CN102412223A - Waterproof sealing lead frame structure - Google Patents
Waterproof sealing lead frame structure Download PDFInfo
- Publication number
- CN102412223A CN102412223A CN201110097592XA CN201110097592A CN102412223A CN 102412223 A CN102412223 A CN 102412223A CN 201110097592X A CN201110097592X A CN 201110097592XA CN 201110097592 A CN201110097592 A CN 201110097592A CN 102412223 A CN102412223 A CN 102412223A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- chip bottom
- waterproof sealing
- dao
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention provides a waterproof sealing lead frame structure of TO220B-7 by which the lead frame and plastic have high joint strength and good waterproof. The waterproof sealing lead frame structure comprises a heat radiation fixing part, a chip bottom island and an external pin, wherein chips are arranged in the center of the chip bottom island. The structure provided by the invention is characterized in that a V-shaped water shielding slot is formed around the centre of the chip bottom island and a concave-convex slot is formed around the outer side of the V-shaped water shielding slot of the chip bottom island.
Description
Technical field
The present invention relates to the technical field of semiconductor packages, be specially TO220B-7L waterproof sealing lead frame.
Background technology
Existing TO220B-7L sealed lead frame carries out plastic packaging after the chip section substrate of chip and lead frame is seated, because chip bottom Ji Dao's is the plane all around, so the bond strength of lead frame and plastic cement is low, water proofing property is poor.
Summary of the invention
To the problems referred to above, the invention provides TO220B-7L waterproof sealing lead frame, it makes the bond strength of lead frame and plastic cement high, good waterproof performance.
TO220B-7L waterproof sealing lead frame; Its technical scheme is such: it comprises heat radiation fixed part, chip bottom Ji Dao, outer pin; Chip is installed at the center of said chip bottom Ji Dao; It is characterized in that: have the V-type water-blocking groove around the center of said chip bottom Ji Dao, have tongue and groove around the V-type water-blocking groove outside of said chip bottom Ji Dao.
It is further characterized in that: the said V-type water-blocking groove around the center of said chip bottom Ji Dao is interconnected and forms a closed space;
Said tongue and groove around the center of said chip bottom Ji Dao is connected and forms a closed space;
Said tongue and groove is specially the not grooving of mid portion of any two adjacent grooves and the structure that is combined to form.
After adopting said structure of the present invention, after chip was installed in the center of chip section Ji Dao, because the existence of tongue and groove, the lead frame behind the plastic packaging and the bond strength of plastic cement were high, good waterproof performance, because water proofing property has further been guaranteed in the existence of V-type water-blocking groove.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is that the A-A of Fig. 1 cuts open the structural representation enlarged drawing;
Fig. 3 is that the B-B of Fig. 2 cuts open the structural representation enlarged drawing.
Embodiment
See Fig. 1, Fig. 2, Fig. 3; It comprises fin fixed part 1, chip bottom base island 2, outer pin 3; Chip (do not draw among the figure, belong to existing mature structure) is installed at the center on chip bottom base island 2, has V-type water-blocking groove 4 around the center on chip bottom base island 2; Chip bottom base island 2 be positioned at V-type water-blocking groove 4 outside around have tongue and groove 5, V-type water-blocking groove 4 all around is connected and forms a closed space; Tongue and groove 5 all around is connected and forms a closed space, and tongue and groove 5 is specially the not grooving of mid portion of any two adjacent grooves 6 and the structure that is combined to form.
Wherein: TO220B-7L is a model of lead frame.
Claims (4)
1.TO220B-7L waterproof sealing lead frame; It comprises heat radiation fixed part, chip bottom Ji Dao, outer pin; Chip is installed at the center of said chip bottom Ji Dao; It is characterized in that: have the V-type water-blocking groove around the center of said chip bottom Ji Dao, have tongue and groove around the V-type water-blocking groove outside of said chip bottom Ji Dao.
2. TO220B-7L waterproof sealing lead frame according to claim 1 is characterized in that: the said V-type water-blocking groove around the center of said chip bottom Ji Dao is interconnected and forms a closed space.
3. TO220B-7L waterproof sealing lead frame according to claim 1 is characterized in that: the said tongue and groove around the center of said chip bottom Ji Dao is connected and forms a closed space.
4. according to the described TO220B-7L waterproof sealing of arbitrary claim lead frame in the claim 1 to 3, it is characterized in that: said tongue and groove is specially the not grooving of mid portion of any two adjacent grooves and the structure that is combined to form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110097592XA CN102412223A (en) | 2011-04-19 | 2011-04-19 | Waterproof sealing lead frame structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110097592XA CN102412223A (en) | 2011-04-19 | 2011-04-19 | Waterproof sealing lead frame structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102412223A true CN102412223A (en) | 2012-04-11 |
Family
ID=45914225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110097592XA Pending CN102412223A (en) | 2011-04-19 | 2011-04-19 | Waterproof sealing lead frame structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102412223A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201229942Y (en) * | 2008-11-07 | 2009-04-29 | 宁波华龙电子股份有限公司 | Dual row dual column thin type lead frame board |
| CN101442035A (en) * | 2008-12-14 | 2009-05-27 | 天水华天科技股份有限公司 | Flat non down-lead encapsulation piece and method for producing the same |
-
2011
- 2011-04-19 CN CN201110097592XA patent/CN102412223A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201229942Y (en) * | 2008-11-07 | 2009-04-29 | 宁波华龙电子股份有限公司 | Dual row dual column thin type lead frame board |
| CN101442035A (en) * | 2008-12-14 | 2009-05-27 | 天水华天科技股份有限公司 | Flat non down-lead encapsulation piece and method for producing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120411 |