CN103779487A - Three-layer LED package structure - Google Patents

Three-layer LED package structure Download PDF

Info

Publication number
CN103779487A
CN103779487A CN201310245277.6A CN201310245277A CN103779487A CN 103779487 A CN103779487 A CN 103779487A CN 201310245277 A CN201310245277 A CN 201310245277A CN 103779487 A CN103779487 A CN 103779487A
Authority
CN
China
Prior art keywords
led
layer
phosphor
layers
glue
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310245277.6A
Other languages
Chinese (zh)
Inventor
刘万庆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUZHOU HENGRONG ENERGY-SAVING TECHNOLOGY INSTALLATION ENGINEERING Co Ltd
Original Assignee
SUZHOU HENGRONG ENERGY-SAVING TECHNOLOGY INSTALLATION ENGINEERING Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUZHOU HENGRONG ENERGY-SAVING TECHNOLOGY INSTALLATION ENGINEERING Co Ltd filed Critical SUZHOU HENGRONG ENERGY-SAVING TECHNOLOGY INSTALLATION ENGINEERING Co Ltd
Priority to CN201310245277.6A priority Critical patent/CN103779487A/en
Publication of CN103779487A publication Critical patent/CN103779487A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8516—Wavelength conversion means having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient

Landscapes

  • Led Device Packages (AREA)

Abstract

本发明的技术方案是：一种三层LED封装结构，包括LED芯片、杯碗、外层封胶，所述LED芯片安装在杯碗上表面中部，荧光粉胶层涂在LED芯片之上，外层封胶位于荧光粉胶层外部，LED芯片的正负极连接导线，所述荧光粉胶层包括颗粒度不同的荧光粉胶里外三层。作为优化，所述荧光粉胶由里至外的颗粒度依次为30-24微米、24-18微米、18-12微米。所述LED芯片可以为蓝光芯片。本发明三层LED封装结构采用不同颗粒度里外层分布且分层固定的方式，根据蓝光对不同颗粒度荧光粉的激发不同效果的道理，实现了可达到高光效而且出光光线均匀的白光LED。

The technical solution of the present invention is: a three-layer LED packaging structure, including LED chips, cups and bowls, and outer sealant. The LED chips are installed in the middle of the upper surface of the cups and bowls. The outer sealing glue is located outside the fluorescent powder glue layer, and the positive and negative poles of the LED chip are connected to the wires. The phosphor powder glue layer includes three layers of phosphor powder glue with different granularity inside and outside. As an optimization, the particle sizes of the phosphor glue from inside to outside are 30-24 microns, 24-18 microns, and 18-12 microns. The LED chip may be a blue light chip. The three-layer LED packaging structure of the present invention adopts the method of distributing the inner and outer layers of different particle sizes and layering and fixing them. According to the principle that blue light has different excitation effects on phosphor powders with different particle sizes, a white LED with high light efficiency and uniform light emission is realized. .

Description

一种三层LED封装结构A three-layer LED packaging structure

技术领域 technical field

本发明涉及LED照明领域，特别涉及一种LED封装结构。 The invention relates to the field of LED lighting, in particular to an LED packaging structure.

背景技术 Background technique

LED（ Light Emitting Diode ；发光二极管）是一种能够将电能转化为可见光的固态的半导体器件，具有寿命长、能耗低等优点，随着LED 技术的发展，LED 光源的性能也越来越好。现有的LED 封装结构中主流的LED 封装为蓝光LED 芯片加入黄色荧光粉形成白光，这种方式封装的白光LED 会因为黄色荧光粉颗粒度大小的影响而出现光斑和光效，若颗粒度偏小则光效偏低，无法达到现有的照明要求；若颗粒度偏大则光斑很差，易出黄蓝圈现象，这两者情况都严重影响到LED 的应用范围和实际使用效果。 LED (Light Emitting Diode; Light Emitting Diode) is a solid-state semiconductor device that can convert electrical energy into visible light. It has the advantages of long life and low energy consumption. With the development of LED technology, the performance of LED light sources is getting better and better. . The mainstream LED package in the existing LED packaging structure is blue LED chip with yellow phosphor powder added to form white light. The white light LED packaged in this way will have light spots and light effects due to the particle size of the yellow phosphor powder. If the particle size is too small If the luminous efficiency is low, it cannot meet the existing lighting requirements; if the particle size is too large, the light spot will be poor, and the phenomenon of yellow and blue circles will easily appear. Both of these conditions will seriously affect the application range and actual use effect of LEDs.

