CN202077266U

CN202077266U - High heat-radiation multilayer-type combined base plate

Info

Publication number: CN202077266U
Application number: CN2011201437328U
Authority: CN
Inventors: 陈尧明
Original assignee: Individual
Current assignee: Individual
Priority date: 2011-05-09
Filing date: 2011-05-09
Publication date: 2011-12-14
Anticipated expiration: 2021-05-09

Abstract

A high heat-radiation multilayer-type combined base plate comprises at least one insulating base plate unit, wherein the insulating base plate unit comprises a base material and a heat radiation layer, the surface of the base material is provided with leads, intervals are formed among the leads, surfaces of the leads and spaces among the intervals are coated with insulating oil ink, and the insulating oil ink forms a equal-height flat surface of the heat radiation layer, the solidified heat radiation layer forms an insulating base plate unit by combining with the base material, conductive glued films are pasted among various insulating units, so the insulating base plate unit has the best heat radiation effect, and at the same time, breakdown resisting voltage among leads is increased, so intervals among the leads are further reduced, thereby realizing the purpose of a light, thin and small design requirement of various electronic products.

Description

High heat radiation multiple field composite base plate

Technical field

A kind of high heat radiation multiple field composite base plate refers to the preferable endurable height heat radiation multiple field composite base plate that hits voltage of tool especially.

Background technology

Along with progressive science and technology of epoch is more and more flourishing, the volume of each relative electronic product is light, thin, short, the little design of deflection gradually also, increase for the circuit capacity of the miniaturization lightweight of dealing with electronic product and the high aggregationization of electronic component, therefore the printed circuit board (PCB) that electronic product is relevant also develops towards this direction, and be in response to above-mentioned design, promptly there is relevant dealer to utilize multilayer board to reach to dwindle the demand of entire area; Existing multilayer board must be provided with plural conductive adhesive film between each substrate, could improve the breakdown voltage resistant of substrate, yet, conductive adhesive film sticks in the cuticula on the surface of must tearing behind the substrate lead just can paste down a slice conductive adhesive film again, therefore the number of plies of conductive adhesive film increases, the relative number of times of pasting conductive adhesive film and tearing cuticula off that also can make increases, and processing procedure man-hour, material cost are improved; Moreover because conductive adhesive film fits in the substrate conductive line surfaces, so conductive adhesive film can form the medium that an isolated lead contacts with air, and makes its thermal source be difficult for leaving and then producing regenerative effect.

Therefore, how to solve above-mentioned existing problem and shortcoming, be the problem of being engaged in research and development that this relevant dealer desires most ardently.

Summary of the invention

Main purpose of the present utility model is, can disperse uniformly rapidly by coating the heat dissipating layer between substrate conductive line surfaces and spacing, make the heat energy that is arranged at the circuit board surface electronic component, produces damage to avoid electronic component because of overheated.

Secondary objective of the present utility model is, by coating the heat dissipating layer of substrate wire pitch, with the endurable voltage that hits between the raising lead, and obtains preferable insulation effect.

For reaching above-mentioned purpose, the utlity model has at least one insulated substrate unit, this insulated substrate unit pack contains base material and heat dissipating layer, this substrate surface is formed with lead, and between each lead, be formed with spacing, this heat dissipating layer is for coating conductive line surfaces with dielectric ink and filling up between each spacing, and form a contour smooth heat dissipating layer surface, combine formation one insulated substrate unit with base material and solidify the back at heat dissipating layer, each insulate and is fitted with conductive adhesive film between the unit, so that the insulated substrate unit is to have preferable radiating effect, and improve breakdown voltage resistant between lead simultaneously, and then reach the further spacing between the constriction lead, to be partial to the purpose of compact design in response to each electronic product.

Description of drawings

Fig. 1 is the side-looking part sectioned view of the utility model preferred embodiment;

Fig. 2 is the utility model side-looking part sectioned view of a preferred embodiment again;

Fig. 3 is the side-looking part sectioned view of the another preferred embodiment of the utility model.

Description of reference numerals: 1-insulated substrate unit; The 11-base material; The 111-lead; The 112-spacing; The 12-heat dissipating layer; The 2-conductive adhesive film.

Embodiment

See also shown in Figure 1ly, find out that by knowing among the figure this insulated substrate unit 1 includes base material 11 and heat dissipating layer 12, wherein:

These base material 11 surfaces are formed with lead 111, and are formed with spacing 112 in 111 in each lead; This heat dissipating layer 12 is for coating lead 111 surfaces and filling up in 112 of each spacings with dielectric ink, and form a contour smooth heat dissipating layer 12 surfaces, combine formation one insulated substrate unit 1 with base material 11 and solidify the back at heat dissipating layer 12, this heat dissipating layer 12 is the hot curing dielectric ink, and this heat dissipating layer 12 is the photocuring dielectric ink.

