CN203312622U - TO pedestal - Google Patents
TO pedestal Download PDFInfo
- Publication number
- CN203312622U CN203312622U CN2013202817501U CN201320281750U CN203312622U CN 203312622 U CN203312622 U CN 203312622U CN 2013202817501 U CN2013202817501 U CN 2013202817501U CN 201320281750 U CN201320281750 U CN 201320281750U CN 203312622 U CN203312622 U CN 203312622U
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- Prior art keywords
- soldering
- base body
- base
- sealing
- lead
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Abstract
The utility model discloses a TO pedestal of a Transistor-Outline (TO) encapsulation laser. The TO pedestal includes a pedestal body and a plurality of leads welded on the pedestal body. The pedestal body is provided with a soldering and sealing part for welding with a to-be-encapsulated device. The soldering and sealing part protrudes an upper end surface of the pedestal body. The upper end surface of the pedestal body is an end surface of the pedestal body connected with the to-be-encapsulated device. The TO pedestal can centralize heat and pressure generated in the soldering and sealing on the projected soldering and sealing part, so that the heat and pressure generated in the soldering and sealing can be isolated from the encapsulation area of glass solder, thereby reducing direct influences of the heat and pressure generated in the soldering and sealing on the glass solder, guaranteeing the air tightness of an encapsulated device, and improving the qualified rate and the reliability of the encapsulated device.
Description
Technical field
The utility model relates to semiconductor laser field, relates in particular to a kind of TO base be used in the coaxial TO encapsulating structure of semiconductor laser.
Background technology
TO (Transistor-Outline, coaxial type) encapsulation is that a kind of automaticity is high, and technical maturity, and lower-cost device package mode, be widely used in the communications field at present.On the market for the TO base of TO encapsulation, its structure comprises a base body and is arranged at the lead-in wire on the base body, and the gap between lead-in wire and base body encapsulates by glass solder.When noise spectra of semiconductor lasers is carried out the TO encapsulation, the base body of TO base is welded on the pipe cap of semiconductor laser, the lead-in wire on the base body is connected with the circuit in laser.
Fig. 1 shows the profile after existing semiconductor laser carries out the TO encapsulation.As shown in Figure 1, the upper surface of the bottom surface of laser pipe cap and base body is affixed, and is welded on the soldering and sealing plane of base body.The base body of existing TO base adopts metal material to make more, thus the pressure of laser pipe cap generation while carrying out soldering and sealing with the TO base and heat by hot transmission meeting to the corresponding stress of glass solder packaging area generation.Lower and do not need the TO packaging of refrigerator for existing transmission rate, its TO base mostly is 4 lead-in wires or 5 lead-in wires.Because number of leads is less, and the glass solder packaging area on the TO base focuses mostly in the center of TO base, while therefore needing soldering and sealing parts and TO base to carry out soldering and sealing on the impact of glass solder packaging area and not quite.But have higher requirements and its inner TO packaging that needs refrigeration for transmission rate, its TO base is necessary for the multilead structure (as 7 lead-in wires, 9 lead-in wires, 10 lead-in wires even), with components and parts such as the refrigerator for connecting the TO packaging, resistance or inductance.
In the situation that the base body dimension is identical, number of leads is more, the distribution of lead-in wire on the base body is just larger, the zone of the soldering and sealing on the base body is just nearer with the distance of glass solder packaging area, therefore the heat and the pressure that produce during soldering and sealing can act directly on the glass packaging zone, make the glass packaging zone produce larger stress, very easily cause the glass solder packaging area to crack, thereby make the air-tightness of encapsulated device undesirable, cause the inefficacy of device, reduce the qualification rate of device, to device reliability, bring huge hidden danger simultaneously.
As from the foregoing, be necessary to provide a kind of TO base, the impact on the glass solder packaging area of the heat that it produces in the time of can reducing to need the soldering and sealing of soldering and sealing parts and pressure, thus guarantee the air-tightness after device package, improve conforming product rate.
The utility model content
Goal of the invention of the present utility model has been to provide the impact on the glass solder packaging area of a kind of heat produced can reduce to need the soldering and sealing of soldering and sealing parts time the and pressure, guarantees the air-tightness after device package, improves the TO base of conforming product rate.
According to embodiment of the present utility model, a kind of TO base is provided, comprise the base body and be welded in many lead-in wires on described base body, described base body is provided with and the soldering and sealing section that needs packaging to weld;
Described soldering and sealing section protrudes and arranges with respect to the upper surface of base body, wherein,
The upper surface of described base body be in described base body with the described end face that needs packaging to be connected.
Preferably, described soldering and sealing section and described this body by integral forming of base.
As another preferred version, described soldering and sealing section is welded on described base body.
Preferably, described base body is cylinder, and described soldering and sealing section is annular, and the external diameter of described soldering and sealing section is identical with the diameter of described base body.
Wherein, described soldering and sealing ring is 0.4～0.7mm with respect to the height of described base body upper surface.
