CN205265034U - Semiconductor laser tube socket fixed mould strip - Google Patents
Semiconductor laser tube socket fixed mould strip Download PDFInfo
- Publication number
- CN205265034U CN205265034U CN201521132155.7U CN201521132155U CN205265034U CN 205265034 U CN205265034 U CN 205265034U CN 201521132155 U CN201521132155 U CN 201521132155U CN 205265034 U CN205265034 U CN 205265034U
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- tube socket
- shell fragment
- semiconductor laser
- mould strip
- fixed
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Abstract
The utility model provides a semiconductor laser tube socket fixed mould strip, includes the mould strip body and shell fragment, and the shell fragment is fixed to be set up on the mould strip body, sets up porose groove on the mould strip body, and it is protruding to be provided with the tube socket location on the groove of hole. Place a semiconductor laser tube socket at every hole inslot of the mould strip body, the shape in hole groove is consistent with the appearance of tube socket to tube socket on clearing hole groove location is protruding to the tube socket location, guarantee the institute on the porose groove the tube socket the orientation unanimously, every tube socket is all pushed down through the shell fragment, and the shell fragment makes two certain angles of preforming leanin of tube socket, can bring sufficient pressure like this, guarantees that the shell fragment is abundant with the tube socket contact, makes the tube socket fixed firm. The utility model discloses a shell fragment is fixed the semiconductor laser tube socket on the mould strip, thereby has solved the problem that the tube socket does not have the carrier and can not get fixing unable batch production, and is fixed firm to the tube socket, and difficult becoming flexible is good with the tolerable error rate of whole production encapsulation process, has improved the packaging efficiency, realizes the batchization of production.
Description
Technical field
The utility model relates to a kind of mould bar for fixing semiconductor laser base, belongs to the fixing skill of semiconductor laser baseArt field.
Background technology
Through the development of decades of photoelectricity industry, semiconductor laser is more and more subject to social extensive concern, and manyField, place is applied. The photoelectric transformation efficiency of semiconductor laser is higher than like product, can reach more than 60% its energy consumptionLow. The advantages such as in device, heat accumulation is few, the life-span is long, collimation is good, illumination distances is far away are new as one in the similar industry of societyEmerging technology application is more and more extensive. What the working portion of semiconductor laser mainly leaned on is chip, and chip is thrown after energising conductingPenetrate laser. But chip must need certain working material, in the industry, conventionally adopt vacuum tube socket leading to as chipCharge carrier. Vacuum tube socket is for fixed chip, and according to prior art, semiconductor laser needs to carry out batch in encapsulation processProduce, chip also needs being fixed on vacuum tube socket of batch thus. Want to produce in batches, need special equipment,To improve the efficiency of production and processing. For chip can be fixed on base in batches, base needs arranged in sequence on special carrierFace, carrier is to be mainly used for fixing base. Carrier moves on the conveying track of special equipment, while reaching predetermined station, specialThe positioner of equipment positions carrier.
There is at present the carrier of vacuum tube socket miscellaneous at the production field of the industry, due to the volume ratio of vacuum tube socket ownLittle, if do not have certain carrier will not reach the mass of production, can affect to a great extent the speed of its production. HalfThe core component of conductor laser is exactly electronic triode, and semiconductor laser must have certain carrier could realize envelope thusThe mass that dress is produced, carrier plays the effect of location on the one hand, also plays in process of production on the other hand fixing effect.
In the industry, there is at present the base carrier of device miscellaneous as semiconductor laser, but excellent scarce different. InState patent documentation CN204642945 discloses a kind of " the rail transport mechanism of vacuum tube socket ", comprises conveying track and support plate; FortuneDefeated track is provided with stopping means and four jiaos of positioners, four jiaos of positioners comprise a substrate, four fairleads, four gripper shoes,A plate, a cylinder, substrate is fixed on pedestal plate, and substrate is between the first guide rail and the second guide rail, and fairlead is fixedOn four angles of substrate, support bar is arranged in fairlead, and the bottom of support bar is fixed on connecting plate, and connecting plate is positioned at machineThe below of frame plate, connecting plate is fixed in the cylinder block of cylinder, and the piston rod of cylinder is fixed on the bottom surface of substrate, four of support platesOn angle, offer supported hole. At stopping means, support plate is carried out under spacing prerequisite, the support bar insertion support plate of four jiaos of positionersIn supported hole, by firm support plate and accurate must being positioned on predetermined station, ensure that electronic device is fixed on vacuum tube socket accurately.
In the rail transport mechanism of above-mentioned vacuum tube socket, do not have clear and definite base fixture, in production encapsulation process, unavoidably canBecause the movement of base brings impact to technique.
Summary of the invention
The deficiency existing for existing semiconductor laser base technique for fixing, the utility model provides a kind of fixation, with wholeThe good semiconductor laser base fixed die bar of serious forgiveness of individual production encapsulation process.