When the utility model will be printed in base material 11 surfaces by the heat dissipating layer 12 that dielectric ink is made in the mode of printing when making, make its be covered in lead 111 the surface and fill up in each spacing 112, and form a contour smooth heat dissipating layer 12 surfaces, utilize the UV-irradiation or the mode of heating that ink solidification is combined with base material 11 again and form an insulated substrate unit 1.

See also shown in Figure 2ly, find out by knowing among the figure, it has at least two insulated substrate unit 1 and the conductive adhesive film 2 of a slice at least, and each insulated substrate unit 1 all includes base material 11 and heat dissipating layer 12; These base material 11 surfaces 111 are formed with lead 111, and are formed with spacing 112 in 111 in each lead; This heat dissipating layer 12 is for coating lead 111 surfaces and fill up in 112 of each spacings with dielectric ink, and forms a contour smooth heat dissipating layer 12 surfaces; Combine formation one insulated substrate unit 1 with base material 11 and solidify the back at heat dissipating layer 12; And, between above-mentioned per two insulated substrate unit 1, be fitted with conductive adhesive film 2, fit mutually with the heat dissipating layer 12 of one insulated substrate unit 1, fitting mutually with the base material 11 of another insulated substrate unit 1 forms a multiple field composite base plate.

See also shown in Figure 3ly, find out by knowing among the figure, the conductive adhesive film 2 of each 1 applying in insulated substrate unit, it is all fitted mutually with the base material 11 of two insulated substrate unit 1 and forms multiple field composite base plates.

In sum, because 112 of each spacings of insulated substrate unit 1 base material 11 are the heat dissipating layer 12 of filling up the tool insulation effect, therefore above-mentioned heat dissipating layer 12 is for improving the breakdown voltage resistant of 111 in lead, the spacing 112 that makes 111 in each lead is constriction further, and increases the circuit capacity of this substrate 11 simultaneously.

Moreover because the lead 111 of insulated substrate unit 1 base material 11 surface and 112 of each spacings are filled up the heat dissipating layer 12 that dielectric ink forms, so this heat dissipating layer 12 be for can make the long-pending heat of base material 11 distribute equably, and a preferable radiating effect is provided; Again and since this heat dissipating layer 12 with can form contour even curface after base material 11 combine, therefore make conductive adhesive film 2 can more easily be attached at the surperficial of heat dissipating layer 12 and avoid the bubble generation.

Claims

1. one kind high heat radiation multiple field composite base plate is characterized in that, has an insulated substrate unit, and this insulated substrate unit pack contains base material and heat dissipating layer; This substrate surface is formed with lead, is formed with spacing between described each lead; This heat dissipating layer is for coating described conductive line surfaces and fill up between described each spacing with dielectric ink, and forms a contour smooth heat dissipating layer surface; Heat dissipating layer after the curing combines with base material and forms this insulated substrate unit.

2. high heat radiation multiple field composite base plate as claimed in claim 1 is characterized in that described heat dissipating layer is the hot curing dielectric ink.

3. high heat radiation multiple field composite base plate as claimed in claim 1 is characterized in that described heat dissipating layer is the photocuring dielectric ink.

4. one kind high heat radiation multiple field composite base plate is characterized in that, has at least two insulated substrate unit and reaches the conductive adhesive film of a slice at least, and each insulated substrate unit all includes base material and heat dissipating layer; This substrate surface is formed with lead, and is formed with spacing between each lead; This heat dissipating layer is for coating conductive line surfaces with dielectric ink and filling up in a contour smooth heat dissipating layer surface that forms between each spacing; Solidify the back at heat dissipating layer and combine formation one insulated substrate unit with base material; Between above-mentioned per two insulated substrate unit, be fitted with conductive adhesive film, form a multiple field composite base plate.

5. high heat radiation multiple field composite base plate as claimed in claim 4 is characterized in that, the conductive adhesive film of fitting between per two insulated substrate unit is fitted mutually with the heat dissipating layer of an insulated substrate unit wherein, fits mutually with the base material of another insulated substrate unit.

6. high heat radiation multiple field composite base plate as claimed in claim 4 is characterized in that the conductive adhesive film of fitting between per two insulated substrate unit is all fitted mutually with the base material of described two insulated substrate unit.

7. high heat radiation multiple field composite base plate as claimed in claim 4 is characterized in that this heat dissipating layer is the hot curing dielectric ink.

8. high heat radiation multiple field composite base plate as claimed in claim 4 is characterized in that this heat dissipating layer is the photocuring dielectric ink.