CN105610046A - High-power green laser integrated packaging tube - Google Patents

High-power green laser integrated packaging tube Download PDF

Info

Publication number
CN105610046A
CN105610046A CN201610173489.1A CN201610173489A CN105610046A CN 105610046 A CN105610046 A CN 105610046A CN 201610173489 A CN201610173489 A CN 201610173489A CN 105610046 A CN105610046 A CN 105610046A
Authority
CN
China
Prior art keywords
crystal
power
base
laser
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610173489.1A
Other languages
Chinese (zh)
Inventor
何振新
初志刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dandong Xunlei Electronic Technology Co Ltd
Original Assignee
Dandong Xunlei Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dandong Xunlei Electronic Technology Co Ltd filed Critical Dandong Xunlei Electronic Technology Co Ltd
Priority to CN201610173489.1A priority Critical patent/CN105610046A/en
Publication of CN105610046A publication Critical patent/CN105610046A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Lasers (AREA)

Abstract

The invention relates to a laser integrated packaging tube, and specifically relates to a high-power green laser integrated packaging tube. According to the technical solution, the high-power green laser integrated packaging tube comprises a base, a packaging sleeve, a high-power light emitting chip, a laser crystal I, a laser crystal II, a planoconvex lens and a connecting pin, wherein a semicircular fixed rack is arranged at the upper part of the base, and the packaging sleeve is provided with a base mounting hole, a crystal mounting hole, light holes, a crystal mounting surface and an exit hole; the high-power light emitting chip is mounted at the fixed rack, the laser crystal I is mounted in the crystal mounting hole, the laser crystal II is mounted on the crystal mounting surface, the planoconvex lens is mounted at the exit hole, the connecting pin is mounted on the base, and the base is mounted in the base mounting hole. The high-power green laser integrated packaging tube can integrate and package the light emitting chip emitting high-power green laser and emit stable green laser and regular circular light spots.

Description

A kind of High-Power Green Light integration packaging pipe
Technical field
The present invention relates to a kind of laser integration packaging pipe, be specifically related to a kind of High-Power Green Light collectionBecome package tube.
Background technology
Current green laser integration packaging pipe, complex structure, poor stability, the laser merit of sendingRate is low, and hot spot is irregular. On market, can launch powerful blue-green laser diode, due to bodyLong-pending larger than low power, also there is no direct integration packaging.
Summary of the invention
The invention provides a kind of High-Power Green Light integration packaging pipe, can launch large by integration packagingThe luminescence chip of the green laser of power, can send stable green glow and regular circular light spot.
Technical scheme of the present invention is as follows:
A kind of High-Power Green Light integration packaging pipe, comprises base, package cover, high-power light-emittingChip, laser crystal one, laser crystal two, planoconvex lens and connecting needle, described base upperPortion is semicircle fixed mount, and described package cover is provided with base installing hole, crystal installing hole, printing opacityHole, crystal installed surface and light hole; Described high-power light-emitting chip is arranged on described fixed mount place,Described laser crystal one is arranged in described crystal installing hole, and described laser crystal two is arranged on instituteState on crystal installed surface, described planoconvex lens is arranged on described light hole place, described connecting needle peaceBe contained on described base, described floor installation is in described base installing hole.
Described High-Power Green Light integration packaging pipe, its preferred version is, described high-powerOptical chip is 808 luminescence chips, and its power is more than 500mW.
Beneficial effect of the present invention is as follows:
1, High-Power Green Light integration packaging pipe of the present invention, has configured two blocks of laser crystals,Make the smaller volume of laser crystal, can ensure again superior performance, the green glow sending canKeep stability.
2, the base installing hole of package cover, crystal installing hole, loophole and light hole are coaxially establishedPut, high-power light-emitting chip is also arranged on the circle central axis position of base, makes of the present invention largeThe green laser integration packaging of power pipe sends regular circular light spot.
3, High-Power Green Light integration packaging tubular construction of the present invention is simple, is suitable for raw in batchesProduce, practical.
Brief description of the drawings
Fig. 1 is High-Power Green Light integration packaging duct ligation composition of the present invention;
Fig. 2 is the structure chart of package cover;
Fig. 3 is the A-A face profile of Fig. 2;
Fig. 4 is the installation diagram of base, 808 luminescence chips and connecting needle;
Fig. 5 is the top view of Fig. 4.
Detailed description of the invention
As shown in Fig. 1～5, a kind of High-Power Green Light integration packaging pipe, comprises base 6, envelopeEncapsulation 1,808 more than power 500mW luminescence chips 5, laser crystal 1, laser crystalline substanceBody 23, planoconvex lens 2 and connecting needle 7, the top of described base 6 is semicircular fixingFrame 13, described package cover 1 be provided with base installing hole 8, crystal installing hole 9, loophole 10,Crystal installed surface 11 and light hole 12, base installing hole 8, crystal installing hole 9, loophole10 and light hole 12 coaxially arrange; 808 luminescence chips 5 are arranged on described fixed mount 13 places,Be positioned on the circle central axis of base 6; Described laser crystal one 4 use light glue bonds are at described crystalIn installing hole 9, described laser crystal 23 use light glue bonds on described crystal installed surface 11,Described planoconvex lens 2 is arranged on described light hole 12 places, described in described connecting needle 7 is arranged onOn base 6, described base 6 is arranged in described base installing hole 8.