Semiconductor laser base fixed die bar of the present utility model, adopts following technical scheme:
This mould bar, comprises mould bar body and shell fragment, and shell fragment is fixedly installed on mould bar body, is provided with hole slot, on hole slot on mould bar bodyBe provided with base positioning convex.
Described mould bar body is cuboid.
The shape of described hole slot is consistent with the profile of semiconductor laser base.
On described mould bar body, be provided with locating slot, the bottom of shell fragment is provided with the projection coordinating with the locating slot on mould bar body. Pass throughProjection fixes shell fragment with the combination of locating slot, and it can not be horizontally slipped on mould bar body.
Described shell fragment top is narrower than bottom, the relative bottom angled 8-12 degree in top. Can make like this shell fragment have enough pressure will manageSeat is fixed on mould bar body, ensures that base position in encapsulation production process can not get production problem fixing and that bring.
In each hole slot of mould bar body, place a semiconductor laser base, the shape of hole slot is consistent with the profile of base,And by the base positioning convex on hole slot, base is located, ensure that the direction of the base on all hole slots is consistent; Each base is equalPush down by shell fragment, shell fragment makes two compressing tablets of base certain angle that slopes inwardly, and can bring so enough pressure, ensuresShell fragment contacts fully with base, makes base fixation.
The utility model is fixed on semiconductor laser base on mould bar by shell fragment, and having solved base does not have carrier and can not getThereby the fixing problem that cannot produce in batches, to base fixation, is difficult for becoming flexible, with the serious forgiveness of whole production encapsulation processGood, improve packaging efficiency, realize the mass of producing.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model semiconductor laser base fixed die bar.
In figure: 1, mould bar body; 2, shell fragment; 3, semiconductor laser base; 4, projection; 5, hole slot.
Detailed description of the invention
As shown in Figure 1, semiconductor laser base fixed die bar of the present utility model, comprises mould bar body 1 and shell fragment 2. Mould barBody 1 is rectangular structure, is provided with several hole slots 5 on it, and hole slot 5 is spaced apart on mould bar body 1. The shape of hole slot 5Shape is consistent with the profile of semiconductor laser base 3. In hole slot 5, be provided with for noise spectra of semiconductor lasers base 3 and determineThe base positioning convex of position, ensures that the direction of the base in all hole slots is consistent. On mould bar body 1, be also provided with locating slot, pass throughLocating slot is fixed on shell fragment 2 location on mould bar body 1. Shell fragment 2 is high rigidity irony shell fragment, is not easy distortion, service lifeFor a long time, its profile, according to the configuration design of mould bar body 1, can be good at being coupled on mould bar body 1. The bottom of shell fragment 2 is provided withThe projection 4 coordinating with the locating slot on mould bar body 1, is combined shell fragment 2 is fixed with the locating slot of mould bar body 1 by projection 4,It can not be horizontally slipped on mould bar body 1. Shell fragment 2 is up-narrow and down-wide, the certain angle of the relative bottom angled in top, this angleFor 8-12 degree, can make like this shell fragment 1 there is enough pressure semiconductor laser base 3 is fixed on mould bar body, ensure pipeSeat 3 position in encapsulation production process can not get production problem fixing and that bring.
In each hole slot of mould bar body 1, place a semiconductor laser base 3, and by the base convex on hole slot 5Rise base location, ensure that the direction of the base on all hole slots is consistent. Each base is all pushed down by shell fragment 2, and shell fragment 2 makesTwo compressing tablets of base certain angle that slopes inwardly, can bring enough pressure like this, ensures that shell fragment 2 contacts and fills with base 3Point, make base 3 fixations.
Claims (5)
1. a semiconductor laser base fixed die bar, is characterized in that, comprises mould bar body and shell fragment, and shell fragment is fixedly installed on mould bar body, on mould bar body, is provided with hole slot, is provided with base positioning convex on hole slot.
2. semiconductor laser base fixed die bar according to claim 1, is characterized in that, described mould bar body is cuboid.
3. semiconductor laser base fixed die bar according to claim 1, is characterized in that, the shape of described hole slot is consistent with the profile of semiconductor laser base.
4. semiconductor laser base fixed die bar according to claim 1, is characterized in that, on described mould bar body, is provided with locating slot, and the bottom of shell fragment is provided with the projection coordinating with the locating slot on mould bar body.
