CN203312622U

CN203312622U - TO pedestal

Info

Publication number: CN203312622U
Application number: CN2013202817501U
Authority: CN
Inventors: 张玲艳
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2013-05-21
Filing date: 2013-05-21
Publication date: 2013-11-27
Anticipated expiration: 2023-05-21

Abstract

The utility model discloses a TO pedestal of a Transistor-Outline (TO) encapsulation laser. The TO pedestal includes a pedestal body and a plurality of leads welded on the pedestal body. The pedestal body is provided with a soldering and sealing part for welding with a to-be-encapsulated device. The soldering and sealing part protrudes an upper end surface of the pedestal body. The upper end surface of the pedestal body is an end surface of the pedestal body connected with the to-be-encapsulated device. The TO pedestal can centralize heat and pressure generated in the soldering and sealing on the projected soldering and sealing part, so that the heat and pressure generated in the soldering and sealing can be isolated from the encapsulation area of glass solder, thereby reducing direct influences of the heat and pressure generated in the soldering and sealing on the glass solder, guaranteeing the air tightness of an encapsulated device, and improving the qualified rate and the reliability of the encapsulated device.

Description

TO base

Technical Field

The utility model relates TO a semiconductor laser technical field especially relates TO a TO base that is used in the coaxial TO packaging structure of semiconductor laser.

Background

The TO (coaxial-out) package is a device packaging mode with high automation degree, mature process and low cost, and is widely used in the communication field at present. A TO base for TO encapsulation on the market structurally comprises a base body and a lead arranged on the base body, wherein a gap between the lead and the base body is encapsulated by glass solder. When the TO encapsulation is carried out on the semiconductor laser, a base body of a TO base is welded on a tube cap of the semiconductor laser, and a lead on the base body is connected with a circuit in the laser.

Fig. 1 is a cross-sectional view of a conventional semiconductor laser after TO packaging. As shown in fig. 1, the bottom surface of the laser cap is attached to the upper end surface of the base body and is welded to the sealing plane of the base body. The base body of the existing TO base is mostly made of metal materials, so that pressure and heat generated when the laser tube cap and the TO base are sealed and welded can generate corresponding stress on a glass solder packaging area through heat transfer. For the existing TO packaging device which is low in transmission rate and does not need a refrigerator, the TO base of the device is mostly 4 leads or 5 leads. Because the number of the leads is small, and the glass solder packaging area on the TO base is concentrated on the center of the TO base, the glass solder packaging area is not greatly influenced when the sealing component and the TO base are sealed. However, for the TO packaged device with high transmission rate requirement and requiring refrigeration inside, the TO base of the TO packaged device must be in a multi-lead structure (e.g. 7 leads, 9 leads, or even 10 leads) for connecting components such as a refrigerator, a resistor, or an inductor in the TO packaged device.

Under the condition that the size of the base body is the same, the more the number of the leads is, the larger the distribution range of the leads on the base body is, the closer the distance between a sealing area on the base body and a glass solder packaging area is, so that heat and pressure generated during sealing can directly act on the glass packaging area, the glass packaging area generates larger stress, and the glass solder packaging area is easy to generate cracks, so that the air tightness of a packaged device is not qualified, the failure of the device is caused, the qualification rate of the device is reduced, and meanwhile, huge hidden dangers are brought to the reliability of the device.

Therefore, it is necessary TO provide a TO base, which can reduce the influence of heat and pressure generated when a component TO be sealed and soldered is sealed and soldered on a glass solder packaging area, thereby ensuring the air tightness of the packaged device and improving the product yield.

SUMMERY OF THE UTILITY MODEL

The utility model aims TO provide a TO base that can reduce the heat that produces when needing TO seal the welding part and pressure TO the glass solder encapsulation region's influence, guarantee the gas tightness after the device encapsulation, improve the product percent of pass.

According TO an embodiment of the utility model, a TO base is provided, which comprises a base body and a plurality of leads welded on the base body, wherein the base body is provided with a sealing part welded with a device TO be packaged;

the sealing and welding part is arranged in a protruding way relative to the upper end surface of the base body, wherein,

the upper end face of the base body is the end face of the base body connected with the device to be packaged.

