CN205016557U - 一种全周光led光源 - Google Patents

一种全周光led光源 Download PDF

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CN205016557U
CN205016557U CN201520676200.9U CN201520676200U CN205016557U CN 205016557 U CN205016557 U CN 205016557U CN 201520676200 U CN201520676200 U CN 201520676200U CN 205016557 U CN205016557 U CN 205016557U
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light source
pin support
led light
wavelength conversion
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魏武兴
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ZHONGSHAN QUANXIN ELECTRICAL LIGHTING CO Ltd
Ruilong Electrooptical Science & Technology Co Ltd Shenzhen City
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ZHONGSHAN QUANXIN ELECTRICAL LIGHTING CO Ltd
Ruilong Electrooptical Science & Technology Co Ltd Shenzhen City
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

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Abstract

本实用新型提供了一种全周光LED光源，所述的全周光LED光源包括引脚支架，所述引脚支架由一个平面主体和两个引脚组成；LED芯片；波长转换部；所述LED芯片通过焊接导线固定于所述引脚支架的平面主体上；与平面主体一起封装于波长转换部内部，所述引脚支架的两个引脚伸出波长转换部的外部，分别与电源的正、负极连接。本实用新型的全周光LED光源，不仅仅限于白光光源，可以根据需要变换芯片类型，其波长转换部的荧光粉组合等来实现不同颜色，不同色温和显色指数的光。本实用新型的全周光LED光源可以广泛应用于各种光源。

Description

一种全周光LED光源
技术领域
本实用新型涉及LED领域，尤其涉及一种全周光LED光源。
背景技术
LED发光二极管已被全球公认为最高效的人造照明技术。具有寿命长、能耗低等优点，在通用照明领域，逐步显现出使用LED替代传统的发光器件的趋势。
但是目前大部分的LED光源的自身发光具有指向性，如图1所示，现有的LED光源封装结构如下，包括LED芯片1’、支架2’、波长转换部3’、透光部4’，LED芯片1’安装在支架2’上表面中部，LED芯片1’之上覆盖有波长转换部3’，LED芯片1’发出的光能够激发该波长转换部3’使其受激发射受激光。透光部4’位于波长转换部3’的外部。
由于波长转换部3’仅覆盖LED芯片1’的上表面，因此经过激发转化后的所发出的光线具有方向性，即使是经过透光部4’扩散后，配光角一般都在120°以下，光线不能达到的背部，会形成暗影。
而且由于波长转换部3’通常是以膜或者片的等形态存在，厚度较薄，体积较小，在制备过程中，由于荧光粉和胶体等材料比重和性质不一致，容易出现沉降、分散不匀等现象，导致产品一致性较差，同一批封装的光源，色温偏差较大，难以控制。
实用新型内容
为解决上述问题，本实用新型提供一种可以360°发光的全周光LED光源。
本实用新型解决其技术问题所采用的技术方案是：一种全周光LED光源，包括：
引脚支架，所述引脚支架由一个平面主体和两个引脚组成；
LED芯片；
波长转换部；
所述LED芯片通过焊接导线固定于所述引脚支架的平面主体上；与平面主体一起封装于波长转换部内部，所述引脚支架的两个引脚伸出波长转换部的外部，分别与电源的正、负极连接。
作为对本实用新型所述技术方案的一种改进，所述LED芯片具有一个或者多个，彼此之间通过焊接导线串联或者并联。
作为对本实用新型所述技术方案的一种改进，所述引脚支架为铁、铝、铜或表面镀银引脚支架。
作为对本实用新型所述技术方案的一种改进，所述焊接导线为金导线、银导线、铝导线、铜导线或合金导线。
作为对本实用新型所述技术方案的一种改进，所述波长转换部为圆柱形、棱柱形、球形或异形多面体中的任意一种。
本实用新型的全周光LED光源，通过将LED芯片整个封装于波长转换部内，芯片发出的光经过波长转换部的转化，实现360°全周光发光，无直射光，使人眼不产生炫晕感，保护了视力，同时改变了传统LED光源单面或平面的发光效果，提升了亮度。
本实用新型的光源结构简单，同时由于改善了波长转换部的结构，使其体积增大，这样在制造过程中，精度便于控制，色温一致性得以提高，尤其是当多个芯片一起封装时。
本实用新型的全周光LED光源，不仅仅限于白光光源，可以根据需要变换芯片类型，其波长转换部中的荧光粉等的组合来实现不同颜色，不同色温和显色指数的光。可以实现如红色、黄色、兰色、绿色、紫色及各配合双色的全周光LED，色温范围可以在1400K—100000K之间。
本实用新型的全周光光源可以广泛应用于各种透明或雾状的灯具内。如球泡灯、小夜灯、太阳能灯、蜡烛灯、筒灯、吊灯、吸顶灯、交通信号灯、广告灯等。
附图说明
下面将结合附图及实施例对本实用新型作进一步说明，附图中：
图1是现有技术的LED光源结构的剖面图；
图2是本实用新型实施例1的LED光源结构的剖面图；
图3是本实用新型实施例2的LED光源结构的剖面图。
具体实施方式
为了使本实用新型的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本实用新型进行进一步详细说明。应当理解，此处所描述的具体实施方式仅用以解释本实用新型，并不用于限定本实用新型。
实施例1
如图2所示，一种全周光LED光源，包括引脚支架1，引脚支架1由一个平面主体11和两个引脚12组成；一个LED芯片2；波长转换部3；LED芯片2通过焊接导线6固定于引脚支架1的平面主体11上，与平面主体11一起封装在波长转换部3内部，引脚支架1的两个引脚12伸出波长转换部3的外部，分别与电源的正、负极连接。
实施例2
如图3所示，一种全周光LED光源，包括引脚支架11，引脚支架11由一个平面主体111和两个引脚121组成；两个LED芯片21，彼此通过焊接导线61串联；波长转换部31；LED芯片21通过焊接导线61固定于引脚支架11的平面主体111上，与平面主体111一起封装在波长转换部31内部，引脚支架11的两个引脚121伸出波长转换部31的外部，分别与电源的正、负极连接。
引脚支架（1，11）通常为金属支架，优选为铁、铝、铜或表面镀银引脚支架。
焊接导线（6，61）可以是金导线、银导线、铝导线、铜导线或合金导线等。
LED芯片（2，21）可以是紫外芯片、蓝光芯片、黄光芯片、红光芯片或白光芯片中的任意一种，可以是多个或者单个芯片的组合，芯片之间彼此通过焊接导线（6，61）串联或者并联。其中LED芯片（2，21）的个数不限于一个，也可以是多个。
波长转换部（3，31）的形状也不限于图2和图3所示的形状，可以是圆柱形、棱柱形、球形或异形多面体等。
波长转换部（3，31）通常有混合有荧光粉、扩散粉的胶体溶液固化得到。
应当理解的是，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，而所有这些改进和变换都应属于本实用新型所附权利要求的保护范围。

