CN205565285U - High -power green sharp optical integrated circuit enclosure tube - Google Patents

High -power green sharp optical integrated circuit enclosure tube Download PDF

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Publication number
CN205565285U
CN205565285U CN201620233112.6U CN201620233112U CN205565285U CN 205565285 U CN205565285 U CN 205565285U CN 201620233112 U CN201620233112 U CN 201620233112U CN 205565285 U CN205565285 U CN 205565285U
Authority
CN
China
Prior art keywords
crystal
power
base
laser
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201620233112.6U
Other languages
Chinese (zh)
Inventor
何振新
初志刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dandong Xunlei Electronic Technology Co Ltd
Original Assignee
Dandong Xunlei Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dandong Xunlei Electronic Technology Co Ltd filed Critical Dandong Xunlei Electronic Technology Co Ltd
Priority to CN201620233112.6U priority Critical patent/CN205565285U/en
Application granted granted Critical
Publication of CN205565285U publication Critical patent/CN205565285U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to a swash optical integrated circuit enclosure tube, concretely relates to high -power green sharp optical integrated circuit enclosure tube. The utility model discloses an including base, encapsulation cover, high -power luminescence chip, laser crystal no. 1, laser crystal no. 2, plane -convex lens and connection needle, the upper portion of base is semi -circular mount, the encapsulation cover is equipped with base mounting hole, crystal mounting hole, light trap, crystal installation face and goes out the unthreaded hole, high -power luminous install the chip is in mount department, laser crystal no. 1 installs in the crystal mounting hole, laser crystal no. 2 installs on the crystal installation face, the plane -convex lens is installed unthreaded hole department goes out, it installs to connect the needle on the base, the pedestal mounting is in in the base mounting hole. The utility model provides a high -power green sharp optical integrated circuit enclosure tube, the luminescence chip of high -power green laser is launched in the encapsulation that can integrate, can send the circular facula of stable green glow and rule.

Description

A kind of High-Power Green Light integration packaging pipe
Technical field
This utility model relates to a kind of laser integration packaging pipe, is specifically related to a kind of high-power green sharp Light integration packaging pipe.
Background technology
Current green laser integration packaging pipe, structure is complicated, poor stability, the laser merit sent Rate is low, and hot spot is irregular.Powerful blue-green laser diode can be launched, due to body on market Long-pending than low power greatly, be not the most directly integrated encapsulation.
Utility model content
This utility model provides a kind of High-Power Green Light integration packaging pipe, it is possible to integration packaging is sent out Penetrate the luminescence chip of High-Power Green Light, stable green glow and the circular light spot of rule can be sent.
The technical solution of the utility model is as follows:
A kind of High-Power Green Light integration packaging pipe, including base, package cover, high-power light-emitting Chip, laser crystal one, laser crystal two, planoconvex lens and connection pin, described base upper Portion is semicircle fixed mount, and described package cover is provided with base installing hole, crystal installing hole, printing opacity Hole, crystal installed surface and light hole;Described high-power light-emitting chip is arranged at described fixed mount, Described laser crystal one is arranged in described crystal installing hole, and described laser crystal two is arranged on institute Stating on crystal installed surface, described planoconvex lens is arranged at described light hole, and described connection pin is pacified Being contained on described base, described floor installation is in described base installing hole.
Described High-Power Green Light integration packaging pipe, its preferred version is, described high-power Optical chip is 808 luminescence chips, and its power is at more than 500mW.
The beneficial effects of the utility model are as follows:
1, High-Power Green Light integration packaging pipe of the present utility model, is configured with two pieces of laser crystalline substances Body so that the volume of laser crystal diminishes, ensure that again superior performance, the green glow sent Stability can be kept.
2, the base installing hole of package cover, crystal installing hole, loophole and light hole coaxially set Putting, high-power light-emitting chip is also mounted at the circle central axis position of base so that this utility model High-Power Green Light integration packaging pipe send rule circular light spot.
3, High-Power Green Light integration packaging tubular construction of the present utility model is simple, is suitable for criticizing Amount produces, practical.
Accompanying drawing explanation
Fig. 1 is High-Power Green Light integration packaging tubular construction figure of the present utility model;
Fig. 2 is the structure chart of package cover;
Fig. 3 is the A-A face profile of Fig. 2;
Fig. 4 is base, 808 luminescence chips and the installation diagram connecting pin;
Fig. 5 is the top view of Fig. 4.
Detailed description of the invention
As shown in Fig. 1~5, a kind of High-Power Green Light integration packaging pipe, including base 6, envelope Encapsulation 1,808 luminescence chips 5 of more than power 500mW, laser crystal 1, laser are brilliant Body 23, planoconvex lens 2 and connection pin 7, the top of described base 6 is semicircular fixing Frame 13, described package cover 1 be provided with base installing hole 8, crystal installing hole 9, loophole 10, Crystal installed surface 11 and light hole 12, base installing hole 8, crystal installing hole 9, loophole 10 and light hole 12 be coaxially disposed;808 luminescence chips 5 are arranged at described fixed mount 13, It is positioned on the circle central axis of base 6;Described laser crystal 1 uses light glue bond at described crystal In installing hole 9, described laser crystal 23 with light glue bond on described crystal installed surface 11, Described planoconvex lens 2 is arranged at described light hole 12, and described connection pin 7 is arranged on described On base 6, described base 6 is arranged in described base installing hole 8.

Claims (2)

1. a High-Power Green Light integration packaging pipe, it is characterised in that include base, envelope Encapsulation, high-power light-emitting chip, laser crystal one, laser crystal two, planoconvex lens and connection Pin, the top of described base is semicircle fixed mount, described package cover be provided with base installing hole, Crystal installing hole, loophole, crystal installed surface and light hole;Described high-power light-emitting chip is pacified Being contained at described fixed mount, described laser crystal one is arranged in described crystal installing hole, described Laser crystal two is arranged on described crystal installed surface, described planoconvex lens be arranged on described in go out light At hole, described connection pin is arranged on described base, and described floor installation is at described floor installation In hole.
High-Power Green Light integration packaging pipe the most according to claim 1, its feature exists In, described high-power light-emitting chip is 808 luminescence chips, and its power is at more than 500mW.
CN201620233112.6U 2016-03-24 2016-03-24 High -power green sharp optical integrated circuit enclosure tube Expired - Fee Related CN205565285U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620233112.6U CN205565285U (en) 2016-03-24 2016-03-24 High -power green sharp optical integrated circuit enclosure tube

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620233112.6U CN205565285U (en) 2016-03-24 2016-03-24 High -power green sharp optical integrated circuit enclosure tube

Publications (1)

Publication Number Publication Date
CN205565285U true CN205565285U (en) 2016-09-07

Family

ID=56815368

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620233112.6U Expired - Fee Related CN205565285U (en) 2016-03-24 2016-03-24 High -power green sharp optical integrated circuit enclosure tube

Country Status (1)

Country Link
CN (1) CN205565285U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160907

Termination date: 20210324

CF01 Termination of patent right due to non-payment of annual fee