CN112713497A

CN112713497A - Die strip fixing carrier for semiconductor laser

Info

Publication number: CN112713497A
Application number: CN201911020978.3A
Authority: CN
Inventors: 牟佳佳; 赵克宁; 刘琦; 梁盼
Original assignee: Weifang Huaguang Photoelectronics Co ltd
Current assignee: Weifang Huaguang Photoelectronics Co ltd
Priority date: 2019-10-25
Filing date: 2019-10-25
Publication date: 2021-04-27
Anticipated expiration: 2039-10-25
Also published as: CN112713497B

Abstract

The invention discloses a die strip fixing carrier for a semiconductor laser, and relates to the technical field of laser manufacturing and packaging. The carrier comprises a carrier body, wherein a plurality of mould strip grooves used for containing mould strips are arranged on the carrier body in parallel, the carrier body is penetrated through along the up-down direction, and the left end and the right end of each mould strip groove are respectively provided with a positioning mechanism. The positioning mechanism comprises ball plungers arranged on the front side walls of the left end and the right end of the die strip groove, and positioning holes matched with the ball plungers are respectively arranged at the left end and the right end of the die strip. A screw hole for installing bulb plunger need run through along the fore-and-aft direction carrier body, set up on the last side of carrier body and be used for the top tightly bulb plunger's first holding screw. The carrier overcomes the defect of the prior handheld fixation, thereby not only reducing the pollution rate of products, but also greatly improving the working efficiency on the premise of ensuring the process requirements.

Description

Die strip fixing carrier for semiconductor laser

Technical Field

The invention relates to the technical field of laser manufacturing and packaging, in particular to a die strip fixing carrier for a semiconductor laser.

Background

Semiconductor lasers have been known for decades and are used in a wide variety of applications. The semiconductor laser has small appearance volume and light weight in the same field, and has various advantages that the semiconductor laser is widely applied to various aspects such as industry, military, medical treatment, education and the like. The technical production field of semiconductor lasers is becoming the focus of the market and the research in various countries.

In recent years, the technology of semiconductor lasers has been rapidly developed, and with the rapid development of the epitaxial growth technology of semiconductor materials, the waveguide structure optimization technology of semiconductor lasers and the cavity surface passivation technology, the performance of semiconductor lasers is greatly improved, and the achievable optical power density is higher and higher. With the wide application range of semiconductor lasers, the requirements on the technical field of production of semiconductor lasers are higher.

In the production of semiconductor lasers, a die bonding operation is required, in which a COS chip is fixed to a specific region (stem tongue) of a stem. The conventional operation is to mount the stem on the die bar first, then hold the die bar by hand, and place the COS chip on the stem tongue of the stem with tweezers for fixation. The method mainly has the following disadvantages:

first, because the mould strip is narrow strip, is difficult to hold at the in-process of in-service use, and the hand touches the tube socket easily, can cause the pollution of different degrees to the product.

Secondly, because the mould strip is narrow strip, can't stabilize and place, at the in-process of in-service use, rely on the manual work to hold fixed position completely, take place position removal like this easily, it is poor finally to paste the COS chip uniformity on the tube socket, and the percent of pass of product is low.

Thirdly, because the mould strip is in a narrow strip shape, the hand will be sore quickly when holding, the holding position and posture need to be adjusted, and the production efficiency is reduced.

Fourthly, the pipe tongue of the pipe seat is suspended, so that the pipe seat is easily damaged once excessive force is applied during mounting.

Disclosure of Invention

In order to solve the problems, the invention provides a die strip fixing carrier for a semiconductor laser, which overcomes the working defect of the prior handheld fixing by using the carrier, thereby not only reducing the pollution rate of products, but also greatly improving the working efficiency on the premise of ensuring the process requirements.

The technical scheme adopted by the invention for solving the technical problems is as follows:

the utility model provides a carrier is fixed with mould strip, includes the carrier body, the carrier body on the parallel arrangement have many mould strip grooves that are used for holding the mould strip, run through along upper and lower direction the carrier body, the left and right both ends in mould strip groove are provided with positioning mechanism respectively.

Furthermore, the positioning mechanism comprises ball plungers arranged on the front side walls of the left end and the right end of the die strip groove, and positioning holes matched with the ball plungers are respectively arranged at the left end and the right end of the die strip.

Furthermore, a threaded hole for installing the ball plunger needs to penetrate through the carrier body along the front-back direction, and a first set screw for tightly pushing the ball plunger is arranged on the upper side face of the carrier body.

Furthermore, the left end and the right end of the carrier body are respectively provided with a second set screw which tightly pushes the ball plunger from the outer end.

Furthermore, the positioning mechanism comprises supporting plates which are arranged at the left end and the right end of the die strip groove and used for supporting the die strips.

Furthermore, a groove is formed in the upper side face of the front side wall of the die strip groove, and when the die strip is installed on the carrier, the lower side face of the tube tongue of the tube seat is just attached to the groove.

Furthermore, round holes are formed between the adjacent die strip grooves on the carrier body, and the round holes and the grooves are arranged at intervals.

