TWI385830B - - Google Patents
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- Publication number
- TWI385830B TWI385830B TW98108579A TW98108579A TWI385830B TW I385830 B TWI385830 B TW I385830B TW 98108579 A TW98108579 A TW 98108579A TW 98108579 A TW98108579 A TW 98108579A TW I385830 B TWI385830 B TW I385830B
- Authority
- TW
- Taiwan
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW98108579A TW201036195A (en) | 2009-03-17 | 2009-03-17 | Modular LED |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW98108579A TW201036195A (en) | 2009-03-17 | 2009-03-17 | Modular LED |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201036195A TW201036195A (en) | 2010-10-01 |
TWI385830B true TWI385830B (en) | 2013-02-11 |
Family
ID=44856142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW98108579A TW201036195A (en) | 2009-03-17 | 2009-03-17 | Modular LED |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW201036195A (en) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200635073A (en) * | 2005-03-22 | 2006-10-01 | Integrated Crystal Technology Inc | A wire-bonding free packaging structure of light emitted diode |
JP2007019519A (en) * | 2005-07-08 | 2007-01-25 | Samsung Electronics Co Ltd | Light emitting diode module, backlight assembly equipped with it, and display device equipped with it |
TW200715622A (en) * | 2005-09-01 | 2007-04-16 | Du Pont | Low temperature co-fired ceramic (LTCC) tape compositions, light-emitting diode (LED) modules, lighting devices and methods of forming thereof |
US7210957B2 (en) * | 2004-04-06 | 2007-05-01 | Lumination Llc | Flexible high-power LED lighting system |
TW200727511A (en) * | 2006-01-12 | 2007-07-16 | Ying-Chieh Liu | Thermal substrate design for LED lighting module |
EP1929202A1 (en) * | 2005-09-22 | 2008-06-11 | Philips Intellectual Property & Standards GmbH | Led lighting module |
JP2008277817A (en) * | 2007-05-07 | 2008-11-13 | Advance Connectek Inc | Heat dissipation module and method for fabricating the same |
TW200905323A (en) * | 2007-07-23 | 2009-02-01 | K Laser Technology Inc | LED backlight with bare chip LED |
-
2009
- 2009-03-17 TW TW98108579A patent/TW201036195A/en not_active IP Right Cessation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7210957B2 (en) * | 2004-04-06 | 2007-05-01 | Lumination Llc | Flexible high-power LED lighting system |
TW200635073A (en) * | 2005-03-22 | 2006-10-01 | Integrated Crystal Technology Inc | A wire-bonding free packaging structure of light emitted diode |
JP2007019519A (en) * | 2005-07-08 | 2007-01-25 | Samsung Electronics Co Ltd | Light emitting diode module, backlight assembly equipped with it, and display device equipped with it |
TW200715622A (en) * | 2005-09-01 | 2007-04-16 | Du Pont | Low temperature co-fired ceramic (LTCC) tape compositions, light-emitting diode (LED) modules, lighting devices and methods of forming thereof |
EP1929202A1 (en) * | 2005-09-22 | 2008-06-11 | Philips Intellectual Property & Standards GmbH | Led lighting module |
TW200727511A (en) * | 2006-01-12 | 2007-07-16 | Ying-Chieh Liu | Thermal substrate design for LED lighting module |
JP2008277817A (en) * | 2007-05-07 | 2008-11-13 | Advance Connectek Inc | Heat dissipation module and method for fabricating the same |
TW200905323A (en) * | 2007-07-23 | 2009-02-01 | K Laser Technology Inc | LED backlight with bare chip LED |
Also Published As
Publication number | Publication date |
---|---|
TW201036195A (en) | 2010-10-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |