CN202183908U - Novel plasma processing device - Google Patents
Novel plasma processing device Download PDFInfo
- Publication number
- CN202183908U CN202183908U CN 201120288544 CN201120288544U CN202183908U CN 202183908 U CN202183908 U CN 202183908U CN 201120288544 CN201120288544 CN 201120288544 CN 201120288544 U CN201120288544 U CN 201120288544U CN 202183908 U CN202183908 U CN 202183908U
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- processing unit
- plasma processing
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Abstract
The utility model discloses a novel plasma processing device. The whole novel plasma processing device is located in a negative pressure environment and comprises an inner pipe, an insulating pipe and an outer pipe nested with each other from inside to outside; wherein, the inner pipe is connected with a high frequency power supply, the outer pipe is grounded, the inner pipe and the outer pipe are both metal pipes and are separated and insulated by the insulating pipe between the inner pipe and the outer pipe. One end of a three-layer casing pipe structure of the processing device is equipped with a gas source interface and the other end is closed, and the processing device penetrates the inner pipe, the insulating pipe and the outer pipe to be equipped with at least one exhaust hole; the distance of the exhaust hole relative to a to-be-processed material satisfies the self-eliminations of electrons or ions in the plasma, and excitation state particles are only kept. By applying the novel plasma processing device of the utility model, under a same discharge power, the plasma particle energy sprayed by the novel plasma processing device is high, the particle concentration is large, and the novel plasma processing device is more suitable for the materials harder to process; and because the utility model has the advantages of remote control, less side reaction, purer processing purpose, less damage to material surface and lower thermal stress, the novel plasma processing device can process sensitive materials.
Description
Technical field
The utility model relates to a kind of device that is used for material is carried out the Surface Physical Chemistry processing, relates in particular to a kind of spray gun device that is applied to the dry type gas-phase reaction, high energy high-density plasma air-flow is provided.
Background technology
The low temperature plasma process of surface treatment is meant under negative pressure and (is generally tens handkerchiefs), and certain gas is applied high-frequency electric field, makes it be excited into plasmoid.Plasma is as the 4th attitude of material; Wherein comprise a large amount of electronics, ion and free radical isoreactivity particle, these active particles collide the surface that is processed object; Corresponding physics or chemical reaction can take place; The character of material surface is changed or give new function,, satisfy the needs of practical application to reach its processing intent.
Compare traditional material surface treatment method, Cement Composite Treated by Plasma has following advantage: 1. the Cement Composite Treated by Plasma material surface belongs to dry process, is different from conventional liquid phase processing method, environment is not polluted clean environment firendly; 2. plasma reaction rapid speed, treatment effeciency is higher, so energy consumption is less relatively, processing cost is lower; 3. Cement Composite Treated by Plasma only relates to material surface, does not influence the performance of processed material itself; 4. the Cement Composite Treated by Plasma application scenario is comparatively extensive, because its distinctive gas phase reaction process, low temperature plasma is widely applied the field of surface treatment in precision components.
Present domestic low temperature plasma is used and is also lagged behind developed countries significantly, but market prospects are comparatively considerable.Yet in traditional Cement Composite Treated by Plasma, because the diversity of plasma content, so its surface treatment reaction to process object is not single.For example the excited state particle in the plasma is because contained energy is higher; It collides and can interrupt some covalent bond after material or the monomer gas and make it produce free radical; And then a series of grafting, polymerization reaction take place, make material surface form required functional group.And other particles (like electronics, ion etc.) that are present in equally in the plasma are also constantly bombarding material surface, make it to degrade, and side effects such as etching have destroyed material surface, have influenced treatment effect.
Summary of the invention
Defective in view of above-mentioned prior art existence; The purpose of the utility model is to propose a kind of novel plasma processing unit; Expand the range of application of plasma to some sensitive material or large tracts of land material; Side reactions such as electronics or ion are saved cost to the influence of treatment effect in the optimization plasma.