Described soldering and sealing ring width radially is 1.2～1.8mm.
Gap between described lead-in wire and described base body encapsulates by glass solder.
The radical of described lead-in wire is at least 7.
Preferably, the radical of described lead-in wire is 10.
Wherein, described lead-in wire is uniformly distributed around the center of described base body.
Preferably, described base body is made by metal material.
As shown from the above technical solution, in the soldering and sealing section that the heat that TO base in the utility model produces in the time of can be by soldering and sealing and pressure concentration are distributed in protrusion, and the heat produced while making soldering and sealing and pressure are away from the glass solder packaging area, thereby the heat while reducing soldering and sealing and the pressure direct impact on the glass solder packaging area, thereby guarantee the air-tightness of packaging, improve qualification rate and the reliability of packaging.
The accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art
,Below will the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described.Apparently, the accompanying drawing in below describing is only embodiment more of the present utility model, for those of ordinary skills, can also obtain according to these accompanying drawing illustrated embodiments other embodiment and accompanying drawing thereof.
Fig. 1 shows the profile after existing semiconductor laser carries out the TO encapsulation;
Fig. 2 shows the section of structure of TO base in the utility model preferred embodiment
Fig. 3 shows the assembly drawing after TO base and soldering and sealing device in the utility model complete soldering and sealing;
Fig. 4 shows the lead-in wire distribution map of the TO base that is provided with 10 lead-in wires.
Embodiment
For making goal of the invention of the present utility model, technical scheme and advantage clearer, referring to accompanying drawing and enumerate preferred embodiment, the utility model is further described.Yet, it should be noted that, many details of listing in specification are only in order to make the reader, to one or more aspects of the present utility model, a thorough understanding be arranged, even if do not have these specific details also can realize these aspects of the present utility model.
The soldering and sealing plane layout of existing TO base is in the upper surface of base body, when needing packaging and TO base to carry out soldering and sealing, because there is larger voltage in high-voltage arc, can moment produce higher heat, simultaneously in the soldering and sealing zone, also there is larger pressure, when these two factors act on base body upper surface, easily cause the Stress non-homogeneity of glass solder packaging area in the base body that glass solder is cracked, thereby make the air-tightness of encapsulated device undesirable, bring huge hidden danger to device reliability.The utility model considers that the welding plane of base body upper surface is protruded to base body upper surface to be arranged, the heat produced during by soldering and sealing and pressure concentration are distributed on the soldering and sealing plane of protrusion, thereby away from the glass solder packaging area, the direct impact on the glass packaging zone of the heat produced while reducing soldering and sealing and pressure, to guarantee the air-tightness of packaging.
Below by specific embodiment, structure of the present utility model and operation principle are described in detail.
Fig. 2 shows the section of structure of TO base in the utility model preferred embodiment;
Fig. 3 shows the assembly drawing after TO base and soldering and sealing device in the utility model complete soldering and sealing.
Referring to Fig. 2 and Fig. 3, the TO base comprises base body 1 and is welded in many lead-in wires 2 on base body 1, by glass solder, encapsulates between the gap between many lead-in wires 2 and base body 1.In the utility model, the zone definitions encapsulated by glass solder between base body 1 and lead-in wire 2 is glass solder packaging area 3.
On base body 1, also be provided with and the soldering and sealing section 4 that needs packaging 5 to weld.The upper surface that soldering and sealing section 4 protrudes from base body 1 arranges.Wherein, the upper surface of soldering and sealing section 4 needs packaging 5 for welding, and the upper surface of the lower surface of soldering and sealing section 4 and base body 1 is affixed.Preferably, soldering and sealing section is welded on the base body.And as preferred embodiment, soldering and sealing section 4 can be one-body molded with base body 1.In the present embodiment, the upper surface of base body 1 be in base body 1 with the end face that needs packaging 5 to be connected.
Below operation principle of the present utility model is described in detail.
When the TO base in needing packaging 5 and the utility model carries out soldering and sealing, need packaging 5 to be welded in and protrude from the soldering and sealing section 4 of base body 1 upper surface, high-voltage arc is concentrated and is distributed in soldering and sealing section 4 at the larger pressure of soldering and sealing zone generation and the higher heat of moment generation, thereby the heat produced while making soldering and sealing and pressure are away from glass solder packaging area 3, the direct impact on the glass packaging zone of the heat produced while having reduced soldering and sealing and pressure, thereby guarantee the air-tightness of packaging, greatly improve the qualification rate of packaging.
As preferred embodiment, the base body 1 in the utility model is cylinder, and soldering and sealing section 4 adopts annular, and the external diameter of soldering and sealing section 4 is identical with the diameter of base body 1.Wherein,
The soldering and sealing ring is 0.4～0.7mm with respect to the height of base body 1 upper surface.Preferably, in the present embodiment, the soldering and sealing ring is 0.4mm with respect to the height of base body 1 upper surface.
