CN202067789U

CN202067789U - TO220B-5L waterproof sealed lead frame

Info

Publication number: CN202067789U
Application number: CN 201120114908
Authority: CN
Inventors: 侯友良
Original assignee: WUXI RED MICROELECTRONICS CO Ltd
Current assignee: WUXI RED MICROELECTRONICS CO Ltd
Priority date: 2011-04-19
Filing date: 2011-04-19
Publication date: 2011-12-07
Anticipated expiration: 2021-04-19

Abstract

The utility model provides a TO220B-5L waterproof sealed lead frame, which has the advantages that the bonding strength between the lead frame and plastic is high and the waterproof performance is good. The TO220B-5L waterproof sealed lead frame comprises a cooling fixed part, a chip bottom pad and external pins. A chip is installed in the center of the chip bottom pad. The TO220B-5L waterproof sealed lead frame is characterized in that V-shaped water retaining grooves are arranged around the center of the chip bottom pad and concave-convex grooves are arranged around the external sides of the V-shaped water retaining grooves of the chip bottom pad.

Description

A kind of TO220B-5L waterproof sealing lead frame

Technical field

The utility model relates to the technical field of semiconductor packages, is specially a kind of TO220B-5L waterproof sealing lead frame.

Background technology

Existing TO220B-5L sealed lead frame carries out plastic packaging after the chip section substrate of chip and lead frame is seated, because chip bottom Ji Dao's is the plane all around, so the bond strength of lead frame and plastic cement is low, water proofing property is poor.

Summary of the invention

At the problems referred to above, the utility model provides a kind of TO220B-5L waterproof sealing lead frame, and it makes bond strength height, the good waterproof performance of lead frame and plastic cement.

A kind of TO220B-5L waterproof sealing lead frame, its technical scheme is such: it comprises heat radiation fixed part, chip bottom Ji Dao, outer pin, chip is installed at the center of described chip bottom Ji Dao, it is characterized in that: have the V-type water-blocking groove around the center of described chip bottom Ji Dao, have tongue and groove around the V-type water-blocking groove outside of described chip bottom Ji Dao.

It is further characterized in that: the described V-type water-blocking groove around the center of described chip bottom Ji Dao is interconnected and forms a closed space;

Described tongue and groove around the center of described chip bottom Ji Dao is connected and forms a closed space;

Described tongue and groove is specially the not grooving of mid portion of any two adjacent grooves and the structure that is combined to form.

After adopting said structure of the present utility model, after chip was installed in the center of chip section Ji Dao, because the existence of tongue and groove, the bond strength height of lead frame behind the plastic packaging and plastic cement, good waterproof performance were because water proofing property has further been guaranteed in the existence of V-type water-blocking groove.

Description of drawings

Fig. 1 is the utility model structural representation;

Fig. 2 is that the A-A of Fig. 1 cuts open the structural representation enlarged drawing;

Fig. 3 is that the B-B of Fig. 2 cuts open the structural representation enlarged drawing.

Embodiment

See Fig. 1, Fig. 2, Fig. 3, it comprises fin fixed part 1, chip bottom base island 2, outer pin 3, the center on chip bottom base island 2 is installed chip and (is not drawn among the figure, belong to existing mature structure), have V-type water-blocking groove 4 around the center on chip bottom base island 2, chip bottom base island 2 be positioned at V-type water-blocking groove 4 outsides around have a tongue and groove 5, V-type water-blocking groove 4 all around is connected and forms a closed space; Tongue and groove 5 all around is connected and forms a closed space, and tongue and groove 5 is specially the not grooving of mid portion of any two adjacent grooves 6 and the structure that is combined to form.

Wherein: TO220B-5L is the model of lead frame.

Claims

1. TO220B-5L waterproof sealing lead frame, it comprises heat radiation fixed part, chip bottom Ji Dao, outer pin, chip is installed at the center of described chip bottom Ji Dao, it is characterized in that: have the V-type water-blocking groove around the center of described chip bottom Ji Dao, have tongue and groove around the V-type water-blocking groove outside of described chip bottom Ji Dao.

2. a kind of TO220B-5L waterproof sealing lead frame according to claim 1 is characterized in that: the described V-type water-blocking groove around the center of described chip bottom Ji Dao is interconnected and forms a closed space.

3. a kind of TO220B-5L waterproof sealing lead frame according to claim 1 is characterized in that: the described tongue and groove around the center of described chip bottom Ji Dao is connected and forms a closed space.

4. according to the described a kind of TO220B-5L waterproof sealing lead frame of arbitrary claim among the claim 1-3, it is characterized in that: described tongue and groove is specially the not grooving of mid portion of any two adjacent grooves and the structure that is combined to form.