CN1997676A - 助焊剂 - Google Patents
助焊剂 Download PDFInfo
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- CN1997676A CN1997676A CNA2004800376033A CN200480037603A CN1997676A CN 1997676 A CN1997676 A CN 1997676A CN A2004800376033 A CNA2004800376033 A CN A2004800376033A CN 200480037603 A CN200480037603 A CN 200480037603A CN 1997676 A CN1997676 A CN 1997676A
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- soldering flux
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- polyvinyl alcohol
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- 229920002451 polyvinyl alcohol Polymers 0.000 claims abstract description 36
- 239000004372 Polyvinyl alcohol Substances 0.000 claims abstract description 34
- 238000002360 preparation method Methods 0.000 claims abstract description 28
- 229920003169 water-soluble polymer Polymers 0.000 claims abstract description 17
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
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- 230000004907 flux Effects 0.000 claims description 69
- 238000005476 soldering Methods 0.000 claims description 66
- 238000003466 welding Methods 0.000 claims description 18
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- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 239000012752 auxiliary agent Substances 0.000 claims description 4
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- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 239000010951 brass Substances 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
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- 229910000679 solder Inorganic materials 0.000 description 3
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- 238000005516 engineering process Methods 0.000 description 1
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- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
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- 238000005498 polishing Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007127 saponification reaction Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F16/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
- C08F16/02—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an alcohol radical
- C08F16/04—Acyclic compounds
- C08F16/06—Polyvinyl alcohol ; Vinyl alcohol
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
- B23K35/3603—Halide salts
- B23K35/3605—Fluorides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F16/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
- B23K2103/04—Steel or steel alloys
- B23K2103/05—Stainless steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
- B23K2103/20—Ferrous alloys and aluminium or alloys thereof
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- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Nonmetallic Welding Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Medicinal Preparation (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