发明内容 Contents of the invention

本发明的目的是针对现有技术的不足，提供一种可实现高光效且出光光线均匀的三层LED封装结构。 The object of the present invention is to provide a three-layer LED packaging structure capable of achieving high light efficiency and uniform light output in order to address the shortcomings of the prior art.

为达到上述目的，本发明的技术方案是：一种三层LED封装结构，包括LED芯片、杯碗、外层封胶，所述LED芯片安装在杯碗上表面中部，荧光粉胶层涂在LED芯片之上，外层封胶位于荧光粉胶层外部， LED芯片的正负极连接导线，所述荧光粉胶层包括颗粒度不同的荧光粉胶里外三层。作为优化，所述荧光粉胶由里至外的颗粒度依次为30-24微米、24-18微米、18-12微米。所述LED芯片可以为蓝光芯片。 In order to achieve the above object, the technical solution of the present invention is: a three-layer LED packaging structure, including LED chips, cups and bowls, and outer sealant. On the LED chip, the outer sealing glue is located outside the phosphor glue layer, and the positive and negative electrodes of the LED chip are connected to the wires. The phosphor glue layer includes three layers of phosphor glue with different particle sizes inside and outside. As an optimization, the particle sizes of the phosphor glue from inside to outside are 30-24 microns, 24-18 microns, and 18-12 microns. The LED chip may be a blue light chip.

本发明三层LED封装结构采用不同颗粒度里外层分布且分层固定的方式，根据蓝光对不同颗粒度荧光粉的激发不同效果的道理，实现了可达到高光效而且出光光线均匀的白光LED。 The three-layer LED packaging structure of the present invention adopts the method of distributing the inner and outer layers of different particle sizes and layering and fixing them. According to the principle that blue light has different excitation effects on phosphor powders with different particle sizes, a white LED with high light efficiency and uniform light emission is realized. .

附图说明 Description of drawings

图1为本发明三层LED封装结构结构示意图。 Fig. 1 is a structural schematic diagram of a three-layer LED packaging structure according to the present invention.

具体实施方式 Detailed ways

下面给出的实施例拟对本发明作进一步说明，但不能理解为是对本发明保护范围的限制，本领域技术人员根据本发明内容对本发明的一些非本质的改进和调整，仍属于本发明的保护范围。 The embodiment given below intends to further illustrate the present invention, but can not be interpreted as the restriction to protection scope of the present invention, those skilled in the art still belongs to the protection of the present invention to some non-essential improvements and adjustments of the present invention according to the content of the present invention scope.

如图1所示，三层LED封装结构，包括LED芯片1、杯碗2、外层封胶3，LED芯片1安装在杯碗2上表面中部，荧光粉胶层包括颗粒度不同的荧光粉胶里外三层。里层荧光粉胶5，中间层荧光粉胶7，外层荧光粉胶4涂在LED芯片1之上，外层封胶3位于荧光粉胶层外部， LED芯片1的正负极连接导线6。荧光粉胶由里至外的颗粒度依次为30-24微米、24-18微米、18-12微米。里层荧光粉胶5直径为中间层荧光粉胶7的三分之二，里层荧光粉胶5直径为外层荧光粉胶4直径二分之一。所述LED芯片为蓝光芯片。 As shown in Figure 1, the three-layer LED packaging structure includes LED chip 1, cup and bowl 2, and outer sealant 3. LED chip 1 is installed in the middle of the upper surface of cup and bowl 2, and the phosphor powder layer includes phosphors with different particle sizes. Three layers of glue inside and outside. The inner layer of phosphor glue 5, the middle layer of phosphor glue 7, the outer layer of phosphor glue 4 coated on the LED chip 1, the outer layer of sealing glue 3 located outside the phosphor glue layer, the positive and negative connecting wires of LED chip 1 6 . The particle size of phosphor glue from inside to outside is 30-24 microns, 24-18 microns, 18-12 microns. The diameter of the phosphor powder glue 5 in the inner layer is two thirds of that of the phosphor powder glue 7 in the middle layer, and the diameter of the phosphor powder glue 5 in the inner layer is 1/2 of the diameter of the phosphor powder glue 4 in the outer layer. The LED chip is a blue light chip.

