CN202025743U - Packaging structure of SMD (Surface Mount Device) product - Google Patents
Packaging structure of SMD (Surface Mount Device) product Download PDFInfo
- Publication number
- CN202025743U CN202025743U CN2011200992600U CN201120099260U CN202025743U CN 202025743 U CN202025743 U CN 202025743U CN 2011200992600 U CN2011200992600 U CN 2011200992600U CN 201120099260 U CN201120099260 U CN 201120099260U CN 202025743 U CN202025743 U CN 202025743U
- Authority
- CN
- China
- Prior art keywords
- pin
- chip
- encapsulating structure
- patch products
- round platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The utility model discloses a packaging structure of an SMD (Surface Mount Device) product. The product comprises a chip, a first pin and a second pin are soldered on the chip, the chip is packaged by a packaging material, the first pin and the second pin are extended out of the packaging material, and the barycenters of the chip, the soldered end of the first pin and the soldered end of the second pin are not on a straight line. Since the barycenters of the chip, the soldered end of the first pin and the soldered end of the second pin are not on a straight line, gravity is utilized to position the chip during shaping, and thereby the chip with a large size can be packaged in a smaller packaging space.
Description
Technical field
The utility model relates to the electronic devices and components field, and particularly a kind of encapsulating structure of patch products in this structure, can be realized the small size encapsulation of high-power chip.
Background technology
The packaging density height, small product size is little, in light weight is a trend of electronic product, the volume and weight of general paster device has only about 1/10 of traditional inserting element, adopt after the patch products, electronic product volume-diminished 40% ~ 60%, the paster packing forms also is the trend of semiconductor device.Patch products mainly contains two kinds of structures in the market, a kind of is frame structure, the chip location better when it used framework to be welded on moulding, can in less encapsulated space, realize the encapsulation of large-size chip, but framework requirement on machining accuracy height, single welding negligible amounts, higher relatively on cost, in the stack encapsulation of chip, also there is certain limitation.Another kind of mode is to flatten after the wire bonds moulding, it has avoided the shortcoming of frame structure, but because lead-in wire and crystal grain welding are the central shaft symmetrical structure after finishing, chip is a square, when moulding,, chip do not have constraint because rotating around central shaft, cause chip position in packaging body not fix, but define the size of packaged chip.
The utility model content
Goal of the invention of the present utility model is a kind of encapsulating structure that overcomes the patch products that is suitable for high-power small size of above deficiency of design.
The technical scheme that the utility model adopts in order to realize its technical purpose is: a kind of encapsulating structure of patch products, this product includes chip, be welded with first pin and second pin on the described chip, around described chip, use encapsulating material to seal, described first pin and second pin stretch out outside the described encapsulating material, and the barycenter of described chip, the first pin welding ends and the second pin welding ends is not point-blank.
Further, in the encapsulating structure of above-mentioned a kind of patch products: it is an oblique round platform and a cylinder that the welding ends of first pin and second pin includes, the top of described oblique round platform contacts with described chip face, the end one of the bottom of described oblique round platform and described cylinder.
Further, in the encapsulating structure of above-mentioned a kind of patch products: described chip is the chipset of a series connection.
Further, in the encapsulating structure of above-mentioned a kind of patch products: described first pin and the second pin corotation change central shaft, and the barycenter of described chip changes outside the central shaft at described first pin and the second pin corotation.
Further, in the encapsulating structure of above-mentioned a kind of patch products: described encapsulating material is an epoxy molding plastic.
The utility model is because the barycenter of chip, the first pin welding ends and the second pin welding ends, utilizes gravity that chip is positioned when moulding not point-blank, thereby realizes the less bigger chip size of encapsulated space encapsulation.
Below in conjunction with specific embodiment and accompanying drawing the utility model is carried out comparatively detailed explanation.
Description of drawings
Fig. 1 is the utility model embodiment 1 schematic diagram.
