CN204303803U - Stable type super large-scale integration lead frame - Google Patents
Stable type super large-scale integration lead frame Download PDFInfo
- Publication number
- CN204303803U CN204303803U CN201520026998.2U CN201520026998U CN204303803U CN 204303803 U CN204303803 U CN 204303803U CN 201520026998 U CN201520026998 U CN 201520026998U CN 204303803 U CN204303803 U CN 204303803U
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- CN
- China
- Prior art keywords
- bar shaped
- rectangle slide
- lead
- slide holder
- wire
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- Expired - Fee Related
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses stable type super large-scale integration lead frame, it comprises rectangular frame body (1), lead-in wire (2), middle muscle (3) and 4 rectangle slide holders (4) linearly spaced apart, the surrounding of rectangle slide holder is evenly provided with the short groove group of bar shaped, bar shaped short groove group comprises two short grooves of spaced bar shaped (5), the side of rectangle slide holder is provided with bar shaped elongated slot (6) along the length direction of rectangular frame body, rectangle slide holder specification is 7mm × 7mm, and the length of lead-in wire is 2mm.The beneficial effects of the utility model are in blanking process, have better Stress Release ability, improve product quality, decrease the generation that distortion is bad, ensure that the yield of product, improve stamping-out speed, reduce cost, create higher benefit; The shortening of lead-in wire, improves the stability of stamping-out product, adds the area in the sharp routing region that goes between, for the routing welding sequence of chip provides better reliability.
Description
Technical field
The utility model relates to lead frame, particularly relates to the lead frame, the stable type super large-scale integration lead frame that use material based on copper or copper alloy, encapsulate for various intelligent chip.
Background technology
LQFP (Low Pprofile Quad Fflat Pakage) plastic flat four limit lead packages, number of pins is more than 100, pin-pitch (0.50,0.40), thickness 1.40mm, volume is little, lightweight, density is high, and thickness is thin, the ratio (LQFP128L: 14*14/7*7=4: 1) of chip area and package area, much smaller compared with DIP, SOP, SSOP, can say that relative volume is little.Generally extensive or super large-scale integration adopts this packing forms.Be characterized in being applicable to SMD surface mounting technique installation wiring in PCB, product is applicable to high frequency, easy to operate, and reliability is high, and the ratio between package area and chip area is little, and packaging technology difficulty is large.The surrounding of the chip of LQFP encapsulation all has pin, and the spacing of pin is very little, pin is also very thin, and the chip of this form encapsulation must adopt SMT (Surface Mount Technology, surface installation technique) pin on chip limit and mainboard to be welded.The chip adopting SMT to install need not punch on mainboard, generally has the solder joint of the respective pin designed on the surface at mainboard.Each for chip pin is aimed at corresponding solder joint, can realize and the welding of mainboard.The punching production of domestic LQFP lead frame is mainly with below 64 pins, and single or two rows are main, and production efficiency is low, and processing cost is high.In blanking process, in often occurring, pin tilts, interior pin distortion, and the fluctuation of slide holder coplanarity is large, and positive flake products exists internal stress and cannot discharge, and causes full wafer product distortion to be out of shape, and the fraction defective of product is very high, further increases production cost.
Utility model content
The technical problems to be solved in the utility model is the easy distortion of pin in existing in existing LQFP lead frame process, slide holder coplanarity fluctuates large, affect planarization and the qualification rate of Total Product, a kind of stable type super large-scale integration lead frame is provided for this reason.
The technical solution of the utility model is: stable type super large-scale integration lead frame, it comprises rectangular frame body, lead-in wire, middle muscle and 4 rectangle slide holders linearly spaced apart, the surrounding of described rectangle slide holder is evenly provided with the short groove group of bar shaped, described bar shaped short groove group comprises two short grooves of spaced bar shaped, the side of described rectangle slide holder is provided with bar shaped elongated slot along the length direction of rectangular frame body, described rectangle slide holder specification is 7mm*7mm, and the length of described lead-in wire is 2mm.
The improvement of such scheme is the length direction of described middle muscle and rectangular frame body is 40 ° of inclination angles, and described middle muscle is provided with the reinforcement of the expansion in middle muscle diameter near rectangle slide holder place.
