及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510554129.1A CN105047796B (zh) | 2015-09-02 | 2015-09-02 | 一种全周光led光源及其制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN105047796A CN105047796A (zh) | 2015-11-11 |
CN105047796B true CN105047796B (zh) | 2018-09-04 |
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CN201510554129.1A Active CN105047796B (zh) | 2015-09-02 | 2015-09-02 | 一种全周光led光源及其制备方法 |
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CN (1) | CN105047796B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3683849A1 (en) * | 2019-01-16 | 2020-07-22 | Zhejiang Hongda Optoelectronics Technology Co., Ltd. | In-line led lamp bead and packaging process thereof |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117393678A (zh) * | 2023-11-15 | 2024-01-12 | 深圳市富斯迈电子有限公司 | 一种led发光管及其封装工艺 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1770482A (zh) * | 2005-09-30 | 2006-05-10 | 陈泽 | 发光二极管 |
CN1776924A (zh) * | 2005-07-12 | 2006-05-24 | 陈建伟 | 360度(体发光)单色发光二极管 |
CN101510579A (zh) * | 2008-02-13 | 2009-08-19 | 财团法人工业技术研究院 | 发光元件及其制作方法 |
CN103208578A (zh) * | 2013-03-21 | 2013-07-17 | 杭州杭科光电股份有限公司 | 一种全角度发光的led光源 |
CN205016557U (zh) * | 2015-09-02 | 2016-02-03 | 深圳市瑞隆光电科技有限公司 | 一种全周光led光源 |
-
2015
- 2015-09-02 CN CN201510554129.1A patent/CN105047796B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1776924A (zh) * | 2005-07-12 | 2006-05-24 | 陈建伟 | 360度(体发光)单色发光二极管 |
CN1770482A (zh) * | 2005-09-30 | 2006-05-10 | 陈泽 | 发光二极管 |
CN101510579A (zh) * | 2008-02-13 | 2009-08-19 | 财团法人工业技术研究院 | 发光元件及其制作方法 |
CN103208578A (zh) * | 2013-03-21 | 2013-07-17 | 杭州杭科光电股份有限公司 | 一种全角度发光的led光源 |
CN205016557U (zh) * | 2015-09-02 | 2016-02-03 | 深圳市瑞隆光电科技有限公司 | 一种全周光led光源 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3683849A1 (en) * | 2019-01-16 | 2020-07-22 | Zhejiang Hongda Optoelectronics Technology Co., Ltd. | In-line led lamp bead and packaging process thereof |
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CN105047796A (zh) | 2015-11-11 |
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Address after: 518100 Guangdong city of Shenzhen Province Phoenix community Long Feng Lu Guangming District Huafeng High-tech Industrial Park No. 5 on the third floor of B building Applicant after: RUILONG OPTOELECTRONIC TECHNOLOGY CO.,LTD. Applicant after: ZHONGSHAN QUANXIN LIGHTING ELECTRICAL APPLIANCE CO.,LTD. Address before: Baoan District Shiyan street of Shenzhen city in Guangdong Province on the 518100 Avenue house community Hang Mei Tian Xin Industrial Zone No. 3 Feng Zheng road Feng Industrial Park building B building 2-3 Applicant before: RUILONG OPTOELECTRONIC TECHNOLOGY CO.,LTD. Applicant before: ZHONGSHAN QUANXIN LIGHTING ELECTRICAL APPLIANCE CO.,LTD. |
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GR01 | Patent grant | ||
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Effective date of registration: 20220520 Address after: 503, building 2, No. 150, Zhangge Road, Zhangge community, Fucheng street, Longhua District, Shenzhen, Guangdong 518110 Patentee after: RUILONG OPTOELECTRONIC TECHNOLOGY CO.,LTD. Patentee after: ZHONGSHAN QUANXIN INTELLIGENT LIGHTING Co.,Ltd. Address before: 518100 plant B, floor 3, No. 5, Huafeng high tech Industrial Park, Changfeng Road, Fenghuang community, Guangming New Area, Shenzhen, Guangdong Patentee before: RUILONG OPTOELECTRONIC TECHNOLOGY CO.,LTD. Patentee before: ZHONGSHAN QUANXIN LIGHTING ELECTRICAL APPLIANCE CO.,LTD. |
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Effective date of registration: 20230602 Granted publication date: 20180904 |