Preferably, the sealing part is integrally formed with the base body.

As another preferable mode, the sealing part is welded to the base body.

Preferably, the base body is a cylinder, the sealing part is annular, and the outer diameter of the sealing part is the same as the diameter of the base body.

The height of the seal welding ring relative to the upper end face of the base body is 0.4-0.7 mm.

The width of the seal welding ring along the radial direction is 1.2-1.8 mm.

And a gap between the lead and the base body is packaged by glass solder.

The number of the leads is at least 7.

Preferably, the number of the leads is 10.

Wherein the leads are evenly distributed around a center of the base body.

Preferably, the base body is made of a metal material.

According TO the above technical scheme, the utility model provides a TO base can concentrate the heat and the pressure that produce when sealing weld on convex sealing weld portion, and the glass solder encapsulation region is kept away from TO the heat and the pressure that produce when making sealing weld TO heat and pressure when reducing sealing weld are TO the regional direct influence of glass solder encapsulation, thereby guarantee the gas tightness of encapsulation device, improve the qualification rate and the reliability of encapsulation device.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art，The drawings that are needed to describe the embodiments or prior art will be briefly described below. It is to be understood that the drawings in the following description are merely exemplary of the invention, and that those skilled in the art will be able to devise various arrangements which, although not explicitly described or shown herein, embody the principles of the invention and are included in its spirit and scopeThe embodiments shown in the figures lead to further embodiments and to the figures thereof.

Fig. 1 is a cross-sectional view of a conventional semiconductor laser after TO packaging;

FIG. 2 is a cross-sectional view of the TO base in the preferred embodiment of the present invention；

Fig. 3 shows an assembly diagram of the TO base and the sealing device after sealing;

fig. 4 shows a lead layout of a TO base with 10 leads.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the numerous specific details set forth in the specification are merely set forth to provide a thorough understanding of one or more aspects of the present invention, which may be practiced without these specific details.

The sealing plane of current TO base sets up in the up end of base body, when needing encapsulated device and TO base TO seal, because high-voltage arc has great voltage, can produce higher heat in the twinkling of an eye, also there is great pressure in the sealing region simultaneously, these two factors act on the base body up end, cause glass solder encapsulation regional stress inhomogeneous even make the glass solder produce the crackle in the base body easily, thereby make the gas tightness of device after the encapsulation nonconforming requirement, bring huge hidden danger TO device reliability. The utility model discloses consider the welding plane protrusion of base body up end in the setting of base body up end, the heat and the pressure that produce when will sealing weld concentrate on convex sealing plane to keep away from glass solder encapsulation region, the heat and the pressure that produce when reducing the sealing weld directly influence regional to glass encapsulation, with the gas tightness of guaranteeing the encapsulation device.

The structure and the operation principle of the present invention will be explained in detail through the specific embodiments.

Fig. 2 shows a cross-sectional view of the structure of the TO base in the preferred embodiment of the present invention;

fig. 3 shows the assembly drawing after the sealing welding of the TO base and the sealing welding device is completed in the utility model.

Referring TO fig. 2 and 3, the TO base includes a base body 1 and a plurality of leads 2 soldered TO the base body 1, and a gap between the plurality of leads 2 and the base body 1 is sealed by a glass solder. The utility model discloses in, the regional definition through the glass solder encapsulation between base body 1 and the lead wire 2 is glass solder encapsulation region 3.

The base body 1 is also provided with a sealing part 4 which is welded with a device 5 to be packaged. The sealing part 4 is protruded from the upper end surface of the base body 1. The upper end face of the sealing part 4 is used for welding a device 5 to be packaged, and the lower end face of the sealing part 4 is attached to the upper end face of the base body 1. Preferably, the sealing part is welded to the base body. As a more preferable embodiment, the seal part 4 may be integrally formed with the base body 1. In this embodiment, the upper end surface of the base body 1 is an end surface of the base body 1 connected to the device 5 to be packaged.

The working principle of the present invention will be explained in detail below.