The purpose of the utility model will be achieved through following technical scheme:
A kind of novel plasma processing unit; It is characterized in that: said processing unit integral body is in subnormal ambient; It comprises interior pipe, insulated tube and outer tube that from-inner-to-outer is nested, and wherein interior pipe connects high frequency electric source, outer tube ground connection; Both are metal tube for this, and both separate insulation by the insulated tube of centre; Three layers of sleeve structure one end of said processing unit are made as gas source interface; Other end sealing; And processing unit penetrates interior pipe, insulated tube and outer tube and is provided with at least one round; The distance of the pending relatively material of said round satisfies electronics or ion oneself elimination in the plasma, only keeps excited state particle.
Further, said round is that relative inner and outer pipe aperture, insulated tube aperture is contraction-like fluidic architecture.
Further, extend axially on three of said processing unit layers of sleeve structure to arrange and be provided with two above rounds; Perhaps on three of said processing unit layers of sleeve structure axially dislocation arrange and be provided with two above rounds; Or the same sagittal plane arrangement of three layers of sleeve structure upper edge of said processing unit is provided with two above rounds.
Further, said processing unit is provided with to be used to drive and self moves radially, large tracts of land pending material is carried out plasma surface treatment.
Compare to conventional plasma processing apparatus, the application implementation of the utility model plasma processing apparatus, its outstanding effect is:
Under identical discharge power, the plasma particle energy that this structure ejects is high, and particle concentration is big, is more suitable for some more unmanageable materials; Owing to possess long-range advantage, the side reaction of this structure treatment material is less, and processing intent is purer, has reduced the damage that material is shown, thermal stress is lower simultaneously, and this structure can be handled sensitive material.
Following constipation closes the embodiment accompanying drawing, the embodiment of the utility model is done further to detail, so that the utility model technical scheme is easier to understand, grasp.
Description of drawings
Fig. 1 is the radially cutaway sectional view of the utility model plasma processing apparatus;
Fig. 2 is the enlarged diagram of round shown in Figure 1.
Embodiment
In the face of the surface treatment drawback that plasma described in the background technology exists, select the remote plasma process of surface treatment usually.So-called long-range, be meant the direct generation zone of object being treated away from plasma.Because contained its life-span of each material and inequality in the plasma, electronics wherein, the rate of disappearance of ion is 10
-7Cm
3/ s, and the rate of disappearance of the excited state particle that plays a key effect is 10
-33Cm
3/ s is so the excited state particle life-span of high energy is longer.Plasma is suitably drawn generation zone (being region of discharge) can be good at getting rid of short electronics of life-span, ion etc.; And long high energy particle of reservation life-span; So just, the adverse effect of electronics, ion etc. is dropped to minimum, thereby make reaction pure more smoothly.
The utility model is a kind of structure of Low Temperature Plasma Treating material surface, claims the hollow cathode structure again.It is big that the plasma that this structure inspires has a particle energy, and particle concentration is high, and do not have the existence of side reactions such as etching, is desirable low temperature plasma surface processing device.
As depicted in figs. 1 and 2, this plasma processing unit integral body is in subnormal ambient, and totally three tubes are formed from inside to outside, and its middle external tube 1 is a metal tube with interior pipe 3, and intermediate insulation pipe 2 separates interior pipe 3 with outer tube 1, and each pipe box nests together.These three layers of sleeve structure one ends are made as gas source interface; Other end sealing; And processing unit penetrates interior pipe, insulated tube and outer tube and is provided with at least one round 6, and the distance of the pending relatively material of said round satisfies electronics or ion oneself elimination in the plasma, only keeps excited state particle.In conjunction with accompanying drawing, pending material 5 is positioned on the objective table 4, and above-mentioned distance is the distance of the pending relatively material 5 of round 6.Reacting gas 7 gets into from interior pipe 3 rear sides, and front seal makes the round ejection of gas from the pipe lower end.
Further, round (being spout) is designed to fluidic architecture, makes its jeting effect best.Outer tube ground connection is served as anode; Interior pipe connects high frequency electric source and serves as negative electrode; Because stopping of intermediate insulation pipe, electric field more is distributed in the round place that naked intercepts, and reacting gas flows through and promptly becomes high-octane plasma here; Pending material is positioned under the round, and the plasma of ejection carries out surface treatment to it.Because processing region is away from region of discharge, so this structure possesses the advantage of remote plasma simultaneously.
