CN202940234U - Package structure of contact intelligent card - Google Patents
Package structure of contact intelligent card Download PDFInfo
- Publication number
- CN202940234U CN202940234U CN 201220593832 CN201220593832U CN202940234U CN 202940234 U CN202940234 U CN 202940234U CN 201220593832 CN201220593832 CN 201220593832 CN 201220593832 U CN201220593832 U CN 201220593832U CN 202940234 U CN202940234 U CN 202940234U
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- Prior art keywords
- carrier band
- chip
- contact
- intelligent card
- package structure
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Abstract
The utility model discloses a package structure of a contact intelligent card. The package structure comprises a chip and a carrier tape, wherein the carrier tape comprises a line surface and a contact surface, the chip is arranged on the line surface of the carrier tape, and the chip matches with the carrier tape; the package structure further comprises a protection film which is arranged on the contact surface. With such a technical scheme, the package structure provided by the utility model has the following beneficial effects: reliability of a product is effectively improved; requirements on production control of the carrier tape are less limited, the form of the carrier tape is more flexible, and production cost is effectively reduced.
Description
Technical field
The utility model relates to a kind of encapsulating structure, is specifically related to a kind of encapsulating structure of contact intelligent card.
Background technology
In prior art, the carrier band of contact intelligent card is packaged with two kinds of methods.A kind of method is to adopt lead key closing process, and this method has occupied the main flow in market at present, and along with present gold cost and protection are risen with UV glue (UV glue) cost, packaging cost also climbs up and up.Another kind method is referred to as FCOS, and the method is by flip chip technology (fct), i.e. face-down bonding technique adheres to the contact type smart card chip particle back side of carrier band by conducting resinl or thermocompression bonding or hot sonic soldering.The shortcoming of FCOS is that the equipment investment of Flip Chip Bond Technique is too high, and the coated metal of carrier band is had specific (special) requirements, guarantee carrier band back side circuit coated metal must with wafer convex point on the solder material welding, so its whole production cost is very high.
The utility model content
For solving the problems of the technologies described above, the purpose of this utility model is to provide a kind of encapsulating structure of contact intelligent card, effectively improves the reliability of product, requires looser to the production control of carrier band simultaneously, form to carrier band is more flexible, and production cost effectively reduces simultaneously.
For achieving the above object, the technical solution of the utility model is as follows: a kind of encapsulating structure of contact intelligent card, comprise chip, carrier band, and described carrier band comprises circuit surface and contact-making surface, described chip is arranged on the circuit surface of described carrier band, and described chip and described carrier band are complementary; Also comprise a diaphragm, described diaphragm is arranged on described contact-making surface.
Preferably, described carrier band is the carrier band that FR4, BT or modified PET material are made.
Preferably, the draw bail of described chip and described carrier band is W i re Bond routing draw bail, SMT paster technique draw bail or FC technique draw bail.
Adopt the beneficial effect of the technical program to be: effectively improve the reliability of product, looser to the production control requirement of carrier band simultaneously, more flexible to the form of carrier band, production cost effectively reduces simultaneously.
Description of drawings
In order to be illustrated more clearly in the technical scheme in the utility model embodiment technology, the below will do to introduce simply to the accompanying drawing of required use in the embodiment technical description, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is structural representation of the present utility model.
Fig. 2 is stereogram of the present utility model.
Numeral and the represented corresponding component title of letter in figure:
1. chip 2. carrier band 3. diaphragm 4. circuit surface 5. contact-making surfaces.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that obtains under the creative work prerequisite, all belong to the scope of the utility model protection.
As depicted in figs. 1 and 2, the encapsulating structure of a kind of contact intelligent card of the present utility model comprises chip 1, carrier band 2, and carrier band 2 comprises circuit surface 4 and contact-making surface 5, and chip 1 is arranged on the circuit surface 4 of carrier band 2, and chip 1 is complementary with carrier band 2; Also comprise a diaphragm 3, diaphragm 3 is arranged on the contact-making surface 5 of chip 1 and carrier band 2.By being provided with layer protecting film 3 at carrier band 2, this diaphragm 3 is not only protected the gold layer of contact-making surface 5, and carrier band 2 is connected rolling.
Carrier band 2 is the carrier band that FR4, BT or modified PET material are made.Carrier band 2 is for being provided with the carrier band of Double-side line.Chip 1 is Wi re Bond routing draw bail, SMT paster technique draw bail or FC technique draw bail with the draw bail of carrier band 2.The method for packing of a kind of contact intelligent card of the present utility model comprises the following steps:
(1) adopt WLCSP that the chip die of contact intelligent card is processed, and chip 1 grain thickness of the contact intelligent card that obtains after processing is no more than 0.40mm;
(2) carrier band 2 is provided with contact point, its position and size, big or small corresponding with the size of chip 1 and position and tin ball thereof respectively;
(3) adopt traditional SMT paster technique or FC technique that chip 1 is attached on carrier band 2, then solidify by Reflow Soldering, perhaps directly adopt Wi re Bond technique.
Adopt the beneficial effect of the technical program to be: effectively improve the reliability of product, looser to the production control requirement of carrier band simultaneously, more flexible to the form of carrier band, production cost effectively reduces simultaneously.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the utility model.Multiple modification to these embodiment will be apparent concerning those skilled in the art, and General Principle as defined herein can be in the situation that do not break away from spirit or scope of the present utility model, realization in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (3)
1. the encapsulating structure of a contact intelligent card, is characterized in that, comprises chip, carrier band, and described carrier band comprises circuit surface and contact-making surface, and described chip is arranged on the circuit surface of described carrier band, and described chip and described carrier band are complementary; Also comprise a diaphragm, described diaphragm is arranged on described contact-making surface.
2. the encapsulating structure of a kind of contact intelligent card according to claim 1, is characterized in that, described carrier band is the carrier band that FR4, BT or modified PET material are made.
3. the encapsulating structure of a kind of contact intelligent card according to claim 1, is characterized in that, the draw bail of described chip and described carrier band is Wi re Bond routing draw bail, SMT paster technique draw bail or FC technique draw bail.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220593832 CN202940234U (en) | 2012-11-13 | 2012-11-13 | Package structure of contact intelligent card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220593832 CN202940234U (en) | 2012-11-13 | 2012-11-13 | Package structure of contact intelligent card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202940234U true CN202940234U (en) | 2013-05-15 |
Family
ID=48324458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220593832 Expired - Fee Related CN202940234U (en) | 2012-11-13 | 2012-11-13 | Package structure of contact intelligent card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202940234U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107275304A (en) * | 2017-06-28 | 2017-10-20 | 山东齐芯微系统科技股份有限公司 | FCOS tape wiring bonding technologies |
-
2012
- 2012-11-13 CN CN 201220593832 patent/CN202940234U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107275304A (en) * | 2017-06-28 | 2017-10-20 | 山东齐芯微系统科技股份有限公司 | FCOS tape wiring bonding technologies |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130515 Termination date: 20131113 |