CN202721184U - Low-power direct insertion type LED - Google Patents
Low-power direct insertion type LED Download PDFInfo
- Publication number
- CN202721184U CN202721184U CN2012202868852U CN201220286885U CN202721184U CN 202721184 U CN202721184 U CN 202721184U CN 2012202868852 U CN2012202868852 U CN 2012202868852U CN 201220286885 U CN201220286885 U CN 201220286885U CN 202721184 U CN202721184 U CN 202721184U
- Authority
- CN
- China
- Prior art keywords
- direct insertion
- low
- insertion type
- type led
- power direct
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- Led Device Packages (AREA)
Abstract
The utility model discloses a low-power direct insertion type LED. The low-power direct insertion type LED comprises a metal support, an LED chip, an electrode gold wire, fluorescence glue, insulating primer and epoxy resin packaging colloid. According to the utility model, the LED chip is a large-size chip, the size of the LED chip is 20*20mil, advantages of good white light heat conduction and heat dissipation effects and good thermostability can be realized, the normal lighting current of the low-power direct insertion type LED is in the range of 100mA to 150mA, the lighting voltage of the low-power direct insertion type LED is in the range of 3.0V to 3.4V, the operating current of the low-power direct insertion type LED in the range of 20mA to 40mA, the operating voltage of the low-power direct insertion type LED in the range of 2.8V to 3.1V, in the working process, only an operating current of 40mA is actually needed to lighten the low-power direct insertion type LED, so that two ordinary small-size direct insertion type LEDs which are lightened with an current of 20mA can be replaced, when the low-power direct insertion type LED of the utility model is used in the process of white light finished product assembly, the temperature can be reduced, so that the low-power direct insertion type LED of the utility model has advantages of small light attenuation and long service life.
Description
Technical field
The utility model relates to the LED lighting technical field, relates in particular to the direct insertion LED of a kind of small-power.
Background technology
In the PN junction of some semi-conducting material, can discharge the form of unnecessary energy with light such as minority carrier and majority carrier compound tense, thereby electric energy is directly changed into luminous energy, this diode that utilizes the injection electroluminescence principle to make is called light-emitting diode, and is English referred to as LED.LED is based on the solid semiconductor light source of electroluminescence principle, have many advantages such as rich color, volume is small and exquisite, the life-span is long, so its range of application has a good application prospect in gradually expansion, simultaneously, its raising chip and package level technology also are subject to the energetically support of country.
At present, the general employing of single direct insertion LED on the market is of a size of the following led chip of 10*26mil, about it uses electric current as 20mA, voltage is between 3.0 ~ 3.4V, power is 0.06 ~ 0.068W, and this direct insertion LED white-light emitting brightness is excessively low, and chip size is little, not anti-high temperature, waste time and energy in the time of will being assembled by many (thousands of up to a hundred of as many as) when its white light finished product is used simultaneously, temperature is high, and heat radiation not, cause the light decay of direct insertion LED large, useful life is short.
The utility model content
The purpose of this utility model be to provide for the deficiencies in the prior art a kind of high temperature resistant, light decay is little, the direct insertion LED of the small-power of long service life.
The purpose of this utility model realizes by following technical measures: the direct insertion LED of a kind of small-power, comprise metallic support, led chip, the electrode gold thread, fluorescent glue, insulation primer and epoxy encapsulation colloid, described led chip is positioned at the bowl-type groove at described metallic support top, described led chip is connected by described electrode gold thread with described metallic support, described fluorescent glue is covered in described led chip top, described insulation primer is arranged at the bottom of described led chip, described metallic support, described led chip and described electrode gold thread encapsulate by described epoxy encapsulation colloid, described led chip is of a size of 20*20mil, its normal point light current is 100 ~ 150mA, lighting voltage is 3.0 ~ 3.4V, it uses electric current is 20 ~ 40mA, and use voltage is 2.8 ~ 3.1V.
Better, in technique scheme, described metallic support is the large scale support that is complementary with described led chip.
Better, in technique scheme, described fluorescent glue for take silica gel as carrier with the colloid of fluorescent material mixing gained.
The utility model beneficial effect is: led chip of the present utility model is set to large size chip, it is of a size of 20*20mil, the white light heat conduction and heat radiation is effective, can be high temperature resistant, its normal point light current is 100 ~ 150mA simultaneously, lighting voltage is 3.0 ~ 3.4V, and it uses electric current is 20 ~ 40mA, and use voltage is 2.8 ~ 3.1V, during work, the actual use electric current of logical upper 40mA that only needs is lighted the utility model, can replace two common undersized direct insertion LED that light with the 20mA electric current, therefore, when using the utility model to carry out the assembling of white light finished product, can reduce temperature, thereby make light decay of the present utility model little, the life-span is long.