Carry out under the technological requirement of graft polymerization at logical monomer gas, can the monomer pipe be placed under the plasma spray round, effectively avoided the direct effect of high frequency electric source to the monomer pipe, can improve the quality of polymerization deposition, monomer gas can not pollute erosion electrode simultaneously.
Except that above-mentioned illustrated embodiment, this structure updating space is bigger, through position, size, the quantity of appropriate change round, makes it be applicable to the occasion of some special material.Specifically feasible scheme comprises extending axially on three layers of sleeve structure of this processing unit to arrange and is provided with two above rounds; Perhaps on three of this processing unit layers of sleeve structure axially dislocation arrange and be provided with two above rounds; Or the same sagittal plane arrangement of three layers of sleeve structure upper edge of this processing unit is provided with two above rounds.For example some material has only certain part or certain several part to need to handle, and other parts should not accepted processing, so can spout can be realized in alignment with the need into treatment sites.Simultaneously, this structure tube suitably extends, and moves radially simultaneously, can carry out the plasma surface treatment of large tracts of land material, so that industrial applications.
Compare to conventional plasma processing apparatus; The application implementation of the utility model plasma processing apparatus, its outstanding effect is: under identical discharge power, the plasma particle energy that this structure ejects is high; Particle concentration is big, is more suitable for some more unmanageable materials; Owing to possess long-range advantage, the side reaction of this structure treatment material is less, and processing intent is purer, has reduced the damage that material is shown, thermal stress is lower simultaneously, and this structure can be handled sensitive material.
Claims (6)
1. novel plasma processing unit; It is characterized in that: said processing unit integral body is in subnormal ambient; It comprises interior pipe, insulated tube and outer tube that from-inner-to-outer is nested, and wherein interior pipe connects high frequency electric source, outer tube ground connection; Both are metal tube for this, and both separate insulation by the insulated tube of centre; Three layers of sleeve structure one end of said processing unit are made as gas source interface; Other end sealing; And processing unit penetrates interior pipe, insulated tube and outer tube and is provided with at least one round; The distance of the pending relatively material of said round satisfies electronics or ion oneself elimination in the plasma, only keeps excited state particle.
2. a kind of novel plasma processing unit according to claim 1 is characterized in that: said round is that relative inner and outer pipe aperture, insulated tube aperture is contraction-like fluidic architecture.
3. a kind of novel plasma processing unit according to claim 1 is characterized in that: extend axially arrangement on three layers of sleeve structure of said processing unit and be provided with two above rounds.
4. a kind of novel plasma processing unit according to claim 1 is characterized in that: axially misplacing to arrange on three layers of sleeve structure of said processing unit is provided with two above rounds.
5. a kind of novel plasma processing unit according to claim 1 is characterized in that: same sagittal plane, three layers of sleeve structure upper edge of said processing unit is arranged and is provided with two above rounds.
6. a kind of novel plasma processing unit according to claim 1 is characterized in that: said processing unit is provided with and is used to drive the driver module that self moves radially, the pending material of large tracts of land is carried out plasma surface treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120288544 CN202183908U (en) | 2011-08-10 | 2011-08-10 | Novel plasma processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120288544 CN202183908U (en) | 2011-08-10 | 2011-08-10 | Novel plasma processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202183908U true CN202183908U (en) | 2012-04-04 |
Family
ID=46176926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120288544 Expired - Fee Related CN202183908U (en) | 2011-08-10 | 2011-08-10 | Novel plasma processing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202183908U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103035464A (en) * | 2012-12-26 | 2013-04-10 | 苏州工业职业技术学院 | Hollow cathode tube with water-cooling effect |
-
2011
- 2011-08-10 CN CN 201120288544 patent/CN202183908U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103035464A (en) * | 2012-12-26 | 2013-04-10 | 苏州工业职业技术学院 | Hollow cathode tube with water-cooling effect |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120404 Termination date: 20130810 |