CN201303468Y - 外壳和安装器件 - Google Patents

外壳和安装器件 Download PDF

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Publication number
CN201303468Y
CN201303468Y CNU2008201319781U CN200820131978U CN201303468Y CN 201303468 Y CN201303468 Y CN 201303468Y CN U2008201319781 U CNU2008201319781 U CN U2008201319781U CN 200820131978 U CN200820131978 U CN 200820131978U CN 201303468 Y CN201303468 Y CN 201303468Y
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CN
China
Prior art keywords
shell
parts
components
installing device
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU2008201319781U
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English (en)
Inventor
董湧
潘杰兵
罗铁铭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Li Tao Electronics Co., Ltd.
Original Assignee
Raychem Electronics Shanghai Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raychem Electronics Shanghai Ltd filed Critical Raychem Electronics Shanghai Ltd
Priority to CNU2008201319781U priority Critical patent/CN201303468Y/zh
Priority to JP2008006555U priority patent/JP3149018U/ja
Priority to US12/284,036 priority patent/US7820920B2/en
Priority to JP2009000040U priority patent/JP3149283U/ja
Application granted granted Critical
Publication of CN201303468Y publication Critical patent/CN201303468Y/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermistors And Varistors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

本实用新型公开了一种外壳以及相应的安装器件，在节省元器件在电路板上的焊接所需面积的同时保护引脚在元器件焊接于电路板上的工艺流程中不致熔化断裂。其技术方案为：外壳包括中空体，所述中空体具备至少一个开口。本实用新型应用于电子器件焊接的领域。

Description

外壳和安装器件
技术领域
本实用新型涉及一种外壳和安装器件，尤其涉及一种可供装配元器件的外壳以及应用于焊接过程的包含带引脚的元器件的安装器件。
背景技术
通常元器件(以下以热敏电阻PTC为例)是以回流焊(SMT)的方式焊接在电路板上。在传统技术中，热敏电阻PTC 1的引脚2以锡焊方式焊接在热敏电阻PTC的表面。在回流焊的过程中，锡焊的焊点容易在高温中熔化，造成引脚从PTC表面脱离。另外，由于引脚较细，在焊接或者运输过程中，在电路板3上的引脚2也较容易在外力作用下断裂。而且，引脚2与电路板3的接触面积不够也容易导致PTC 1安装在电路板上的重心不稳。
发明内容
本实用新型提供了一种外壳，其本体中空可供元器件插入。另外，其底座开有细槽可供器件引脚弯折成焊盘。
本实用新型提供了一种包含带引脚的元器件的安装器件，在节省元器件在电路板上的焊接所需面积的同时保护引脚在元器件焊接于电路板上的工艺流程中不致熔化断裂。
本实用新型提出了一种外壳，包括该中空体在开口所在的一侧具备至少一个凸出部件。
根据本发明的实施方式，该外壳还包括从该凸出部件上延伸出的导向柱。
根据本发明的实施方式，该外壳还包括与中空体耦合的底座，它沿着与该开口的方向垂直的方向延伸，并且在其底面上具有延伸到该开口的细槽。
本实用新型的另一方面提出一种具有该的外壳的安装器件，该安装器件由该外壳及外壳内的元器件组成。
本实用新型还提出了一种具有上述外壳的安装器件，该引脚在该细槽中弯折以形成焊盘。
根据本发明的实施方式，该元器件包括电阻、电感、电容和晶体管至少之一。
根据本发明的实施方式，该元器件是热敏电阻器。
本实用新型对比现有技术，有如下的有益效果：本实用新型通过在元器件表面套一个外壳，同时将引脚在外壳底座的细槽中弯折以形成焊盘，保护了引脚的锡焊焊点在回流焊的过程中不被熔解，同时保护了引脚在回流焊以及运输过程中不易断裂。
另外，由于在中空体在开口那侧具有凸出部分，使得中空体与电路板之间具有间隙，从而允许进行回流焊。
附图说明
图1是传统的热敏电阻PTC焊接在电路板上的示意图。
图2是本实用新型第一实施方式的套有外壳的热敏电阻PTC的一个实施例焊接在电路板上的结构示意图。
图3是本实用新型第一实施方式的外壳底座的外观示意图。
图4是本实用新型第二实施方式的外壳的视图。
图5是本实用新型第二实施方式的安装器件在电路板上安装时的示意图。
具体实施方式
下面结合附图和实施例对本实用新型作进一步的描述。
请同时参见图2和图3，根据第一实施方式的外壳5包括在一侧有开口中空的本体(中空体)51以及沿着大致与开口方向垂直的方向延伸的底座52。本体51中空以供元器件4插入，底座52上开有延伸到开口的细槽6，以供元器件4的引脚7在细槽6中弯折，形成焊盘8。较佳地，细槽6的越多越长，在电路板9上焊接的牢固程度就越高。
本实用新型的第一实施方式还揭示了包括套有上述外壳的元器件(例如热敏电阻PTC)和所述外壳的装置，以下也称为安装器件。热敏电阻PTC 4的表面套有一个外壳5，二者一起形成一安装器件。外壳5的底座52请参见图3所示。外壳5的底座52上开有细槽6，引脚7在细槽6中弯折形成焊盘8。在回流焊过程中，热敏电阻PTC通过焊盘焊接在电路板9上。较佳地，细槽6的越多越长，在电路板9上焊接的牢固程度就越高。元器件还可以是电阻、电感、电容、晶体管等。
图4示出了根据本实用新型第二实施方式的外壳的视图，图5示出了该实施方式的安装器件在电路板上安装时的示意图。
如图4和5所示，中空体51具有从开口一侧延伸的凸出部件53A和53B。这样，当将元器件引脚7A和7B插入到电路板中进行回流焊时，在中空的主体和电路板之间形成了间隙，方便焊接的进行。另外，在凸出部件53A和53B上沿着凸出部件的凸出方向还形成了导向柱54A和54B，它在安装时插入到电路板上的导向孔中，方便定位。本实用新型主要应用在元器件以回流焊的方式焊接在电路板上的工艺流程中。本实用新型有如下的有益效果至少之一：(1)外壳保护了引脚在元器件表面的焊点不致于因温度过高而熔化；(2)焊盘的形成提高了元器件在电路板上的焊接牢固度；(3)焊盘的形成使得焊接在电路板上的引脚不容易断裂；(4)在外壳和电路板之间形成的间隙方便回流焊的进行；(5)导向柱的使用方便了元器件安装时的快速定位。
上述实施例是提供给本领域普通技术人员来实现或使用本实用新型的，本领域普通技术人员可在不脱离本实用新型的发明思想的情况下，对上述实施例做出种种修改或变化，因而本实用新型的保护范围并不被上述实施例所限，而应该是符合权利要求书提到的创新性特征的最大范围。

