JP3149283U - ハウジング及び実装部品 - Google Patents
ハウジング及び実装部品 Download PDFInfo
- Publication number
- JP3149283U JP3149283U JP2009000040U JP2009000040U JP3149283U JP 3149283 U JP3149283 U JP 3149283U JP 2009000040 U JP2009000040 U JP 2009000040U JP 2009000040 U JP2009000040 U JP 2009000040U JP 3149283 U JP3149283 U JP 3149283U
- Authority
- JP
- Japan
- Prior art keywords
- housing
- circuit board
- mounting component
- hollow body
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/304—Protecting a component during manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Abstract
Description
7 リードピン
8 半田付けパッド
5 ハウジング
51 中空体
52 ベース
53A,53B 突出部
54A,54B ガイド柱
6 細溝
Claims (6)
- 少なくとも1個の開口を底面に有する中空体を有するハウジングであって、
前記中空体は、開口した側に少なくとも1個の突出部を有することを特徴とするハウジング。 - 前記突出部から延びるガイド柱をさらに具備することを特徴とする請求項1記載のハウジング。
- 半田付け用のリードピンを有する素子と、該素子を受容するための中空体と有する高温防止ハウジングとを具備し、
該ハウジングは、前記リードピンの外部への突出を許容する少なくとも1個の開口を有することを特徴とする実装部品。 - 請求項1又は2記載のハウジングを有する実装部品であって、
該実装部品は、前記ハウジングと、該ハウジング内の素子とからなることを特徴とする実装部品。 - 前記素子がサーミスタであることを特徴とする請求項3又は4記載の実装部品。
- 前記素子が、抵抗、インダクタ、コンデンサ又はトランジスタであることを特徴とする請求項3又は4記載の実装部品。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200720074735 | 2007-09-17 | ||
CNU2008201319781U CN201303468Y (zh) | 2007-09-17 | 2008-08-22 | 外壳和安装器件 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008006555U Division JP3149018U (ja) | 2007-09-17 | 2008-09-17 | ハウジング及び実装部品 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP3149283U true JP3149283U (ja) | 2009-03-19 |
Family
ID=40470428
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008006555U Expired - Fee Related JP3149018U (ja) | 2007-09-17 | 2008-09-17 | ハウジング及び実装部品 |
JP2009000040U Expired - Fee Related JP3149283U (ja) | 2007-09-17 | 2009-01-07 | ハウジング及び実装部品 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008006555U Expired - Fee Related JP3149018U (ja) | 2007-09-17 | 2008-09-17 | ハウジング及び実装部品 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7820920B2 (ja) |
JP (2) | JP3149018U (ja) |
CN (1) | CN201303468Y (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103216773B (zh) * | 2013-04-24 | 2015-07-08 | 德清新明辉电光源有限公司 | 一种led发光模组 |
CN107167256B (zh) * | 2017-06-07 | 2020-02-14 | 佛山市程显科技有限公司 | 一种温度传感器封装结构 |
CN107167260B (zh) * | 2017-06-07 | 2020-02-14 | 佛山市程显科技有限公司 | 一种热敏传感器 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3889365A (en) * | 1971-08-09 | 1975-06-17 | Gordon L Brock | Electronic module and method of fabricating same |
US3838316A (en) * | 1973-10-09 | 1974-09-24 | Western Electric Co | Encapsulated electrical component assembly and method of fabrication |
US5212345A (en) * | 1992-01-24 | 1993-05-18 | Pulse Engineering, Inc. | Self leaded surface mounted coplanar header |
US5351167A (en) * | 1992-01-24 | 1994-09-27 | Pulse Engineering, Inc. | Self-leaded surface mounted rod inductor |
KR100231796B1 (ko) * | 1995-11-07 | 1999-12-01 | 무라타 야스타카 | 고장시에 내부 소자의 파괴를 줄이는 전자 장치 |
US5847938A (en) * | 1996-12-20 | 1998-12-08 | Ericsson Inc. | Press-fit shields for electronic assemblies, and methods for assembling the same |
-
2008
- 2008-08-22 CN CNU2008201319781U patent/CN201303468Y/zh not_active Expired - Lifetime
- 2008-09-17 US US12/284,036 patent/US7820920B2/en active Active
- 2008-09-17 JP JP2008006555U patent/JP3149018U/ja not_active Expired - Fee Related
-
2009
- 2009-01-07 JP JP2009000040U patent/JP3149283U/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP3149018U (ja) | 2009-03-12 |
US20090078460A1 (en) | 2009-03-26 |
US7820920B2 (en) | 2010-10-26 |
CN201303468Y (zh) | 2009-09-02 |
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