CN202454609U - Layered light-emitting diode (LED) packaging structure - Google Patents

Layered light-emitting diode (LED) packaging structure Download PDF

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Publication number
CN202454609U
CN202454609U CN2012200244854U CN201220024485U CN202454609U CN 202454609 U CN202454609 U CN 202454609U CN 2012200244854 U CN2012200244854 U CN 2012200244854U CN 201220024485 U CN201220024485 U CN 201220024485U CN 202454609 U CN202454609 U CN 202454609U
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CN
China
Prior art keywords
fluorescent material
layer
line
material glue
glue
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2012200244854U
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Chinese (zh)
Inventor
王国福
黄淋毅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FUZHOU RUISHENG ELECTRONICS CO LTD
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FUZHOU RUISHENG ELECTRONICS CO LTD
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Priority to CN2012200244854U priority Critical patent/CN202454609U/en
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Publication of CN202454609U publication Critical patent/CN202454609U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to the field of LED packaging and particularly provides a layered LED packaging structure. The structure comprises a cup, solid crystal glue, a blue light chip, a metal wire, a fluorescent powder glue layer and an outer sealing glue layer, wherein the solid crystal glue is dropped in the center of the cup, the blue light chip is fixed on the solid crystal glue, an electrode of the blue light chip is connected with the metal wire, and the outer layer of the blue light chip is coated with the fluorescent powder glue layer and the outer sealing glue layer sequentially. The layered LED packaging structure is characterized in that the fluorescent powder glue layer can be divided into three layers of fluorescent powder glue layers with different granularity from inside to outside. The layered LED packaging structure is high in lighting effect and uniform in emitting light.

Description

A kind of layer-stepping LED encapsulating structure
Technical field
The utility model belongs to the LED encapsulation field, relates in particular to a kind of layer-stepping LED encapsulating structure.
Background technology
The LED of main flow is encapsulated as blue-light LED chip adding yellow fluorescent powder and forms white light in the existing LED encapsulating structure; The white light LEDs that this mode encapsulates can hot spot and light efficiency occur because of the influence of yellow fluorescent powder granularity size; If granularity then light efficiency less than normal is on the low side, can't reach existing lighting requirement; If granularity then hot spot bigger than normal is very poor, be prone to champac circle phenomenon, the two situation all badly influences range of application and the practical effect of LED.
The utility model content
The technical problem that the utility model will solve is to provide a kind of high light efficiency and uniform a kind of layer-stepping LED encapsulating structure of light guide realized.
The utility model is achieved in that a kind of layer-stepping LED encapsulating structure; Comprise cup bowl, crystal-bonding adhesive, blue chip, metal wire, fluorescent material glue-line and outer adhesive layer; Said crystal-bonding adhesive point is in cup bowl central authorities, and blue chip is fixed on the crystal-bonding adhesive, and the electrode of blue chip connects metal wire; The skin of blue chip is coated fluorescent material glue-line and outer adhesive layer successively, it is characterized in that: said fluorescent material glue-line is served as reasons interior to the different fluorescent material glue-line of outer three layers of granularity.
Said three layers of fluorescent material glue-line granularity from the inside to the outside is followed successively by 20-28 micron, 13-18 micron and 3-8 micron.
The thickness of said three layers of fluorescent material glue-line is identical.
Said cup bowl inclined-plane is mirror surface structure.
A kind of layer-stepping LED of the utility model encapsulating structure has following advantage: adopt the mode that variable grain degree different layers distributes and hierarchical sequence is fixing; According to the reason that excite different-effect of blue light to variable grain degree fluorescent material; High light efficiency and light guide uniform white light LED have been realized to reach; Solved and be prone to the on the low side and hot spot difference of light efficiency in the prior art and be prone to champac circle phenomenon; The characteristics that are minute surface simultaneously through cup bowl inclined-plane, the light extraction efficiency of raising light source is to reach range of application and the practical effect that has improved LED greatly.
Description of drawings
Combine embodiment that the utility model is further described with reference to the accompanying drawings.
Fig. 1 is the overall structure sketch map of a kind of layer-stepping LED of the utility model encapsulating structure.
Embodiment
Come the utility model is carried out detailed explanation below in conjunction with specific embodiment.
See also shown in Figure 1; Be the described a kind of layer-stepping LED encapsulating structure of the utility model, comprise cup bowl 1, crystal-bonding adhesive 2, blue chip 3, metal wire 4, fluorescent material glue-line 5 and outer adhesive layer 6, said cup bowl 1 inclined-plane is mirror surface structure; 2 of crystal-bonding adhesives are central at the cup bowl; Blue chip 3 is fixed on the crystal-bonding adhesive 2, and the electrode of blue chip 3 connects metal wire 4, and the skin of blue chip 3 is coated three layers of fluorescent material glue-line 5 and outer adhesive layer 6 that granularity is different successively; Outer adhesive layer 6 adopts silica gel or epoxy glue; Play the purpose of protection fluorescent material glue-line, metal wire and cup bowl, the thickness that said three layers of fluorescent material glue-line are followed successively by ground floor fluorescent material glue-line 51, second layer fluorescent material glue- line 52 and 53, three layers of fluorescent material glue-line of the 3rd layer of fluorescent material glue-line from the inside to the outside is identical; Granularity is respectively 25 microns, 15 microns and 7 microns; The utility model is different to the stimulation effect of variable grain degree fluorescent material according to blue chip, and the fluorescent material light extraction efficiency that promptly granularity is big is high, the principle of the fluorescent material hot spot best results that granularity is little; On blue chip, distribute the respectively phosphor powder layer of variable grain degree reaches by granularity Changing Pattern from big to small and to improve the effect that hot spot improves the LED light extraction efficiency simultaneously.
A kind of layer-stepping LED of the utility model encapsulating structure; At first be in cup bowl central authorities the crystal-bonding adhesive point; Blue chip is fixed on the crystal-bonding adhesive, and the electrode of blue chip is connected with extraneous through metal wire, fills the fluorescent material glue-line of one deck by 25 microns of granularities around the blue chip earlier; Recharge the fluorescent material glue-line of about 15 microns of one deck particle diameters; Fill the fluorescent material glue-line of 7 microns of one deck particle diameters at last, outer adhesive layer is filled the space on the full fluorescence glue-line, plays protection fluorescent material glue-line, metal wire and cup bowl; This patent is different to the stimulation effect of variable grain degree fluorescent material according to blue chip; Be that the big fluorescent material light extraction efficiency of granularity is high; The principle of the fluorescent material hot spot best results that granularity is little; On blue chip, distribute the respectively phosphor powder layer of variable grain degree reaches by granularity Changing Pattern from big to small and to improve hot spot, reaches the effect that improves the LED light extraction efficiency through the high minute surface wall of cup of reflectivity simultaneously.