本发明涉及一种助焊剂或一种助焊剂制剂,所述助焊剂制剂除复合碱金属氟化物之外包含水溶性的聚合物,优选地聚乙烯醇或聚乙烯醇衍生物。该水溶性聚合物可以颗粒或粉末形式包含在助焊剂制剂中,或可用作助焊剂或助焊剂制剂的水溶性包装。
Description
本发明涉及用于焊接铝部件的助焊剂以及包装助焊剂的方法。
由铝或铝合金构成的部件的组件或与由合适的其它材料例如铜、黄铜、铁或钢构成的部件相结合的组件可以通过焊接这些部件来制造。用于焊接这些部件的技术是已知的。借助于焊料和助焊剂将部件在加热条件下彼此连接。在此可以单独添加焊料或可以使用镀以焊料的部件。使用基于复合金属氟化物例如复合碱金属氟化物的助焊剂是有利的,它们使得待彼此焊接的部件的表面没有氧化的粘附。在此该助焊剂可以干燥地或作为糊涂覆或作为水悬浮液喷射到待连接的部件上,或将部件浸入悬浮液中。
概念“助焊剂”包含可以使用的组合物,其除助焊剂之外必要时还包含助剂。在此该助焊剂可以只由助焊剂组成。助焊剂制剂中作为助剂可以包含例如粘合剂、分散剂、焊料、焊料前体、形成焊接的材料或稳定剂。
基于复合金属氟化物的助焊剂可以是例如碱金属氟铝酸盐、碱金属氟硅酸盐、碱金属氟锌酸盐。其中其它已知的助焊剂也同样适合。
氟化合物可以作为纯化合物或作为氟化合物的混合物使用。
如已经列举的,助焊剂或助焊剂制剂可以干燥的、作为糊或以水悬浮液形式施加到待连接的部件上。
将混合组分悬浮在水中制成悬浮液。在此可能因为组分的特性而出现灰尘干扰或计量误差。
将助焊剂和助剂以及载体材料如有机化合物混合制成糊,在此可以通过载体材料的量调控制剂的粘度。
本发明的目的是,提供一种可以被更好计量的助焊剂或助焊剂制剂。在制备助焊剂悬浮液时的灰尘干扰应该被避免,并可以改善用该助焊剂焊接的部件的可润湿性和助焊剂对部件的粘附。
本发明的目的通过下列方式解决,根据本发明的基于复合金属氟化物的助焊剂或助焊剂制剂包含水溶性聚合物,尤其是聚乙烯醇或聚乙烯醇衍生物。该水溶性聚合物可以用作助焊剂或助焊剂制剂的包覆物,或可以颗粒或粉末的形式加入助焊剂或助焊剂制剂中。例如,该水溶性聚合物可以用作水溶性包装,尤其是用作包装膜。
根据本发明,助焊剂或助焊剂制剂包含水溶性聚合物,其量为0.005-10重量%,基于助焊剂或助焊剂制剂的总量。
本发明的一个实施方案中,助焊剂与普通助剂一同装入袋中并加料到水悬浮液中,所述袋子由水溶性聚合物膜制成,优选地由水溶性聚乙烯醇膜制成。使用强度例如为80μm的膜。
聚乙烯醇几十年来已经被大规模生产。由于它的特性,聚乙烯醇(PVA)被用作例如上浆剂或磨光剂,用作乳化剂和用作保护胶体。由于PVA对有机溶剂的高稳定性,用它制作防汽油和防溶剂的管、膜、密封件和空心体。
PVA膜在包覆物或包装材料中占据特殊位置,因为它们在加入水中时溶解。因此水溶性PVA膜只是接触防护或计量包装。
在PVA包装的储存和运输中它的应用可能性和安全措施,基本上是通过良好的水溶性和吸湿性能决定的。
PVA膜对那些在水溶液中使用的物质是理想的包装材料。
已经有一系列产品是用PVA膜包装的,例如洗涤剂、清洁剂或农业的化学品。
水溶性膜可以用各种类型的聚乙烯醇制造,这些聚乙烯醇通过它们的皂化度和聚合度来区别。此外加入的柔软剂的种类和数量可以影响膜的性质。由EP283180已知基于水溶性聚乙烯醇、更确切地说是乙烯醇-醋酸乙烯酯-共聚物的水溶性薄膜,其部分地用苯甲醛衍生物缩醛化。
已经发现,将水溶性聚合物作为包装材料加入助焊剂悬浮液或以颗粒形式加入糊状的助焊剂配方对焊接结果没有不利影响。所使用的水溶性聚合物的数量和种类取决于助焊剂或助焊剂制剂的种类。对于悬浮液来说,悬浮液的体积和悬浮液中助焊剂的浓度是重要的,对于糊状的制剂来说,除了体积之外,期望的粘度和对与载体材料的相互作用的认识也是重要的。水溶性聚合物的量为0.005-10重量%;优选地为0.1-5重量%,尤其是0.5-2重量%(基于总量)已经证明是有利的。
可以确定,通过加入水溶性聚合物,使用助焊剂的部件的涂层非常均匀。使用助焊剂的部件的可润湿性得到改善。助焊剂更好地粘附在部件上。制造制剂时的灰尘干扰减少或不再出现。因为可以有具体的包装尺寸,所以可以最小化或者甚至消除计量误差。
此外有利的是,通过加入水溶性聚合物,可以降低润湿剂的量。通常使用表面活性剂作为润湿剂。没有润湿剂,也就是说没有表面活性剂,助焊剂悬浮液将在铝表面积聚(由于水的凝聚力形成小液滴)。干燥之后,助焊剂不是均匀分布在金属表面上。使用聚乙烯醇或聚乙烯醇衍生物的优点是可以降低水的表面张力,这样在最有利的情况下,使得额外的润湿剂变得多余。聚乙烯醇或聚乙烯醇衍生物起到如表面活性剂的作用,它们是生物可降解的并且这些物质没有已知的有毒作用。
已经发现,如果不能忍受对焊接结果的负面影响,应该保持尽可能少的PVA部分。
维持聚合物(作为包装)对助焊剂的比例为0.1-5重量%,优选地为0.5-2重量%已经证明是有利的,由此不会对焊接性质有负面影响。PVA包装中上述比例过大可能导致在焊接过程中在焊接处的变色。
聚合物对悬浮液量的比例为0.005-10重量%(基于总量)对使用助焊剂的部件的润湿性能或冲击有积极影响。并且均匀的涂层又导致改善的焊接结果。
另一个实施方案中,助焊剂或助焊剂制剂作为糊状配方涂覆到待焊接的部件上。在这种情况下,水溶性聚合物,优选的是聚乙烯醇或聚乙烯醇衍生物以颗粒形式或作为粉末加入助焊剂制剂。
已经发现,向制剂糊中加入制剂总量0.1-5重量%的聚乙烯醇时,聚乙烯醇使制剂糊增稠。同样改善了包含聚乙烯醇的制剂糊的粘附性质。
如已经列出的,使用聚乙烯醇作为助焊剂配方的组分具有这样的优点,即可以替换通常被包含在助焊剂配方中的表面活性剂。聚乙烯醇是环境相容的,并且在焊接过程中不引起与助焊剂组分或焊接对象的不利反应。
下列实施例将举例说明本发明但并不限制本发明。
实施例1:生产助焊剂悬浮液
在容器中放置去矿物质水。将G6102.090型(Fa.Nordenia)聚乙烯醇膜在搅拌下溶于水中。之后加入氟铝酸钾(Nocolok)。生成的助焊剂悬浮液由下列物质组成:
18%氟铝酸钾
2%聚乙烯醇
80%去矿物质水
实施例2:焊接试验
将尺寸为25×25×0.4-1mm的单面的焊镀和未镀的铝样片浸入实施例1中均匀化的悬浮液中大约30秒并且然后干燥。助焊剂在样片上的分布是均匀的。助焊剂在表面上的粘附良好并且耐擦拭。
分别以焊镀的铝样片进行6次焊接和以未镀的铝样片进行6次焊接。所有样片与铝角焊接。
在未镀的样片上,在角末端放置一个3-4mm长的AISi12的焊接块。
焊接试验在玻璃焊接炉型号III中进行。
焊接条件:
持久氮气流11l/min.
