CN102709446A - Small-power direct-plugging light emitting diode (LED) - Google Patents
Small-power direct-plugging light emitting diode (LED) Download PDFInfo
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- CN102709446A CN102709446A CN2012102012837A CN201210201283A CN102709446A CN 102709446 A CN102709446 A CN 102709446A CN 2012102012837 A CN2012102012837 A CN 2012102012837A CN 201210201283 A CN201210201283 A CN 201210201283A CN 102709446 A CN102709446 A CN 102709446A
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Abstract
The invention discloses a small-power direct-plugging light emitting diode (LED), which comprises a metal support, an LED chip, an electrode gold wire, fluorescent glue, insulation bottom glue and epoxy resin encapsulation colloid, wherein the LED chip is a large-sized chip, the size of the LED chip is 20*20mil, the white light has good heat conduction and heat radiation effect, high temperature can be resisted, normal lightening current of the white light is 100 to 150mA, the lightening voltage is 3.0 to 3.4V, the application current is 20 to 40mA, the application voltage is 2.8 to 3.1V, when the LED is in work, the LED can be lightened only through the application current of 40mA, and the LED can substitute two direct-plugging LEDs which are lightened by utilizing the current of 20mA. When the LED is used for assembling a white light finished product, the temperature can be reduced, the light attenuation is small, and the service life is long.
Description
Technical field
The present invention relates to the LED lighting technical field, relate in particular to the direct insertion LED of a kind of small-power.
Background technology
In the PN junction of some semi-conducting material; Can discharge the form of unnecessary energy such as minority carrier and majority carrier compound tense with light; Thereby be directly changed into luminous energy to electric energy; This diode of injection electroluminescence principles that utilizes is called light-emitting diode, and English abbreviates LED as.LED is based on the solid semiconductor light source of electroluminescence principle; Have many advantages such as rich color, advantages of small volume, life-span be long, so its range of application has a good application prospect in gradually expansion; Simultaneously, its raising chip and package level technology also receive the support energetically of country.
At present, the general led chip that is of a size of below the 10*26mil that adopts of single direct insertion LED on the market, about it used electric current as 20mA, voltage was between 3.0 ~ 3.4V; Power is 0.06 ~ 0.068W, and this direct insertion LED white-light emitting brightness is low excessively, and chip size is little; Not anti-high temperature is wasted time and energy in the time of will being assembled by many (thousands of up to a hundred of as many as) when its white light finished product is used simultaneously, and temperature is high; Heat radiation is not enough, causes the light decay of direct insertion LED big, and useful life is short.
Summary of the invention
The objective of the invention is to provide to the deficiency of prior art a kind of high temperature resistant, light decay is little, the direct insertion LED of the small-power of long service life.
The object of the invention is realized through following technical measures: the direct insertion LED of a kind of small-power; Comprise metallic support, led chip, electrode gold thread, fluorescent glue, insulation primer and epoxy encapsulation colloid, said led chip is positioned at the bowl-type groove at said metallic support top, and said led chip is connected through said electrode gold thread with said metallic support; Said fluorescent glue is covered in said led chip top; Said insulation primer is arranged at the bottom of said led chip, and said metallic support, said led chip and said electrode gold thread encapsulate through said epoxy encapsulation colloid, and said led chip is of a size of 20*20mil; Its normal point light current is 100 ~ 150mA; Lighting voltage is 3.0 ~ 3.4V, and it uses electric current is 20 ~ 40mA, and working voltage is 2.8 ~ 3.1V.
Preferable, in technique scheme, said metallic support is the large scale support that is complementary with said led chip.
Preferable, in technique scheme, said fluorescent glue is for being carrier with silica gel and the colloid of fluorescent material mixing gained.
Beneficial effect of the present invention is: led chip of the present invention is set to large size chip, and it is of a size of 20*20mil, and the white light heat conduction and heat radiation is effective, can be high temperature resistant; Its normal point light current is 100 ~ 150mA simultaneously, and lighting voltage is 3.0 ~ 3.4V, and it uses electric current is 20 ~ 40mA; Working voltage is 2.8 ~ 3.1V, and during work, the actual use electric current of the logical 40mA of going up that only needs is lighted the present invention; Can replace two common undersized direct insertion LED that light with the 20mA electric current, therefore, when utilization the present invention carries out the assembling of white light finished product; Can reduce temperature, thereby make light decay of the present invention little, the life-span is long.
Description of drawings
Fig. 1 is a structural representation of the present invention.
In Fig. 1, include:
1---metallic support, 2---led chip, 3---electrode gold thread, 4---fluorescent glue, 5---insulation primer, 6---epoxy encapsulation colloid.
Embodiment
In order to set forth thought of the present invention and purpose, the present invention is further described below in conjunction with accompanying drawing and specific embodiment.