Claims (10)

1、一种外壳，其特征在于包括：
中空体，所述中空体具备至少一个开口。
2、如权利要求1所述的外壳，其特征在于，所述中空体在开口所在的一侧具备至少一个凸出部件。
3、如权利要求2所述的外壳，其特征在于还包括从所述凸出部件上延伸出导向柱。
4、如权利要求1所述的外壳，其特征在于还包括与中空体耦合的底座，它沿着与所述开口的方向垂直的方向延伸，并且在其底面上具有延伸到所述开口的细槽。
5、一种具有如权利要求1至3中任一项中所述的外壳的安装器件，所述安装器件由所述外壳及外壳内的元器件组成。
6、一种具有如权利要求4所述的外壳的安装器件，其特征在于所述引脚在所述细槽中弯折以形成焊盘。
7、如权利要求5所述的安装器件，其特征在于所述元器件包括电阻、电感、电容和晶体管至少之一。
8、如权利要求6所述的安装器件，其特征在于所述元器件包括电阻、电感、电容和晶体管至少之一。
9、如权利要求5所述的安装器件，其特征在于所述元器件是热敏电阻器。
10、如权利要求6所述的安装器件，其特征在于所述元器件是热敏电阻器。
CNU2008201319781U 2007-09-17 2008-08-22 外壳和安装器件 Expired - Lifetime CN201303468Y (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CNU2008201319781U CN201303468Y (zh) 2007-09-17 2008-08-22 外壳和安装器件
JP2008006555U JP3149018U (ja) 2007-09-17 2008-09-17 ハウジング及び実装部品
US12/284,036 US7820920B2 (en) 2007-09-17 2008-09-17 Casing and mounting device
JP2009000040U JP3149283U (ja) 2007-09-17 2009-01-07 ハウジング及び実装部品

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN200720074735 2007-09-17
CN200720074735.4 2007-09-17
CNU2008201319781U CN201303468Y (zh) 2007-09-17 2008-08-22 外壳和安装器件

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JP (2) JP3149018U (zh)
CN (1) CN201303468Y (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103216773A (zh) * 2013-04-24 2013-07-24 德清新明辉电光源有限公司 一种led发光模组
CN107167256A (zh) * 2017-06-07 2017-09-15 佛山市程显科技有限公司 一种温度传感器封装结构
CN107167260A (zh) * 2017-06-07 2017-09-15 佛山市程显科技有限公司 一种热敏传感器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3889365A (en) * 1971-08-09 1975-06-17 Gordon L Brock Electronic module and method of fabricating same
US3838316A (en) * 1973-10-09 1974-09-24 Western Electric Co Encapsulated electrical component assembly and method of fabrication
US5212345A (en) * 1992-01-24 1993-05-18 Pulse Engineering, Inc. Self leaded surface mounted coplanar header
US5351167A (en) * 1992-01-24 1994-09-27 Pulse Engineering, Inc. Self-leaded surface mounted rod inductor
KR100231796B1 (ko) * 1995-11-07 1999-12-01 무라타 야스타카 고장시에 내부 소자의 파괴를 줄이는 전자 장치
US5847938A (en) * 1996-12-20 1998-12-08 Ericsson Inc. Press-fit shields for electronic assemblies, and methods for assembling the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103216773A (zh) * 2013-04-24 2013-07-24 德清新明辉电光源有限公司 一种led发光模组
CN107167256A (zh) * 2017-06-07 2017-09-15 佛山市程显科技有限公司 一种温度传感器封装结构
CN107167260A (zh) * 2017-06-07 2017-09-15 佛山市程显科技有限公司 一种热敏传感器
CN107167260B (zh) * 2017-06-07 2020-02-14 佛山市程显科技有限公司 一种热敏传感器

Also Published As

Publication number Publication date
US7820920B2 (en) 2010-10-26
JP3149018U (ja) 2009-03-12
JP3149283U (ja) 2009-03-19
US20090078460A1 (en) 2009-03-26

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Address after: 200233 Shanghai City Caohejing Development Zone No. 889 Yishan Road, building 4, floor 2

Patentee after: Shanghai Li Tao Electronics Co., Ltd.

Address before: 200233 Shanghai City Caohejing Development Zone No. 889 Yishan Road, building 4, floor 2

Patentee before: Raychem Electronics (Shanghai) Co., Ltd.

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CX01 Expiry of patent term

Granted publication date: 20090902