TW200635073A - A wire-bonding free packaging structure of light emitted diode - Google Patents
A wire-bonding free packaging structure of light emitted diodeInfo
- Publication number
- TW200635073A TW200635073A TW094108807A TW94108807A TW200635073A TW 200635073 A TW200635073 A TW 200635073A TW 094108807 A TW094108807 A TW 094108807A TW 94108807 A TW94108807 A TW 94108807A TW 200635073 A TW200635073 A TW 200635073A
- Authority
- TW
- Taiwan
- Prior art keywords
- wire
- packaging
- led
- packaging structure
- light emitted
- Prior art date
Links
Abstract
The present invention discloses a wire-bonding free packaging structure for light emitting diode (LED). Prepare a silicon sub-mount having a backside bulk micromachining reach-through U-shape cavity for accommodating a flip-chip LED. This stack-integrated packaging module with solder bumps on the surface is then bonded to an aluminum PC board with flip-chip surface mount packaging or bump technology. This gives very good heat conduction to the heat sink of the PC board and can endure more current to enhance light intensity of the LED. This stack-integrated packaging module can also be bonded on an ordinary bonding seat of two leg packaging, which can also increase heat conduction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94108807A TWI272731B (en) | 2005-03-22 | 2005-03-22 | A wire-bonding free packaging structure of light emitted diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94108807A TWI272731B (en) | 2005-03-22 | 2005-03-22 | A wire-bonding free packaging structure of light emitted diode |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200635073A true TW200635073A (en) | 2006-10-01 |
TWI272731B TWI272731B (en) | 2007-02-01 |
Family
ID=38441329
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94108807A TWI272731B (en) | 2005-03-22 | 2005-03-22 | A wire-bonding free packaging structure of light emitted diode |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI272731B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI385830B (en) * | 2009-03-17 | 2013-02-11 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102237471B (en) * | 2010-04-29 | 2014-08-27 | 展晶科技(深圳)有限公司 | Light-emitting diode packaging structure and manufacturing method thereof |
TWI462327B (en) * | 2012-02-06 | 2014-11-21 | Lite On Electronics Guangzhou | Positioning system |
-
2005
- 2005-03-22 TW TW94108807A patent/TWI272731B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI385830B (en) * | 2009-03-17 | 2013-02-11 |
Also Published As
Publication number | Publication date |
---|---|
TWI272731B (en) | 2007-02-01 |
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