TW200635073A - A wire-bonding free packaging structure of light emitted diode - Google Patents

A wire-bonding free packaging structure of light emitted diode

Info

Publication number
TW200635073A
TW200635073A TW094108807A TW94108807A TW200635073A TW 200635073 A TW200635073 A TW 200635073A TW 094108807 A TW094108807 A TW 094108807A TW 94108807 A TW94108807 A TW 94108807A TW 200635073 A TW200635073 A TW 200635073A
Authority
TW
Taiwan
Prior art keywords
wire
packaging
led
packaging structure
light emitted
Prior art date
Application number
TW094108807A
Other languages
Chinese (zh)
Other versions
TWI272731B (en
Inventor
Jin-Shown Shie
Ji-Yung Shie
Chien-Chung Lin
Original Assignee
Integrated Crystal Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Integrated Crystal Technology Inc filed Critical Integrated Crystal Technology Inc
Priority to TW94108807A priority Critical patent/TWI272731B/en
Publication of TW200635073A publication Critical patent/TW200635073A/en
Application granted granted Critical
Publication of TWI272731B publication Critical patent/TWI272731B/en

Links

Abstract

The present invention discloses a wire-bonding free packaging structure for light emitting diode (LED). Prepare a silicon sub-mount having a backside bulk micromachining reach-through U-shape cavity for accommodating a flip-chip LED. This stack-integrated packaging module with solder bumps on the surface is then bonded to an aluminum PC board with flip-chip surface mount packaging or bump technology. This gives very good heat conduction to the heat sink of the PC board and can endure more current to enhance light intensity of the LED. This stack-integrated packaging module can also be bonded on an ordinary bonding seat of two leg packaging, which can also increase heat conduction.
TW94108807A 2005-03-22 2005-03-22 A wire-bonding free packaging structure of light emitted diode TWI272731B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94108807A TWI272731B (en) 2005-03-22 2005-03-22 A wire-bonding free packaging structure of light emitted diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94108807A TWI272731B (en) 2005-03-22 2005-03-22 A wire-bonding free packaging structure of light emitted diode

Publications (2)

Publication Number Publication Date
TW200635073A true TW200635073A (en) 2006-10-01
TWI272731B TWI272731B (en) 2007-02-01

Family

ID=38441329

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94108807A TWI272731B (en) 2005-03-22 2005-03-22 A wire-bonding free packaging structure of light emitted diode

Country Status (1)

Country Link
TW (1) TWI272731B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385830B (en) * 2009-03-17 2013-02-11

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102237471B (en) * 2010-04-29 2014-08-27 展晶科技(深圳)有限公司 Light-emitting diode packaging structure and manufacturing method thereof
TWI462327B (en) * 2012-02-06 2014-11-21 Lite On Electronics Guangzhou Positioning system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385830B (en) * 2009-03-17 2013-02-11

Also Published As

Publication number Publication date
TWI272731B (en) 2007-02-01

Similar Documents

Publication Publication Date Title
US7385227B2 (en) Compact light emitting device package with enhanced heat dissipation and method for making the package
TW200644280A (en) LED wafer-level chip scale packaging
WO2007126720A3 (en) Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same
WO2014039833A4 (en) Integrated led based illumination device
JP4353196B2 (en) Light emitting device
JP3159412U (en) LED package structure
TW200733436A (en) Light emitting diode package structure and fabrication method thereof
TW200503048A (en) Composite leadframe led package and method of making the same
EP1605525A3 (en) High power LED package
MY138237A (en) Collets for bonding of light emitting diodes having shaped substrates
WO2008130541A3 (en) Semiconductor light emitting device packages and methods
WO2004023522A3 (en) Power surface mount light emitting die package
TW200625683A (en) Methods of assembly for a semiconductor light emitting device package
TW200703708A (en) Package structure of light-emitting diode with electrothermal component
WO2014122888A1 (en) Light-emitting module
TW200709456A (en) Semiconductor chip package and application device thereof
JP2004207367A (en) Light emitting diode and light emitting diode arrangement plate
JP4821343B2 (en) Submount substrate and light emitting device including the same
TWM500362U (en) Led module
US20100084673A1 (en) Light-emitting semiconductor packaging structure without wire bonding
TW200635073A (en) A wire-bonding free packaging structure of light emitted diode
JP5530321B2 (en) Lamp and lighting device
WO2010137841A3 (en) Light-emitting diode package and backlight unit
TWI604584B (en) Chip-scale package and semiconductor device assembly
WO2007024355A3 (en) Heat sink packaging assembly for electronic components