TWI283088B

TWI283088B - Switch pin applied for SMD manufacturing processes

Info

Publication number: TWI283088B
Application number: TW94135426A
Authority: TW
Inventors: Tsuei-Rung Su
Original assignee: Zippy Tech Corp
Priority date: 2005-10-12
Filing date: 2005-10-12
Publication date: 2007-06-21
Also published as: TW200715657A

Abstract

A switch pin applied for SMD manufacturing processes. The signal pin extended from a switch is mounted onto a circuit board by SMD manufacturing processes and includes a connection end located in a switch and a coupling end extended from the connection end and exposed outside the switch. The coupling end has a horizontal portion and a bend portion bending from the horizontal end towards the switch. Hence the signal pin and the circuit board can form a greater electric connection area to enhance electric effect of the switch. The bend portion also can prevent interference of other electronic elements installed on the circuit board.

Description

1283088 =銲接外，»段422更可因具備部分銲錫物2()之覆蓋而獲得更加定位以 ^良好電氣效果表現，此外，彎折段422是向開關加侧部彎折故不會有如第1圖之習知開關30有干擾其他電子零件設置問題產生。知上所述僅為本發明的較佳實施例而已，並非用來限定本發明之實施範圍。即凡依本發明申請專利範圍之内容所為的等效變化與修飾，皆應為本發明之技術範疇。 1283088 【圖式簡單說明】 . 第1圖，係習知開關外觀立體示意圖第2圖，係本發明之外觀立體示意圖第3圖，係本發明之訊號接腳分解示意圖第4圖，係本發明之訊號接腳組合配置底視示意圖第5圖，係本發明之另一訊號接腳組合配置底視示意圖第6-1〜6-3圖，係本發明應用SMD製程之組合示意圖【主要元件符號說明】 10.............電路板 11a、lib..........接點 # 12a、12b..........定位孔 20.............銲錫物 30 .............開關 31 .............缺口 32 · .............凸部 4a、4b...........訊號接腳 41 .............導接端 42 .............接設端 421.............水平段 Φ 422 .............彎折段1283088 = outside the welding, the section 422 can be more positioned by the coverage of the partial solder 2 () to obtain a good electrical performance. In addition, the bending section 422 is bent to the side of the switch, so it will not be as The conventional switch 30 of Fig. 1 has the problem of interfering with other electronic component setting problems. The above description is only the preferred embodiment of the present invention and is not intended to limit the scope of the present invention. That is, equivalent changes and modifications constituting the scope of the patent application of the present invention should be the technical scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing the appearance of a conventional switch. FIG. 2 is a perspective view of the appearance of the present invention. FIG. 3 is a schematic view of the signal pin according to the present invention. FIG. FIG. 5 is a bottom view of the signal pin combination configuration. FIG. 6 is a schematic diagram showing the combination of the SMD process of the present invention. Description] 10.............Circuit board 11a, lib..........Contact # 12a, 12b.......... positioning hole 20 ............. Solder 30.............Switch 31 .............Gap 32 · ... .......... convex portion 4a, 4b...........signal pin 41.............guide terminal 42 ... ..........connecting end 421.............horizontal section Φ 422 .............bend section

Claims

1283088 X. Patent application scope: ~ L - is used for the switch pin of the ® process, the signal pin extending the switch is connected to the circuit board, and the signal is connected to the circuit board. The foot includes a guiding end located inside the switch and a connecting end connected to the guiding end and extending outside the switch, and the connecting end defines a horizontal section and a direction from the end of the horizontal section The bending section of the switch is bent, wherein the horizontal section of the connecting end is located below the switch, and the bending section is located on the side of the switch. 2. The switch pin applied to the SMD process according to the first aspect of the patent application, wherein the switch is formed with a notch at a position of the connection end of the signal pin.