Please with reference to Fig. 1, the direct insertion LED of a kind of small-power of the present invention, it comprises metallic support 1, led chip 2, electrode gold thread 3, fluorescent glue 4, insulation primer 5 and epoxy encapsulation colloid 6.Concrete, led chip 2 is positioned at the bowl-type groove at metallic support 1 top, and led chip 2 is connected through electrode gold thread 3 with metallic support 1; Fluorescent glue 4 is covered in led chip 2 tops; Wherein, fluorescent glue 4 is for being carrier with silica gel and the colloid of fluorescent material mixing gained, in addition; Insulation primer 5 is arranged at the bottom of led chip 2, and metallic support 1, led chip 2 and electrode gold thread 3 are through 6 encapsulation of epoxy encapsulation colloid.
As improvement of the present invention, led chip 2 is of a size of 20*20mil, and it uses electric current is 20 ~ 40mA, and test voltage is 2.8 ~ 3.1V, and its normal point light current is 100 ~ 150mA, and test voltage is 3.0 ~ 3.4V.
As further improvement of the present invention, metallic support 1 is set to the large scale support that is complementary with led chip 2, is convenient to the large scale led chip is fixed in wherein.
In sum, led chip of the present invention is a large size chip, and the white light heat conduction and heat radiation is effective; Can be high temperature resistant, during work, the actual use electric current of the logical 40mA of going up that only needs is lighted the present invention; Can replace two common undersized direct insertion LED that light with the 20mA electric current, therefore, when utilization the present invention carries out the assembling of white light finished product; Can reduce temperature, thereby make light decay of the present invention little, the life-span is long.
Should be noted that at last; Above embodiment is only in order to explain technical scheme of the present invention; But not to the restriction of protection range of the present invention, although with reference to preferred embodiment the present invention has been done explanation at length, those of ordinary skill in the art is to be understood that; Can make amendment or be equal to replacement technical scheme of the present invention, and not break away from the essence and the scope of technical scheme of the present invention.
Claims (3)
1. direct insertion LED of small-power; Comprise metallic support (1), led chip (2), electrode gold thread (3), fluorescent glue (4), insulation primer (5) and epoxy encapsulation colloid (6); Said led chip (2) is positioned at the bowl-type groove at said metallic support (1) top; Said led chip (2) is connected through said electrode gold thread (3) with said metallic support (1), and said fluorescent glue (4) is covered in said led chip (2) top, and said insulation primer (5) is arranged at the bottom of said led chip (2); Said metallic support (1), said led chip (2) and said electrode gold thread (3) encapsulate through said epoxy encapsulation colloid (6); It is characterized in that: said led chip (2) is of a size of 20*20mil, and its normal point light current is 100 ~ 150mA, and lighting voltage is 3.0 ~ 3.4V; It uses electric current is 20 ~ 40mA, and working voltage is 2.8 ~ 3.1V.
2. the direct insertion LED of a kind of small-power according to claim 1 is characterized in that: said metallic support (1) is the large scale support that is complementary with said led chip (2).
3. the direct insertion LED of a kind of small-power according to claim 1 is characterized in that: said fluorescent glue (4) is for being carrier with silica gel and the colloid of fluorescent material mixing gained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2012102012837A CN102709446A (en) | 2012-06-18 | 2012-06-18 | Small-power direct-plugging light emitting diode (LED) |
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CN2012102012837A CN102709446A (en) | 2012-06-18 | 2012-06-18 | Small-power direct-plugging light emitting diode (LED) |
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CN2012102012837A Pending CN102709446A (en) | 2012-06-18 | 2012-06-18 | Small-power direct-plugging light emitting diode (LED) |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105336833A (en) * | 2015-11-04 | 2016-02-17 | 深圳莱特光电股份有限公司 | Improved LED lamp support structure |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1617488A1 (en) * | 2004-07-12 | 2006-01-18 | Nan Ya Plastics Corporation | Light emitting diode with improved heat dissipation and its manufacturing method |
CN102439741A (en) * | 2009-11-06 | 2012-05-02 | 旭明光电股份有限公司 | Light emitting diode device |
-
2012
- 2012-06-18 CN CN2012102012837A patent/CN102709446A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1617488A1 (en) * | 2004-07-12 | 2006-01-18 | Nan Ya Plastics Corporation | Light emitting diode with improved heat dissipation and its manufacturing method |
CN102439741A (en) * | 2009-11-06 | 2012-05-02 | 旭明光电股份有限公司 | Light emitting diode device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105336833A (en) * | 2015-11-04 | 2016-02-17 | 深圳莱特光电股份有限公司 | Improved LED lamp support structure |
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Application publication date: 20121003 |