Among the figure: 1, chip, 2, first pin, 3, second pin, 4, cylinder, 5, oblique round platform, 6, encapsulating material.
Embodiment
Embodiment 1, as shown in Figure 1, present embodiment is a kind of encapsulating structure of patch products, the present embodiment product includes chip 1, chip 1 can be that the chipset that is composed in series by a core assembly sheet also can be single chip, is welded with two pins on the chip 1, is respectively first pin 2 and second pin 3 among the figure, use encapsulating material 6 to seal around chip 1, present embodiment encapsulating material 6 is an epoxy molding plastic.First pin 2 and second pin 3 stretch out outside the epoxy molding plastic as encapsulating material 6, the characteristics of present embodiment be chip 1, first pin 2 and second pin 3 welding ends barycenter not point-blank.Following two kinds of situations are arranged, and first pin 2 and second pin 3 not corotation change central shaft, and the barycenter of chip 1 is not also on the central shaft of any one pin.Another situation is, first pin 2 and second pin, 3 corotations change central shaft, but the barycenter of chip 1 is not on this rotary middle spindle.Like this, when moulding, utilize gravity that chip is positioned, thereby realize the less bigger chip size of encapsulated space encapsulation.The pin of present embodiment product also has characteristics at weld: it is an oblique round platform 5 and a cylinder 4 that the welding ends of first pin 2 and second pin 3 includes, tiltedly the top of round platform 5 contacts with 1 of chip, tiltedly the bottom of round platform 5 and the end one of described cylinder 4.
Claims (5)
1. the encapsulating structure of a patch products, this product includes chip (1), be welded with first pin (2) and second pin (3) on the described chip (1), use encapsulating material (6) to seal on every side at described chip (1), described first pin (2) and second pin (3) stretch out outside the described encapsulating material (6), it is characterized in that: the barycenter of the welding ends of described chip (1), first pin (2) and second pin (3) is not point-blank.
2. the encapsulating structure of a kind of patch products according to claim 1, it is characterized in that: it is an oblique round platform (5) and a cylinder (4) that the welding ends of described first pin (2) and second pin (3) includes, the top of described oblique round platform (5) contacts with described chip (1) face, the end one of the bottom of described oblique round platform (5) and described cylinder (4).
3. the encapsulating structure of a kind of patch products according to claim 1 is characterized in that: described chip (1) is the chipset of a series connection.
4. the encapsulating structure of a kind of patch products according to claim 1, it is characterized in that: described first pin (2) and second pin (3) corotation change central shaft, and the barycenter of described chip (1) changes outside the central shaft at described first pin (2) and second pin (3) corotation.
5. according to the encapsulating structure of arbitrary described a kind of patch products in the claim 1 to 4, it is characterized in that: described encapsulating material (6) is an epoxy molding plastic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200992600U CN202025743U (en) | 2011-04-07 | 2011-04-07 | Packaging structure of SMD (Surface Mount Device) product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200992600U CN202025743U (en) | 2011-04-07 | 2011-04-07 | Packaging structure of SMD (Surface Mount Device) product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202025743U true CN202025743U (en) | 2011-11-02 |
Family
ID=44850685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200992600U Expired - Lifetime CN202025743U (en) | 2011-04-07 | 2011-04-07 | Packaging structure of SMD (Surface Mount Device) product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202025743U (en) |
-
2011
- 2011-04-07 CN CN2011200992600U patent/CN202025743U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: BRIGHTKING INC. Free format text: FORMER NAME: BRIGHTKING CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 523808 modern enterprise accelerator No. 3, Songshan hi tech Industrial Development Zone, Guangdong, Dongguan Province Patentee after: BRIGHTKING CO., LTD. Address before: 3, 1 floor, south of the Five Ridges Industrial Zone, six road, Henggang District, Longgang District, Shenzhen 518173, Guangdong, China Patentee before: BestBright Electronics (Shenzhen) Co., Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20111102 |
|
| CX01 | Expiry of patent term |