加热速率30℃/min.至温度为605℃
605℃时停留时间2min.
冷却时间30℃/min.
结果:
所有样片与角最佳地焊接在一起。
Claims (7)
1.一种基于复合碱金属氟化物的助焊剂,其特征在于,该助焊剂包含水溶性聚合物。
2.根据权利要求1的助焊剂,其特征在于,该助焊剂包含助剂,例如粘合剂或分散剂。
3.根据权利要求1的助焊剂,其特征在于,该助焊剂包含作为水溶性聚合物的聚乙烯醇和/或聚乙烯醇衍生物,它们的量为0.005-10重量%,基于助焊剂制剂。
4.包装助焊剂的方法,其特征在于,水溶性聚合物用作助焊剂制剂的包覆物或作为颗粒或粉末加入助焊剂制剂。
5.根据权利要求4的包装助焊剂的方法,其特征在于,由聚乙烯醇或聚乙烯醇衍生物制成的水溶性膜用作助焊剂制剂的包覆物。
6.根据权利要求4的包装助焊剂的方法,其特征在于,水溶性聚合物作为颗粒或粉末加入糊状的助焊剂制剂。
7.根据权利要求1-6任一项的助焊剂制剂的用途,用于由铝或铝合金构成的部件的焊接,或者用于由铝或铝合金构成的部件和适当的材料如铜、黄铜、铁或钢构成的部件的焊接。
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DE10359222A DE10359222A1 (de) | 2003-12-17 | 2003-12-17 | Flußmittel |
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EP (1) | EP1697430B1 (zh) |
JP (1) | JP5032123B2 (zh) |
KR (1) | KR20060113733A (zh) |
CN (1) | CN1997676A (zh) |
AT (1) | ATE427326T1 (zh) |
BR (1) | BRPI0417730A (zh) |
DE (2) | DE10359222A1 (zh) |
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2003
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2004
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- 2004-12-03 EP EP04820415A patent/EP1697430B1/de not_active Not-in-force
- 2004-12-03 WO PCT/EP2004/013759 patent/WO2005058985A2/de active Application Filing
- 2004-12-03 AT AT04820415T patent/ATE427326T1/de not_active IP Right Cessation
- 2004-12-03 ES ES04820415T patent/ES2325268T3/es active Active
- 2004-12-03 KR KR1020067011890A patent/KR20060113733A/ko not_active Application Discontinuation
- 2004-12-03 CN CNA2004800376033A patent/CN1997676A/zh active Pending
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Publication number | Priority date | Publication date | Assignee | Title |
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CN102712064A (zh) * | 2009-12-21 | 2012-10-03 | 苏威氟有限公司 | 包含脱水的k2a1f5的具有增加的动态粘度的焊剂制剂、其制备方法以及使用方法 |
CN106029296A (zh) * | 2013-12-19 | 2016-10-12 | 索尔维公司 | 用于对铝合金进行钎焊的焊剂 |
CN105694614A (zh) * | 2016-02-03 | 2016-06-22 | 杭州钱航船舶修造有限公司 | 船舶用铝钢板的焊接方法、涂料制备方法及铝钢板 |
CN105694614B (zh) * | 2016-02-03 | 2018-04-10 | 杭州钱航船舶修造有限公司 | 船舶用铝钢板的焊接方法、涂料制备方法及铝钢板 |
Also Published As
Publication number | Publication date |
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KR20060113733A (ko) | 2006-11-02 |
US20060231162A1 (en) | 2006-10-19 |
WO2005058985A3 (de) | 2007-03-22 |
US8163104B2 (en) | 2012-04-24 |
DE10359222A1 (de) | 2005-07-28 |
EP1697430A2 (de) | 2006-09-06 |
BRPI0417730A (pt) | 2007-04-03 |
WO2005058985A2 (de) | 2005-06-30 |
JP2007521139A (ja) | 2007-08-02 |
ES2325268T3 (es) | 2009-08-31 |
JP5032123B2 (ja) | 2012-09-26 |
ATE427326T1 (de) | 2009-04-15 |
DE502004009285D1 (de) | 2009-05-14 |
EP1697430B1 (de) | 2009-04-01 |
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