Need encapsulation device 5 with the utility model provides a when the TO base carries out the seal welding, need encapsulation device 5 TO weld on protrusion in the seal welding portion 4 of 1 up end of base body, then the great pressure that high-voltage arc produced in the seal welding region and the higher heat that produces in the twinkling of an eye then concentrate on the seal welding portion 4, thereby glass solder encapsulation region 3 is kept away from TO the heat and the pressure that produce when making the seal welding, the heat and the direct influence of pressure TO glass encapsulation region that produce when having reduced the seal welding, thereby guarantee the gas tightness of encapsulation device, improve the qualification rate of encapsulation device greatly.

As preferred embodiment, base body 1 in the utility model provides a be the cylinder, seal welding portion 4 adopts the annular, and the external diameter of seal welding portion 4 is the same with base body 1's diameter. Wherein,

the height of the seal welding ring relative to the upper end surface of the base body 1 is 0.4-0.7 mm. Preferably, in the present embodiment, the height of the sealing ring relative to the upper end surface of the base body 1 is 0.4 mm.

The width of the seal welding ring along the radial direction is 1.2-1.8 mm. Preferably, the width of the seal ring in the radial direction is 1.4 mm.

In this embodiment, the shape of the seal 4 may also be oval or square. The utility model discloses do not specifically prescribe a limit to the shape of seal welding portion 4, all protrusion in 1 up end of base body and can be used for the welding to need the closed figure of sealing the device all to fall into the utility model discloses a protection scope.

Because the utility model discloses pressure and heat when well sealing portion 4 can concentrate the sealing, reduce pressure and heat of distributing on base body 1, consequently the embodiment of the utility model provides an in 1 last lead wire 2 of base body can set up more than 7 at least, and lead wire 2 centers on 1 central evenly distributed of base body to can be partial to the peripheral setting of base body 1. Fig. 4 shows, as a preferred embodiment, a lead 2 profile for a TO base with 10 leads 2. As shown in fig. 4, one lead 2 of the 10 leads 2 is a group, and every three leads 2 are a group, and the four groups of leads 2 are uniformly distributed on the periphery of the center of the base body 1 and are disposed near the edge of the base body 1. Through the edge setting that is close TO base body 1 with lead wire 2, then electronic devices and subassemblies such as resistance, heat sink and refrigerator can then be placed TO the position in the middle of base body 1 TO improve the encapsulation space of TO base greatly. The lead 2 distribution diagram shown in fig. 4 is only exemplary, and all the lead 2 distribution structures that are uniformly distributed on the periphery of the center of the base body 1 and can improve the TO base packaging space all fall into the protection scope of the present invention.

Preferably, the base body 1 in the embodiment of the present invention is made of a metal material.

According TO the above, the utility model provides a TO base can concentrate the heat and the pressure that produce when sealing weld on convex sealing weld plane, and the glass solder encapsulation is regional 3 TO heat and pressure that produce when making the sealing weld keep away from, and the heat and the pressure that produce when reducing the sealing weld directly influence regional TO glass encapsulation TO guarantee the gas tightness of encapsulation device, improve the qualification rate and the reliability of encapsulation device.

The utility model provides a TO base not only is applicable TO the TO encapsulation of many lead wire 2 structures, also is applicable TO the TO encapsulation of less lead wire 2 structure.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A TO base is characterized by comprising a base body and a plurality of leads welded on the base body, wherein the base body is provided with a sealing part welded with a device TO be packaged;

2. The TO base of claim 1, wherein the solder seal is integrally formed with the base body.

3. The TO base of claim 1, wherein said solder seal is welded TO said base body.

4. The TO base of any one of claims 1 TO 3, wherein the base body is cylindrical, the seal is annular, and the seal has an outer diameter that is the same as a diameter of the base body.

5. The TO base of claim 4, wherein the seal ring has a height of 0.4 TO 0.7mm relative TO the upper end surface of the base body;

the width of the seal welding ring along the radial direction is 1.2-1.8 mm.

6. The TO base of claim 1, wherein a gap between the lead and the base body is encapsulated by a glass solder.

7. The TO base of claim 1, wherein said leads are at least 7 in number.

8. The TO base of claim 7, wherein said leads are 10 in number.

9. The TO base of claim 7 or 8, wherein said leads are evenly distributed around a center of said base body.

10. The TO base of claim 1, wherein the base body is made of a metallic material.