Further, the groove penetrates through the carrier body along the front-back direction.

Furthermore, a notch for avoiding the pin is arranged on the rear side wall of the die strip groove.

Further, the left end and the right end of the lower side surface of the carrier body are respectively provided with a protruding part, and the ball plunger is arranged on the protruding part.

The invention has the beneficial effects that:

1. the mould strips provided with the pipe seats are arranged on the carriers, and a plurality of mould strips can be simultaneously arranged on one carrier, so that during installation, workers do not need to hold the mould strips all the time, the labor intensity of the workers is reduced, and the work efficiency is improved.

2. In the process of actual use, the hands do not touch the tube seats accidentally, so that pollution is not easy to cause, and the qualification rate of products is improved.

3. One side through the die strip groove sets up the recess to bear the pipe tongue of tube socket on the die strip, in the time of can effectively avoiding operating like this, the too big damage that causes the tube socket of application of force.

4. The notch is arranged on the other side of the die strip groove, so that the pin on the tube seat is avoided, and the tube seat is prevented from being damaged due to mutual extrusion between the pin of the tube seat and the carrier in the process of installing the die strip.

Drawings

FIG. 1 is a perspective view of a vehicle in one direction;

FIG. 2 is an enlarged schematic view of portion A of FIG. 1;

FIG. 3 is a perspective view of the carrier in another direction;

FIG. 4 is an enlarged schematic view of portion B of FIG. 3;

FIG. 5 is a top view of the carrier;

FIG. 6 is a cross-sectional view A-A of FIG. 5;

FIG. 7 is a cross-sectional view taken along line B-B of FIG. 5;

FIG. 8 is an enlarged view of the portion C of FIG. 5;

FIG. 9 is a perspective view of the socket;

FIG. 10 is a front view of the carrier;

FIG. 11 is a schematic perspective view of a mold strip;

in the figure: 1-carrier body, 11-mould strip groove, 12-groove, 13-notch, 14-round hole, 15-lug boss, 2-ball plunger, 3-first set screw, 4-second set screw, 5-mould strip, 51-positioning hole, 6-tube seat, 61-tube tongue and 62-tube pin.

Detailed Description

Example one

For convenience of description, a coordinate system is now defined as shown in fig. 1.

As shown in fig. 1 and 5, a mold strip fixing carrier for a semiconductor laser includes a carrier body 1, a plurality of mold strip grooves 11 for accommodating mold strips 5 are arranged on the carrier body 1 along the front-back direction, the plurality of mold strip grooves 11 are arranged in parallel, and penetrate through the carrier body 1 along the up-down direction.

As a specific implementation manner, the carrier body 1 in this embodiment is provided with five molding grooves 11 for accommodating the molding 5.

And the left end and the right end of the die strip groove 11 are respectively provided with a positioning mechanism for fixing the die strip 5 in the vertical direction.

As a specific embodiment, as shown in fig. 5 and 7, threaded holes are respectively formed in front side walls of left and right ends of the molding groove 11, a ball plunger 2 is disposed in the threaded holes, and a head portion of the ball plunger 2 protrudes from the front side wall and extends into the molding groove 11. The ball plunger 2 is fixedly connected with the carrier body 1 through threads. As shown in fig. 11, the left and right ends of the mold strip 5 are respectively provided with positioning holes 51 for matching with the ball plunger 2. As shown in fig. 7, when the mold strip 5 is snapped into the mold strip slot 11, the head of the ball plunger 2 is inserted into the positioning hole 51, so as to fix the mold strip 5.

Further, because the left end and the right end of each molding groove 11 are provided with the ball plunger 2, in order to facilitate the installation of the ball plunger 2, the threaded hole for installing the ball plunger 2 needs to penetrate through the carrier body 1 along the front-back direction. Thus, when the ball plunger 2 is mounted, it is only necessary to mount one by one from the front to the rear or from the rear to the front, and a tool for tightening the ball plunger 2 can be inserted into the threaded hole from the other side.

Although the installation of the ball plunger 2 is facilitated in this way, due to the threaded through hole, a pretightening force does not exist between the ball plunger 2 and the carrier body 1, and when the mold strip 5 is repeatedly installed and disassembled, the ball plunger 2 is easy to move in the axial direction, so that the mold strip 5 cannot be clamped tightly, and the position of the ball plunger 2 needs to be readjusted. Especially, when the position of the middle ball plunger 2 moves, the position of the ball plunger 2 can be adjusted only after all the ball plungers 2 on one side of the ball plunger 2 need to be removed, which is very inconvenient in application.

For this purpose, as shown in fig. 5, a first set screw 3 for pressing against the ball plunger 2 is provided on the upper side surface of the carrier body 1.

Further, as shown in fig. 4 and 6, the left and right ends of the carrier body 1 are respectively provided with a second set screw 4 for tightly pressing the ball plunger 2 from the outer end.