Claims (5)

1.一种全周光LED光源，其特征在于，包括
引脚支架，所述引脚支架由一个平面主体和两个引脚组成；
LED芯片；
波长转换部；
所述LED芯片通过焊接导线固定于所述引脚支架的平面主体上；与平面主体一起封装于波长转换部内部，所述引脚支架的两个引脚伸出波长转换部的外部，分别与电源的正、负极连接。
2.根据权利要求1所述的全周光LED光源，其特征在于，所述LED芯片具有一个或者多个，彼此之间通过焊接导线串联或者并联。
3.根据权利要求1所述的全周光LED光源，其特征在于，所述引脚支架为铁、铝、铜或表面镀银引脚支架。
4.根据权利要求1所述的全周光LED光源，其特征在于，所述焊接导线为金导线、银导线、铝导线、铜导线或合金导线。
5.根据权利要求1-4任一项所述的全周光LED光源，其特征在于，所述波长转换部为圆柱形、棱柱形、球形或异形多面体中的任意一种。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105047796A (zh) * 2015-09-02 2015-11-11 深圳市瑞隆光电科技有限公司 一种全周光led光源及其制备方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105047796A (zh) * 2015-09-02 2015-11-11 深圳市瑞隆光电科技有限公司 一种全周光led光源及其制备方法
CN105047796B (zh) * 2015-09-02 2018-09-04 深圳市瑞隆光电科技有限公司 一种全周光led光源及其制备方法

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Address after: 518000 Guangdong city of Shenzhen Province Phoenix community Long Feng Lu Guangming District Huafeng High-tech Industrial Park No. 5 on the third floor of B building

Patentee after: Ruilong Electrooptical Science & Technology Co., Ltd., Shenzhen City

Patentee after: Zhongshan Quanxin Electrical Lighting Co., Ltd.

Address before: Baoan District Shiyan street of Shenzhen city in Guangdong Province on the 518000 Avenue house community Hang Mei Tian Xin Industrial Zone No. 3 Feng Zheng road Feng Industrial Park building B building 2-3

Patentee before: Ruilong Electrooptical Science & Technology Co., Ltd., Shenzhen City

Patentee before: Zhongshan Quanxin Electrical Lighting Co., Ltd.