Claims (4)

1. layer-stepping LED encapsulating structure; Comprise cup bowl, crystal-bonding adhesive, blue chip, metal wire, fluorescent material glue-line and outer adhesive layer; Said crystal-bonding adhesive point is in cup bowl central authorities, and blue chip is fixed on the crystal-bonding adhesive, and the electrode of blue chip connects metal wire; The skin of blue chip is coated fluorescent material glue-line and outer adhesive layer successively, it is characterized in that: said fluorescent material glue-line is served as reasons interior to the different fluorescent material glue-line of outer three layers of granularity.
2. layer-stepping LED encapsulating structure according to claim 1 is characterized in that: said three layers of fluorescent material glue-line granularity from the inside to the outside is followed successively by 20-28 micron, 13-18 micron and 3-8 micron.
3. layer-stepping LED encapsulating structure according to claim 1, it is characterized in that: the thickness of said three layers of fluorescent material glue-line is identical.
4. layer-stepping LED encapsulating structure according to claim 1 is characterized in that: said cup bowl inclined-plane is mirror surface structure.
CN2012200244854U 2012-01-19 2012-01-19 Layered light-emitting diode (LED) packaging structure Expired - Fee Related CN202454609U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012200244854U CN202454609U (en) 2012-01-19 2012-01-19 Layered light-emitting diode (LED) packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012200244854U CN202454609U (en) 2012-01-19 2012-01-19 Layered light-emitting diode (LED) packaging structure

Publications (1)

Publication Number Publication Date
CN202454609U true CN202454609U (en) 2012-09-26

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Family Applications (1)

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CN2012200244854U Expired - Fee Related CN202454609U (en) 2012-01-19 2012-01-19 Layered light-emitting diode (LED) packaging structure

Country Status (1)

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CN (1) CN202454609U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103779479A (en) * 2013-06-20 2014-05-07 苏州恒荣节能科技安装工程有限公司 LED package structure
CN103779487A (en) * 2013-06-20 2014-05-07 苏州恒荣节能科技安装工程有限公司 Three-layer LED package structure
CN106384776A (en) * 2016-11-30 2017-02-08 深圳市聚飞光电股份有限公司 Sandwich type quantum dot LED lamp bead packaging method
CN106449908A (en) * 2016-11-30 2017-02-22 深圳市聚飞光电股份有限公司 Packaging method of LED lamp bead based on quantum dot fluorescent film

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103779479A (en) * 2013-06-20 2014-05-07 苏州恒荣节能科技安装工程有限公司 LED package structure
CN103779487A (en) * 2013-06-20 2014-05-07 苏州恒荣节能科技安装工程有限公司 Three-layer LED package structure
CN106384776A (en) * 2016-11-30 2017-02-08 深圳市聚飞光电股份有限公司 Sandwich type quantum dot LED lamp bead packaging method
CN106449908A (en) * 2016-11-30 2017-02-22 深圳市聚飞光电股份有限公司 Packaging method of LED lamp bead based on quantum dot fluorescent film
CN106384776B (en) * 2016-11-30 2018-08-24 深圳市聚飞光电股份有限公司 A kind of packaging method of sandwich type quantum dot LED lamp bead

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120926

Termination date: 20180119

CF01 Termination of patent right due to non-payment of annual fee