本发明三层LED封装结构采用不同颗粒度里外层分布且分层固定的方式，根据蓝光对不同颗粒度荧光粉的激发不同效果的道理，实现了可达到高光效而且出光光线均匀的白光LED。 The three-layer LED packaging structure of the present invention adopts the method of distributing the inner and outer layers of different particle sizes and layering and fixing them. According to the principle that blue light has different excitation effects on phosphor powders with different particle sizes, a white LED with high light efficiency and uniform light emission is realized. .

Claims (4)

1. three layers of LED encapsulating structure, comprise LED chip, cup, outer sealing, described LED chip is arranged on cup upper surface middle part, fluorescent material glue-line is coated on LED chip, outer sealing is positioned at fluorescent material glue-line outside, the both positive and negative polarity of LED chip connects wire, it is characterized in that inside and outside three layers of the phosphor gel that described fluorescent material glue-line comprises that granularity is different.
2. according to three layers of LED encapsulating structure described in claim 1, it is characterized in that described phosphor gel granularity is from the inside to the outside followed successively by 30-24 micron, 24-18 micron, 18-12 micron.
3. according to three layers of LED encapsulating structure described in claim 1, it is characterized in that described phosphor gel nexine diameter is 2/3rds of intermediate layer diameter, phosphor gel nexine diameter is outer diameter 1/2nd.
4. according to three layers of LED encapsulating structure described in claim 1, it is characterized in that described LED chip is blue chip.
CN201310245277.6A 2013-06-20 2013-06-20 Three-layer LED package structure Pending CN103779487A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310245277.6A CN103779487A (en) 2013-06-20 2013-06-20 Three-layer LED package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310245277.6A CN103779487A (en) 2013-06-20 2013-06-20 Three-layer LED package structure

Publications (1)

Publication Number Publication Date
CN103779487A true CN103779487A (en) 2014-05-07

Family

ID=50571518

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310245277.6A Pending CN103779487A (en) 2013-06-20 2013-06-20 Three-layer LED package structure

Country Status (1)

Country Link
CN (1) CN103779487A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202454609U (en) * 2012-01-19 2012-09-26 福州瑞晟电子有限公司 Layered light-emitting diode (LED) packaging structure

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202454609U (en) * 2012-01-19 2012-09-26 福州瑞晟电子有限公司 Layered light-emitting diode (LED) packaging structure

Similar Documents

Publication Publication Date Title
CN202153536U (en) High power LED packaging structure
CN105720166A (en) White-light LED chip preparation method
CN203288644U (en) Distributed high-voltage LED (Light-Emitting Diode) module group
CN204130588U (en) A kind of COB light source without packaged chip
CN103050615B (en) A kind of White LED with high color rendering property device
CN204045633U (en) Chip-packaging structure on light-emitting diode panel
CN204696126U (en) Based on the COB structure white light LED light source of ceramic phosphor encapsulation
CN202454609U (en) Layered light-emitting diode (LED) packaging structure
CN206650075U (en) A kind of adopting surface mounted LED packaging body of adjustable color temperature
CN203481270U (en) LED (Light-Emitting Diode) packaging structure
CN203456457U (en) SMD LED structure characterized by polycrystalline packaging
CN204857721U (en) High -power LED encapsulation paster
CN103779487A (en) Three-layer LED package structure
CN203910794U (en) Combined packaging structure of diode chips
CN203398158U (en) LED packaging structure
CN204189795U (en) Arc MCOB LED encapsulation structure
CN204927327U (en) A UV packaging structure of SMD LED lamp beads
CN203312357U (en) Patch type LED light source with all-angle lighting
CN204497229U (en) The large power white light LED of bright dipping time space aberration can be eliminated
CN203477964U (en) LED area light source lamp emitting light by 360 degrees
CN203398152U (en) Led
CN202111091U (en) Led integrated package structure
CN106816515A (en) A kind of efficient paster LED encapsulating structure
CN103779479A (en) LED package structure
CN206293467U (en) A kind of high brightness straight cutting low-power LED lamp bead

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140507