Soldering and sealing ring width radially is 1.2～1.8mm.Preferably, soldering and sealing ring width radially is 1.4mm.
In the present embodiment, the shape of soldering and sealing section 4 also can be oval or square.The utility model is not specifically limited the shape of soldering and sealing section 4, every protrude from base body 1 upper surface and can be used in the welding need the closed figure of closure means all to fall into protection range of the present utility model.
Pressure and heat when in the utility model, soldering and sealing section 4 can concentrate soldering and sealing, reduce and be distributed in pressure and the heat on base body 1, therefore the lead-in wire 2 on the base body 1 in the utility model embodiment can arrange more than at least 7, and 2 centers around base body 1 that go between are uniformly distributed, and the periphery that can be partial to base body 1 arranges.As preferred embodiment, Fig. 4 shows lead-in wire 2 distribution maps of the TO base that is provided with 10 lead-in wires 2.As shown in Figure 4, the lead-in wire 2 of 10 lead-in wires in 2 is one group, and every three lead-in wires 2 are one group in addition, and four groups of lead-in wires 2 are uniformly distributed in the periphery at base body 1 center, and near the edge setting of base body 1.By going between 2 near the edge settings of base bodies 1, electronic device and the assemblies such as resistance, heat sink and refrigerator can be placed in the position in the middle of base body 1, thereby greatly improve the encapsulated space of TO base.Lead-in wire 2 distribution maps shown in Fig. 4 are exemplary, everyly are uniformly distributed in base body 1 central periphery, and lead-in wire 2 distributed architectures that can improve TO base encapsulated space all fall into protection range of the present utility model.
Preferably, the base body 1 in the utility model embodiment is made by metal material.
As known from the above, TO base in the utility model, on the soldering and sealing plane that the heat produced in the time of can be by soldering and sealing and pressure concentration are distributed in protrusion, the heat produced while making soldering and sealing and pressure are away from glass solder packaging area 3, the direct impact on the glass packaging zone of the heat produced while reducing soldering and sealing and pressure, thereby guarantee the air-tightness of packaging, improve qualification rate and the reliability of packaging.
TO base in the utility model not only is applicable to the TO encapsulation of multilead 2 structures, also is applicable to the TO encapsulation of less lead-in wire 2 structures.
The foregoing is only preferred embodiment of the present utility model, not be used to limiting protection range of the present utility model.All within spirit of the present utility model and principle, any modification of doing, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (10)
1. a TO base, is characterized in that, comprises the base body and be welded in many lead-in wires on described base body, and described base body is provided with and the soldering and sealing section that needs packaging to weld;
Described soldering and sealing section protrudes and arranges with respect to the upper surface of base body, wherein,
The upper surface of described base body be in described base body with the described end face that needs packaging to be connected.
2. TO base according to claim 1, is characterized in that, described soldering and sealing section and described this body by integral forming of base.
3. TO base according to claim 1, is characterized in that, described soldering and sealing section is welded on described base body.
4. according to arbitrary described TO base in claims 1 to 3, it is characterized in that, described base body is cylinder, and described soldering and sealing section is annular, and the external diameter of described soldering and sealing section is identical with the diameter of described base body.
5. TO base according to claim 4, is characterized in that, described soldering and sealing ring is 0.4～0.7mm with respect to the height of described base body upper surface;
Described soldering and sealing ring width radially is 1.2～1.8mm.
6. TO base according to claim 1, is characterized in that, the gap between described lead-in wire and described base body encapsulates by glass solder.
7. TO base according to claim 1, is characterized in that, the radical of described lead-in wire is at least 7.
8. TO base according to claim 7, is characterized in that, the radical of described lead-in wire is 10.
9. according to the described TO base of claim 7 or 8, it is characterized in that, described lead-in wire is uniformly distributed around the center of described base body.
10. TO base according to claim 1, is characterized in that, described base body is made by metal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202817501U CN203312622U (en) | 2013-05-21 | 2013-05-21 | TO pedestal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202817501U CN203312622U (en) | 2013-05-21 | 2013-05-21 | TO pedestal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203312622U true CN203312622U (en) | 2013-11-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013202817501U Expired - Fee Related CN203312622U (en) | 2013-05-21 | 2013-05-21 | TO pedestal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203312622U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105610046A (en) * | 2016-03-24 | 2016-05-25 | 丹东依镭社电子科技有限公司 | High-power green laser integrated packaging tube |
| CN110710069A (en) * | 2018-12-29 | 2020-01-17 | 泉州三安半导体科技有限公司 | Laser packaging structure |
-
2013
- 2013-05-21 CN CN2013202817501U patent/CN203312622U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105610046A (en) * | 2016-03-24 | 2016-05-25 | 丹东依镭社电子科技有限公司 | High-power green laser integrated packaging tube |
| CN110710069A (en) * | 2018-12-29 | 2020-01-17 | 泉州三安半导体科技有限公司 | Laser packaging structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131127 Termination date: 20190521 |