CN203288584U - 半导体装置 - Google Patents
半导体装置 Download PDFInfo
- Publication number
- CN203288584U CN203288584U CN2013202186858U CN201320218685U CN203288584U CN 203288584 U CN203288584 U CN 203288584U CN 2013202186858 U CN2013202186858 U CN 2013202186858U CN 201320218685 U CN201320218685 U CN 201320218685U CN 203288584 U CN203288584 U CN 203288584U
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- semiconductor element
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- semiconductor
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- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/1058—Bump or bump-like electrical connections, e.g. balls, pillars, posts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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US201261701419P | 2012-09-14 | 2012-09-14 | |
US61/701,419 | 2012-09-14 | ||
US13/832,781 | 2013-03-15 | ||
US13/832,781 US9443797B2 (en) | 2012-09-14 | 2013-03-15 | Semiconductor device having wire studs as vertical interconnect in FO-WLP |
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CN203288584U true CN203288584U (zh) | 2013-11-13 |
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CN2013202186858U Expired - Lifetime CN203288584U (zh) | 2012-09-14 | 2013-04-26 | 半导体装置 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104851841A (zh) * | 2014-02-13 | 2015-08-19 | 台湾积体电路制造股份有限公司 | 包括嵌入式表面贴装器件的半导体封装件及其形成方法 |
CN108604571A (zh) * | 2015-11-20 | 2018-09-28 | 德卡科技公司 | 全模制周边堆叠封装设备 |
CN117038532A (zh) * | 2023-10-09 | 2023-11-10 | 成都汉芯国科集成技术有限公司 | 一种基于可塑性基板的芯片3d堆叠的封装系统及其封装方法 |
-
2013
- 2013-04-26 CN CN2013202186858U patent/CN203288584U/zh not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104851841A (zh) * | 2014-02-13 | 2015-08-19 | 台湾积体电路制造股份有限公司 | 包括嵌入式表面贴装器件的半导体封装件及其形成方法 |
CN108604571A (zh) * | 2015-11-20 | 2018-09-28 | 德卡科技公司 | 全模制周边堆叠封装设备 |
CN108604571B (zh) * | 2015-11-20 | 2023-02-17 | 美国德卡科技公司 | 全模制周边堆叠封装设备 |
CN117038532A (zh) * | 2023-10-09 | 2023-11-10 | 成都汉芯国科集成技术有限公司 | 一种基于可塑性基板的芯片3d堆叠的封装系统及其封装方法 |
CN117038532B (zh) * | 2023-10-09 | 2024-01-16 | 成都汉芯国科集成技术有限公司 | 一种基于可塑性基板的芯片3d堆叠的封装系统及其封装方法 |
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