Claims (2)

1. a High-Power Green Light integration packaging pipe, is characterized in that, comprises base, envelopeEncapsulation, high-power light-emitting chip, laser crystal one, laser crystal two, planoconvex lens and connectionPin, the top of described base is semicircle fixed mount, described package cover be provided with base installing hole,Crystal installing hole, loophole, crystal installed surface and light hole; Described high-power light-emitting chip peaceBe contained in described fixed mount place, described laser crystal one is arranged in described crystal installing hole, described inLaser crystal two is arranged on described crystal installed surface, and described planoconvex lens is arranged on described bright dippingHole place, described connecting needle is arranged on described base, and described floor installation is at described floor installationIn hole.
2. High-Power Green Light integration packaging pipe according to claim 1, its feature existsIn, described high-power light-emitting chip is 808 luminescence chips, its power is more than 500mW.
CN201610173489.1A 2016-03-24 2016-03-24 High-power green laser integrated packaging tube Pending CN105610046A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610173489.1A CN105610046A (en) 2016-03-24 2016-03-24 High-power green laser integrated packaging tube

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610173489.1A CN105610046A (en) 2016-03-24 2016-03-24 High-power green laser integrated packaging tube

Publications (1)

Publication Number Publication Date
CN105610046A true CN105610046A (en) 2016-05-25

Family

ID=55989692

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610173489.1A Pending CN105610046A (en) 2016-03-24 2016-03-24 High-power green laser integrated packaging tube

Country Status (1)

Country Link
CN (1) CN105610046A (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030231671A1 (en) * 2002-05-30 2003-12-18 Nan-Tsung Huang Small format optoelectronic package
CN2610497Y (en) * 2003-04-14 2004-04-07 深圳飞通光电股份有限公司 Photoelectronic device packaged by plastic
JP2007298643A (en) * 2006-04-28 2007-11-15 Nippon Telegr & Teleph Corp <Ntt> Optical element module and method for manufacturing the same
CN101438190A (en) * 2006-04-27 2009-05-20 菲尼萨公司 Low inductance optical transmitter submount assembly
CN101872935A (en) * 2009-04-22 2010-10-27 上海富伸光电有限公司 Manufacturing method of green laser module and products thereof
CN102742098A (en) * 2009-11-23 2012-10-17 赛米尼克斯有限公司 Semiconductor laser assembly and packaging system
CN202872174U (en) * 2012-09-14 2013-04-10 常州市正宇佳华激光设备有限公司 Novel spot-light-source laser module
CN203312622U (en) * 2013-05-21 2013-11-27 青岛海信宽带多媒体技术有限公司 TO pedestal

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030231671A1 (en) * 2002-05-30 2003-12-18 Nan-Tsung Huang Small format optoelectronic package
CN2610497Y (en) * 2003-04-14 2004-04-07 深圳飞通光电股份有限公司 Photoelectronic device packaged by plastic
CN101438190A (en) * 2006-04-27 2009-05-20 菲尼萨公司 Low inductance optical transmitter submount assembly
JP2007298643A (en) * 2006-04-28 2007-11-15 Nippon Telegr & Teleph Corp <Ntt> Optical element module and method for manufacturing the same
CN101872935A (en) * 2009-04-22 2010-10-27 上海富伸光电有限公司 Manufacturing method of green laser module and products thereof
CN102742098A (en) * 2009-11-23 2012-10-17 赛米尼克斯有限公司 Semiconductor laser assembly and packaging system
CN202872174U (en) * 2012-09-14 2013-04-10 常州市正宇佳华激光设备有限公司 Novel spot-light-source laser module
CN203312622U (en) * 2013-05-21 2013-11-27 青岛海信宽带多媒体技术有限公司 TO pedestal

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Legal Events

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20160525

RJ01 Rejection of invention patent application after publication