Further, as shown in fig. 9, the socket 6 includes a tongue 61 and a pin 62 respectively disposed on the front and rear sides of the socket 6. The pipe tongue 61 is a specific position for mounting the COS chip. As can be seen from fig. 9, the tube tongue 61 protrudes outside the tube seat 6 in a cantilever manner, and the cross section of the tube tongue 61 is smaller. When attaching the COS chip, an operator is required to attach the COS chip to the stem tongue 61 with tweezers. In the mounting process, it is difficult to ensure that the force applied by the operator is consistent, and once the force is too large, the weak pipe tongue 61 is easily damaged.

For this purpose, as shown in fig. 2 and 5, the upper side of the front side wall of the matrix groove 11 is provided with a plurality of grooves 12 in the left-right direction for holding the tongues 61 of the socket 6. The number of the grooves 12 is the same as that of the mounting holes of the tube seats 6 on the mould strip 5, and the positions of the grooves are in one-to-one correspondence. When the mould strip 5 is mounted on the carrier, the lower side of the pipe tongue 61 of the pipe seat 6 is just jointed with the groove 12.

Preferably, the groove 12 penetrates the carrier body 1 in the front-rear direction.

Further, in order to avoid the pin 62 from bending due to the squeezing action between the pin 62 and the carrier body 1 during the process of installing the die strip 5, as shown in fig. 5 and 8, a notch 13 for avoiding the pin 62 is provided on the rear side wall of the die strip groove 11.

Preferably, the notch 13 is semicircular and penetrates through the carrier body 1 along the vertical direction.

Furthermore, in order to reduce the weight of the carrier, on one hand, the carrier is convenient to take and place, and on the other hand, the production cost is reduced. As shown in fig. 5, circular holes 14 are provided between adjacent die strip grooves 11 on the carrier body 1, and the circular holes 14 and the grooves 12 are arranged at intervals.

Further, as shown in fig. 3, downwardly extending protrusions 15 are respectively disposed on the left and right ends of the carrier body 1 on the lower side of the carrier body 1, and the ball plunger 2 is disposed on the protrusions 15.

The advantage of this design is that the removal of the mould strip 5 is facilitated. As shown in fig. 10, the left and right ends of the lower side of the mold strip 5 are located in the mold strip groove 11, and the middle of the lower side of the mold strip 5 protrudes from the carrier body 1 and extends below the carrier body 1. Thus, when the carrier is placed on a table, the protrusions 15 contact the table to support the table, but the mold strips 5 are not in contact with the table. When the mould strip 5 needs to be disassembled, only the middle part of the mould strip 5 needs to be pressed upwards.

Preferably, the cross section of the convex portion 15 is trapezoidal.

Example two

The left end and the right end of the mould strip groove 11 are respectively provided with a supporting plate for supporting the mould strip 5, and the rest structures are the same as the first embodiment.

When installing mould strip 5, place mould strip 5 in mould strip groove 11, then push down mould strip 5, until the downside of mould strip 5 compress tightly the layer board on can.

Claims

1. The utility model provides a semiconductor laser is with fixed carrier of mould strip which characterized in that: the carrier comprises a carrier body, wherein a plurality of mould strip grooves used for containing mould strips are arranged on the carrier body in parallel, the carrier body is penetrated through along the vertical direction, and the left end and the right end of each mould strip groove are respectively provided with a positioning mechanism.

2. The die strip fixing carrier for semiconductor laser device as claimed in claim 1, wherein: the positioning mechanism comprises ball plungers arranged on the front side walls of the left end and the right end of the die strip groove, and positioning holes matched with the ball plungers are respectively arranged at the left end and the right end of the die strip.

3. The die strip fixing carrier for semiconductor laser device as claimed in claim 2, wherein: a screw hole for installing bulb plunger need run through along the fore-and-aft direction carrier body, set up on the last side of carrier body and be used for the top tightly bulb plunger's first holding screw.

4. The die bar fixing carrier for semiconductor laser according to claim 2 or 3, wherein: and the left end and the right end of the carrier body are respectively provided with a second set screw which tightly pushes the ball plunger from the outer end.

5. The die strip fixing carrier for semiconductor laser device as claimed in claim 1, wherein: the positioning mechanism comprises supporting plates which are arranged at the left end and the right end of the die strip groove and used for supporting the die strips.

6. The die strip fixing carrier for semiconductor laser device as claimed in claim 1, wherein: the upper side of the front side wall of the mould strip groove is provided with a groove, and when the mould strip is installed on the carrier, the lower side surface of the pipe tongue of the pipe seat is just attached to the groove.

7. The die strip fixing carrier for semiconductor laser as claimed in claim 6, wherein: the carrier body is provided with round holes between adjacent die strip grooves, and the round holes and the grooves are arranged at intervals.

8. The die strip fixing carrier for semiconductor laser as claimed in claim 6, wherein: the groove penetrates through the carrier body along the front-back direction.

9. The die strip fixing carrier for semiconductor laser device as claimed in claim 1, wherein: and a notch for avoiding the pin is arranged on the rear side wall of the die strip groove.

10. The die strip fixing carrier for semiconductor laser device as claimed in claim 1, wherein: the left and right ends of the lower side surface of the carrier body are respectively provided with a protruding part, and the ball plunger is arranged on the protruding part.