The beneficial effects of the utility model are in blanking process, have better Stress Release ability, improve product quality, decrease the generation that distortion is bad, ensure that the yield of product, improve stamping-out speed, reduce cost, create higher benefit; The shortening of lead-in wire, improves the stability of stamping-out product, adds the area in the sharp routing region that goes between, for the routing welding sequence of chip provides better reliability.
Accompanying drawing explanation
Fig. 1 is the utility model schematic diagram;
Fig. 2 is single rectangle slide holder schematic diagram in Fig. 1;
In figure, 1, rectangular frame body, 2, lead-in wire, 3, middle muscle, 4, rectangle slide holder, 5, the short groove of bar shaped, 6, bar shaped elongated slot, 7, reinforcement.
Detailed description of the invention
Below in conjunction with accompanying drawing, the utility model is described further.
As shown in Figure 1 and Figure 2, the utility model comprises rectangular frame body 1, lead-in wire 2, middle muscle 3 and 4 rectangle slide holders 4 linearly spaced apart, the surrounding of described rectangle slide holder is evenly provided with the short groove group of bar shaped, described bar shaped short groove group comprises two short grooves 5 of spaced bar shaped, the side of described rectangle slide holder is provided with bar shaped elongated slot 6 along the length direction of rectangular frame body, described rectangle slide holder specification is 7mm*7mm, and the length of described lead-in wire is 2mm.
The specification of rectangle slide holder increases, and can hold more chip wafer.Lead-in wire shortens to 2mm, improves the stability of stamping-out product, adds the area in the sharp routing region that goes between, for the routing welding sequence of chip provides better reliability.The design of the short groove of bar shaped makes lead frame in blanking process, have better Stress Release ability, improves product quality, decreases the generation that distortion is bad, ensure that the yield of product, improve stamping-out speed, reduce cost, create higher benefit.Rectangle slide holder is increased to 4 rows by the past single, has increased exponentially production capacity.
In order to improve stability during stamping-out further, the length direction of described middle muscle and rectangular frame body is 40 ° of inclination angles, and described middle muscle is provided with the reinforcement 7 of the expansion in middle muscle diameter near rectangle slide holder place.The inclination angle of middle muscle and the design of reinforcement make rectangle slide holder obtain more stable connection, further counteracting stress, and reinforcement is preferably in trapezoidal, is namely contracted to middle muscle diameter unified on the direction away from rectangle slide holder gradually, be conducive to like this transmitting strength, stress is dissipated.
Claims (2)
1. stable type super large-scale integration lead frame, it comprises rectangular frame body (1), lead-in wire (2), middle muscle (3) and 4 rectangle slide holders (4) linearly spaced apart, it is characterized in that the surrounding of described rectangle slide holder is evenly provided with the short groove group of bar shaped, described bar shaped short groove group comprises two short grooves of spaced bar shaped (5), the side of described rectangle slide holder is provided with bar shaped elongated slot (6) along the length direction of rectangular frame body, described rectangle slide holder specification is 7mm*7mm, and the length of described lead-in wire is 2mm.
2. stable type super large-scale integration lead frame as claimed in claim 1, it is characterized in that the length direction of described middle muscle and rectangular frame body is 40 ° of inclination angles, described middle muscle is provided with the reinforcement (7) in the expansion of middle muscle diameter near rectangle slide holder place.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520026998.2U CN204303803U (en) | 2015-01-15 | 2015-01-15 | Stable type super large-scale integration lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520026998.2U CN204303803U (en) | 2015-01-15 | 2015-01-15 | Stable type super large-scale integration lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204303803U true CN204303803U (en) | 2015-04-29 |
Family
ID=53109321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520026998.2U Expired - Fee Related CN204303803U (en) | 2015-01-15 | 2015-01-15 | Stable type super large-scale integration lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204303803U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023115320A1 (en) * | 2021-12-21 | 2023-06-29 | Texas Instruments Incorporated | Nonlinear structure for connecting multiple die attach pads |
-
2015
- 2015-01-15 CN CN201520026998.2U patent/CN204303803U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023115320A1 (en) * | 2021-12-21 | 2023-06-29 | Texas Instruments Incorporated | Nonlinear structure for connecting multiple die attach pads |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150429 Termination date: 20160115 |
|
| EXPY | Termination of patent right or utility model |