Description of drawings
Fig. 1 is structural representation of the present utility model.
In Fig. 1, include:
1---metallic support, 2---led chip, 3---electrode gold thread, 4---fluorescent glue, 5---insulation primer, 6---epoxy encapsulation colloid.
Embodiment
In order to set forth thought of the present utility model and purpose, below in conjunction with the drawings and specific embodiments the utility model is further described.
Please refer to Fig. 1, the direct insertion LED of a kind of small-power of the present utility model, it comprises metallic support 1, led chip 2, electrode gold thread 3, fluorescent glue 4, insulation primer 5 and epoxy encapsulation colloid 6.Concrete, led chip 2 is positioned at the bowl-type groove at metallic support 1 top, led chip 2 is connected by electrode gold thread 3 with metallic support 1, fluorescent glue 4 is covered in led chip 2 tops, wherein, fluorescent glue 4 for take silica gel as carrier with the colloid of fluorescent material mixing gained, in addition, insulation primer 5 is arranged at the bottom of led chip 2, and metallic support 1, led chip 2 and electrode gold thread 3 are by 6 encapsulation of epoxy encapsulation colloid.
As improvement of the present utility model, led chip 2 is of a size of 20*20mil, and it uses electric current is 20 ~ 40mA, and test voltage is 2.8 ~ 3.1V, and its normal point light current is 100 ~ 150mA, and test voltage is 3.0 ~ 3.4V.
As further improvement of the utility model, metallic support 1 is set to the large scale support that is complementary with led chip 2, is convenient to the large scale led chip is fixed in wherein.
In sum, led chip of the present utility model is large size chip, and the white light heat conduction and heat radiation is effective, can be high temperature resistant, during work, the actual use electric current of logical upper 40mA that only needs is lighted the utility model, can replace two common undersized direct insertion LED that light with the 20mA electric current, therefore, when using the utility model to carry out the assembling of white light finished product, can reduce temperature, thereby make light decay of the present utility model little, the life-span is long.
Should be noted that at last; above embodiment is only in order to illustrate the technical solution of the utility model; but not to the restriction of the utility model protection range; although with reference to preferred embodiment the utility model has been done to explain; those of ordinary skill in the art is to be understood that; can make amendment or be equal to replacement the technical solution of the utility model, and not break away from essence and the scope of technical solutions of the utility model.
Claims (3)
1. direct insertion LED of small-power, comprise metallic support (1), led chip (2), electrode gold thread (3), fluorescent glue (4), insulation primer (5) and epoxy encapsulation colloid (6), described led chip (2) is positioned at the bowl-type groove at described metallic support (1) top, described led chip (2) is connected by described electrode gold thread (3) with described metallic support (1), described fluorescent glue (4) is covered in described led chip (2) top, described insulation primer (5) is arranged at the bottom of described led chip (2), described metallic support (1), described led chip (2) and described electrode gold thread (3) encapsulate by described epoxy encapsulation colloid (6), it is characterized in that: described led chip (2) is of a size of 20*20mil, its normal point light current is 100 ~ 150mA, lighting voltage is 3.0 ~ 3.4V, it uses electric current is 20 ~ 40mA, and use voltage is 2.8 ~ 3.1V.
2. the direct insertion LED of a kind of small-power according to claim 1 is characterized in that: the large scale support of described metallic support (1) for being complementary with described led chip (2).
3. the direct insertion LED of a kind of small-power according to claim 1 is characterized in that: described fluorescent glue (4) for take silica gel as carrier with the colloid of fluorescent material mixing gained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202868852U CN202721184U (en) | 2012-06-18 | 2012-06-18 | Low-power direct insertion type LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202868852U CN202721184U (en) | 2012-06-18 | 2012-06-18 | Low-power direct insertion type LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202721184U true CN202721184U (en) | 2013-02-06 |
Family
ID=47622992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012202868852U Expired - Fee Related CN202721184U (en) | 2012-06-18 | 2012-06-18 | Low-power direct insertion type LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202721184U (en) |
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2012
- 2012-06-18 CN CN2012202868852U patent/CN202721184U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130206 Termination date: 20130618 |