5. semiconductor laser base fixed die bar according to claim 1, is characterized in that, described shell fragment top is narrower than bottom, the relative bottom angled 8-12 degree in top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521132155.7U CN205265034U (en) | 2015-12-30 | 2015-12-30 | Semiconductor laser tube socket fixed mould strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521132155.7U CN205265034U (en) | 2015-12-30 | 2015-12-30 | Semiconductor laser tube socket fixed mould strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205265034U true CN205265034U (en) | 2016-05-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521132155.7U Active CN205265034U (en) | 2015-12-30 | 2015-12-30 | Semiconductor laser tube socket fixed mould strip |
Country Status (1)
| Country | Link |
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| CN (1) | CN205265034U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105834725A (en) * | 2016-05-27 | 2016-08-10 | 山东华光光电子股份有限公司 | Tool for fast mounting and demounting LD die bar and elastic piece and use method of tool |
| CN106216979A (en) * | 2016-08-10 | 2016-12-14 | 山东华光光电子股份有限公司 | The detachment device of a kind of semiconductor laser mould bar and shell fragment and method for splitting |
| CN107089400A (en) * | 2017-06-14 | 2017-08-25 | 湖南粤港光电科技有限公司 | A kind of mould bar and the modularization housing with decoration element |
| CN108971266A (en) * | 2017-06-01 | 2018-12-11 | 山东华光光电子股份有限公司 | A kind of semiconductor laser tabletting prosthetic device and its working method and application |
| CN109872956A (en) * | 2017-12-05 | 2019-06-11 | 山东华光光电子股份有限公司 | A kind of the rapid material-feeding device and its charging method of semiconductor laser tube socket |
| CN110676686A (en) * | 2018-07-02 | 2020-01-10 | 潍坊华光光电子有限公司 | Die bonding clamp and die bonding method for photoelectric detector of semiconductor laser |
| CN110676687A (en) * | 2018-07-02 | 2020-01-10 | 潍坊华光光电子有限公司 | Cap mounting device and method for welding semiconductor laser tube cap |
| CN110943365A (en) * | 2018-09-25 | 2020-03-31 | 潍坊华光光电子有限公司 | Device and method for quickly fixing tube seat of semiconductor laser |
| CN112713497A (en) * | 2019-10-25 | 2021-04-27 | 潍坊华光光电子有限公司 | Die strip fixing carrier for semiconductor laser |
-
2015
- 2015-12-30 CN CN201521132155.7U patent/CN205265034U/en active Active
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105834725A (en) * | 2016-05-27 | 2016-08-10 | 山东华光光电子股份有限公司 | Tool for fast mounting and demounting LD die bar and elastic piece and use method of tool |
| CN105834725B (en) * | 2016-05-27 | 2018-06-22 | 山东华光光电子股份有限公司 | The tooling and its application method of a kind of LD moulds item and shrapnel quick despatch |
| CN106216979A (en) * | 2016-08-10 | 2016-12-14 | 山东华光光电子股份有限公司 | The detachment device of a kind of semiconductor laser mould bar and shell fragment and method for splitting |
| CN106216979B (en) * | 2016-08-10 | 2018-08-28 | 山东华光光电子股份有限公司 | A kind of detachment device and method for splitting of semiconductor laser mould item and shrapnel |
| CN108971266A (en) * | 2017-06-01 | 2018-12-11 | 山东华光光电子股份有限公司 | A kind of semiconductor laser tabletting prosthetic device and its working method and application |
| CN107089400A (en) * | 2017-06-14 | 2017-08-25 | 湖南粤港光电科技有限公司 | A kind of mould bar and the modularization housing with decoration element |
| CN109872956A (en) * | 2017-12-05 | 2019-06-11 | 山东华光光电子股份有限公司 | A kind of the rapid material-feeding device and its charging method of semiconductor laser tube socket |
| CN109872956B (en) * | 2017-12-05 | 2020-11-27 | 山东华光光电子股份有限公司 | Rapid feeding device and method for tube seat for semiconductor laser |
| CN110676686A (en) * | 2018-07-02 | 2020-01-10 | 潍坊华光光电子有限公司 | Die bonding clamp and die bonding method for photoelectric detector of semiconductor laser |
| CN110676687A (en) * | 2018-07-02 | 2020-01-10 | 潍坊华光光电子有限公司 | Cap mounting device and method for welding semiconductor laser tube cap |
| CN110943365A (en) * | 2018-09-25 | 2020-03-31 | 潍坊华光光电子有限公司 | Device and method for quickly fixing tube seat of semiconductor laser |
| CN112713497A (en) * | 2019-10-25 | 2021-04-27 | 潍坊华光光电子有限公司 | Die strip fixing carrier for semiconductor laser |
| CN112713497B (en) * | 2019-10-25 | 2022-06-14 | 潍坊华光光电子有限公司 | Die strip fixing carrier for semiconductor laser |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Tianchen Avenue high tech Zone of Ji'nan City, Shandong Province, No. 1835 250101 Patentee after: SHANDONG HUAGUANG OPTOELECTRONICS CO., LTD. Address before: Tianchen Avenue high tech Zone of Ji'nan City, Shandong Province, No. 1835 250101 Patentee before: Shandong Huaguang Photoelectronic Co., Ltd. |